61 research outputs found
Test Planning for 3D SICs using ILP
In this paper we propose a test planning scheme for corebased 3D stacked integrated circuits where the total test cost for wafer sort of each individual chip and the test cost of the complete stack at package test is minimized. We use an Integer Linear Programming (ILP) model to find the optimal test cost, which is given as the weighted sum of the test time and the test access mechanism (TAM). As ILP is time consuming, we use a scheme to bound the test time and the TAM such that the search space is reduced. The proposed bounding scheme and the ILP model were applied on several ITC’02 benchmarks and the results show that optimal solutions were obtained at low computation time
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
<p>As integrated circuits (ICs) continue to scale to smaller dimensions, long interconnects</p><p>have become the dominant contributor to circuit delay and a significant component of</p><p>power consumption. In order to reduce the length of these interconnects, 3D integration</p><p>and 3D stacked ICs (3D SICs) are active areas of research in both academia and industry.</p><p>3D SICs not only have the potential to reduce average interconnect length and alleviate</p><p>many of the problems caused by long global interconnects, but they can offer greater design</p><p>flexibility over 2D ICs, significant reductions in power consumption and footprint in</p><p>an era of mobile applications, increased on-chip data bandwidth through delay reduction,</p><p>and improved heterogeneous integration.</p><p>Compared to 2D ICs, the manufacture and test of 3D ICs is significantly more complex.</p><p>Through-silicon vias (TSVs), which constitute the dense vertical interconnects in a</p><p>die stack, are a source of additional and unique defects not seen before in ICs. At the same</p><p>time, testing these TSVs, especially before die stacking, is recognized as a major challenge.</p><p>The testing of a 3D stack is constrained by limited test access, test pin availability,</p><p>power, and thermal constraints. Therefore, efficient and optimized test architectures are</p><p>needed to ensure that pre-bond, partial, and complete stack testing are not prohibitively</p><p>expