Enhancement of an indium phosphide resonator sensor microsystem through the development of an adaptive feedback circuit and electrospray deposition

Cantilever resonator sensor enhancement through the development of an adaptive feedback circuit and the use of electrospray deposition is presented. The feedback system adapts to a wide range of resonators by implementing a hill climbing algorithm, locking onto the cantilever's resonance condition. Eight different cantilever-based sensors (Length=40-75μm), resonating at 201.0kHz to 592.1kHz, with a minimum standard deviation of 11.8Hz, corresponding to a mass resolution limit of 123fg for the device, have been dynamically detected using a single circuit. Electrospray deposition of thin-films on multiple substrate materials and released microstructures has been performed. An average deposition rate of 9.5±5nm/min was achieved with an average surface roughness of 4.5nm on a 197nm thick film. This technology will enable a post-processing method for depositing absorbing layers for sensing applications. With the development of these two technologies, the practical functionality of a chip-scale sensor microsystem will be more readily realized

Integrated sensors for process monitoring and health monitoring in microsystems

This thesis presents the development of integrated sensors for health monitoring in Microsystems, which is an emerging method for early diagnostics of status or “health” of electronic systems and devices under operation based on embedded tests. Thin film meander temperature sensors have been designed with a minimum footprint of 240 m × 250 m. A microsensor array has been used successfully for accurate temperature monitoring of laser assisted polymer bonding for MEMS packaging. Using a frame-shaped beam, the temperature at centre of bottom substrate was obtained to be ~50 ºC lower than that obtained using a top-hat beam. This is highly beneficial for packaging of temperature sensitive MEMS devices. Polymer based surface acoustic wave humidity sensors were designed and successfully fabricated on 128° cut lithium niobate substrates. Based on reflection signals, a sensitivity of 0.26 dB/RH% was achieved between 8.6 %RH and 90.6 %RH. Fabricated piezoresistive pressure sensors have also been hybrid integrated and electrically contacted using a wire bonding method. Integrated sensors based on both LiNbO3 and ZnO/Si substrates are proposed. Integrated sensors were successfully fabricated on a LiNbO3 substrate with a footprint of 13 mm × 12 mm, having multi monitoring functions for simultaneous temperature, measurement of humidity and pressure in the health monitoring applications

Fault-based Analysis of Industrial Cyber-Physical Systems

The fourth industrial revolution called Industry 4.0 tries to bridge the gap between traditional Electronic Design Automation (EDA) technologies and the necessity of innovating in many indus- trial fields, e.g., automotive, avionic, and manufacturing. This complex digitalization process in- volves every industrial facility and comprises the transformation of methodologies, techniques, and tools to improve the efficiency of every industrial process. The enhancement of functional safety in Industry 4.0 applications needs to exploit the studies related to model-based and data-driven anal- yses of the deployed Industrial Cyber-Physical System (ICPS). Modeling an ICPS is possible at different abstraction levels, relying on the physical details included in the model and necessary to describe specific system behaviors. However, it is extremely complicated because an ICPS is com- posed of heterogeneous components related to different physical domains, e.g., digital, electrical, and mechanical. In addition, it is also necessary to consider not only nominal behaviors but even faulty behaviors to perform more specific analyses, e.g., predictive maintenance of specific assets. Nevertheless, these faulty data are usually not present or not available directly from the industrial machinery. To overcome these limitations, constructing a virtual model of an ICPS extended with different classes of faults enables the characterization of faulty behaviors of the system influenced by different faults. In literature, these topics are addressed with non-uniformly approaches and with the absence of standardized and automatic methodologies for describing and simulating faults in the different domains composing an ICPS. This thesis attempts to overcome these state-of-the-art gaps by proposing novel methodologies, techniques, and tools to: model and simulate analog and multi-domain systems; abstract low-level models to higher-level behavioral models; and monitor industrial systems based on the Industrial Internet of Things (IIOT) paradigm. Specifically, the proposed contributions involve the exten- sion of state-of-the-art fault injection practices to improve the ICPSs safety, the development of frameworks for safety operations automatization, and the definition of a monitoring framework for ICPSs. Overall, fault injection in analog and digital models is the state of the practice to en- sure functional safety, as mentioned in the ISO 26262 standard specific for the automotive field. Starting from state-of-the-art defects defined for analog descriptions, new defects are proposed to enhance the IEEE P2427 draft standard for analog defect modeling and coverage. Moreover, dif- ferent techniques to abstract a transistor-level model to a behavioral model are proposed to speed up the simulation of faulty circuits. Therefore, unlike the electrical domain, there is no extensive use of fault injection techniques in the mechanical one. Thus, extending the fault injection to the mechanical and thermal fields allows for supporting the definition and evaluation of more reliable safety mechanisms. Hence, a taxonomy of mechanical faults is derived from the electrical domain by exploiting the physical analogies. Furthermore, specific tools are built for automatically instru- menting different descriptions with multi-domain faults. The entire work is proposed as a basis for supporting the creation of increasingly resilient and secure ICPS that need to preserve functional safety in any operating context

EUROSENSORS XVII : book of abstracts

Fundação Calouste Gulbenkien (FCG).Fundação para a Ciência e a Tecnologia (FCT)

Solid State Technology Branch of NASA Lewis Research Center

A collection of papers written by the members of the Solid State Technology Branch of NASA LeRC from Jun. 1991 - Jun. 1992 is presented. A range of topics relating to superconductivity, Monolithic Microwave Circuits (MMIC's), coplanar waveguides, and material characterization is covered

Integrated packaging solutions and hotplates for a miniature atomic clock and other microsystems

This thesis aimed at developing innovative packaging solutions for a miniature atomic clock and other microsystems in the cm-scale, i.e. somewhat larger than what is practical for full "chip-scale" device-package integration using clean-room technologies for fabrication of microelectromechanical systems (MEMS). Besides well-defined and robust mechanical attachment, such packaging solutions must provide reliable electrical interconnection with the other system components, and, if needed, additional functions such as local temperature control, insulation from electrical magnetic or temperature perturbations, chemical separation (hermeticity). In order to accomplish this objective, different packaging technologies and modules were developed, fabricated and characterized in the frame of this thesis, with particular emphasis on the packaging of a miniature double-resonance (DR) rubidium atomic clock, which is an ideal demonstration platform given the associated large variety of requirements. First, the possibility of encapsulating the reactive Rb metal in ceramic / glass substrates using soldering was explored, with the aim to achieve simple and reliable fabrication of miniature atomic clock elements such as the reference cell and the Rb lamp. After a thorough literature review investigation of the metallurgical interactions between rubidium and materials used in packaging such as solder (Sn, Pb, Bi..) and thick-film metallizations metals (Ag, Pd, Au, 2 Pt...), an innovative design for a Rb reference cell (dimensions 10 × 12 mm ) is presented. The cell is based on a multifunctional low-temperature cofired ceramic (LTCC) spacer, closed by two glass windows allowing light transmission and acting as lids. Bonding is achieved by low-temperature soldering, avoiding exposing Rb to high temperatures. The use of LTCC as the main substrate material for Rb vapor cells in principle allows further integration of necessary functions for the Rb lamp and reference cell, such as temperature regulation, excitation / microwave resonator electrodes, impedance-matching passive components (lamp), and coil for static magnetic field generation (reference). In this work, to test the hermeticity of the bonding, a pressure sensor was integrated into the cell by replacing one of the glass windows by a membrane comprising an integrated piezoresistive Wheatstone bridge. In this frame, a new lamination technique for LTCC is proposed. The technique consists in applying a hot-melt adhesive on top of the LTCC green tape, and allows good bonding of the tapes even at low lamination pressure. This technique is particularly attractive for the lamination of LTCC microfluidic devices or membrane pressure sensors, because the low pressure applied during lamination does not affect the shape of the channels in a microfluidic device, or the membrane of the sensor. The resulting cells are shown to be hermetic, and a Rb response could be measured by the project partners. However, heating resulted in loss of this response, indicating Rb depletion by undesired reactions between Rb and the sealing metals or contaminants. This result is somewhat in line with studies made in parallel with the present work on low-temperature indium thermocompression bonding. Therefore, although the results are promising, further optimisation of metallizations, solders and package design is required. An important generic function that may be integrated into LTCC is temperature control. In this frame, a multifunctional LTCC hotplate was designed, fabricated and studied. This device allows controlling the temperature of any object in the cm-scale, such as the abovementioned Rb vapor cells (reference or lamp) and other temperature-sensitive elements used in miniature atomic clocks such as lasers and impedance-matching passive components. Full thermal analysis, mathematical calculations, finite-element simulations and laboratory experiments were performed. The excellent structurability and modest thermal conductivity of LTCC make it much better suited than standard alumina for integrated hotplates, resulting in conduction losses in the LTCC structure being small compared to surface losses by conduction and convection. It is therefore concluded that insulation and/or vacuum packaging techniques are necessary to achieve optimized low-power operation. Although we have seen that LTCC is an excellent integrated packaging platform, there are some limitations for carrying relatively massive components such as the DR atomic clock resonator cavity structure, which in general is a solid metal part. Therefore, an alternative hotplate technology platform, was developed, based on the combination of standard fiberglass-reinforced organic-matrix printed-circuit board (PCB), combined with thick-film alumina heaters. The PCB acts as high-strength, low-cost and readily available mechanical carrier, electrical interconnect and thermal insulator, and the thick-film heaters provide local temperature regulation, with the high thermal conductivity of alumina ensuring good local temperature uniformity. Therefore, such a hybrid PCB-Al2O3 platform constitutes an attractive alternative to LTCC hotplates for benign operating conditions. In conclusion, this work introduced several innovative packaging solutions and techniques, which were successfully applied to various dedicated modules carrying the elements of miniature atomic clocks. Beyond this application, these developments allow us to envision efficient packaging of a wide variety of new miniature devices. Also, new areas for further investigations are suggested, such as long-term metallurgical interactions of alkali metals with solders, hermeticity, optimization of temperature distribution and thermal insulation techniques, as well as reliability at high-temperatures and under severe thermal cycling.This thesis aimed at developing innovative packaging solutions for a miniature atomic clock and other microsystems in the cm-scale, i.e. somewhat larger than what is practical for full "chip-scale" device-package integration using clean-room technologies for fabrication of microelectromechanical systems (MEMS). Besides well-defined and robust mechanical attachment, such packaging solutions must provide reliable electrical interconnection with the other system components, and, if needed, additional functions such as local temperature control, insulation from electrical magnetic or temperature perturbations, chemical separation (hermeticity). In order to accomplish this objective, different packaging technologies and modules were developed, fabricated and characterized in the frame of this thesis, with particular emphasis on the packaging of a miniature double-resonance (DR) rubidium atomic clock, which is an ideal demonstration platform given the associated large variety of requirements. First, the possibility of encapsulating the reactive Rb metal in ceramic / glass substrates using soldering was explored, with the aim to achieve simple and reliable fabrication of miniature atomic clock elements such as the reference cell and the Rb lamp. After a thorough literature review investigation of the metallurgical interactions between rubidium and materials used in packaging such as solder (Sn, Pb, Bi..) and thick-film metallizations metals (Ag, Pd, Au, 2 Pt...), an innovative design for a Rb reference cell (dimensions 10 × 12 mm ) is presented. The cell is based on a multifunctional low-temperature cofired ceramic (LTCC) spacer, closed by two glass windows allowing light transmission and acting as lids. Bonding is achieved by low-temperature soldering, avoiding exposing Rb to high temperatures. The use of LTCC as the main substrate material for Rb vapor cells in principle allows further integration of necessary functions for the Rb lamp and reference cell, such as temperature regulation, excitation / microwave resonator electrodes, impedance-matching passive components (lamp), and coil for static magnetic field generation (reference). In this work, to test the hermeticity of the bonding, a pressure sensor was integrated into the cell by replacing one of the glass windows by a membrane comprising an integrated piezoresistive Wheatstone bridge. In this frame, a new lamination technique for LTCC is proposed. The technique consists in applying a hot-melt adhesive on top of the LTCC green tape, and allows good bonding of the tapes even at low lamination pressure. This technique is particularly attractive for the lamination of LTCC microfluidic devices or membrane pressure sensors, because the low pressure applied during lamination does not affect the shape of the channels in a microfluidic device, or the membrane of the sensor. The resulting cells are shown to be hermetic, and a Rb response could be measured by the project partners. However, heating resulted in loss of this response, indicating Rb depletion by undesired reactions between Rb and the sealing metals or contaminants. This result is somewhat in line with studies made in parallel with the present work on low-temperature indium thermocompression bonding. Therefore, although the results are promising, further optimisation of metallizations, solders and package design is required. An important generic function that may be integrated into LTCC is temperature control. In this frame, a multifunctional LTCC hotplate was designed, fabricated and studied. This device allows controlling the temperature of any object in the cm-scale, such as the abovementioned Rb vapor cells (reference or lamp) and other temperature-sensitive elements used in miniature atomic clocks such as lasers and impedance-matching passive components. Full thermal analysis, mathematical calculations, finite-element simulations and laboratory experiments were performed. The excellent structurability and modest thermal conductivity of LTCC make it much better suited than standard alumina for integrated hotplates, resulting in conduction losses in the LTCC structure being small compared to surface losses by conduction and convection. It is therefore concluded that insulation and/or vacuum packaging techniques are necessary to achieve optimized low-power operation. Although we have seen that LTCC is an excellent integrated packaging platform, there are some limitations for carrying relatively massive components such as the DR atomic clock resonator cavity structure, which in general is a solid metal part. Therefore, an alternative hotplate technology platform, was developed, based on the combination of standard fiberglass-reinforced organic-matrix printed-circuit board (PCB), combined with thick-film alumina heaters. The PCB acts as high-strength, low-cost and readily available mechanical carrier, electrical interconnect and thermal insulator, and the thick-film heaters provide local temperature regulation, with the high thermal conductivity of alumina ensuring good local temperature uniformity. Therefore, such a hybrid PCB-Al2O3 platform constitutes an attractive alternative to LTCC hotplates for benign operating conditions. In conclusion, this work introduced several innovative packaging solutions and techniques, which were successfully applied to various dedicated modules carrying the elements of miniature atomic clocks. Beyond this application, these developments allow us to envision efficient packaging of a wide variety of new miniature devices. Also, new areas for further investigations are suggested, such as long-term metallurgical interactions of alkali metals with solders, hermeticity, optimization of temperature distribution and thermal insulation techniques, as well as reliability at high-temperatures and under severe thermal cycling

Large space structures and systems in the space station era: A bibliography with indexes

Bibliographies and abstracts are listed for 1372 reports, articles, and other documents introduced into the NASA scientific and technical information system between January 1, 1990 and June 30, 1990. Its purpose is to provide helpful information to the researcher, manager, and designer in technology development and mission design according to system, interactive analysis and design, structural and thermal analysis and design, structural concepts and control systems, electronics, advanced materials, assembly concepts, propulsion, and solar power satellite systems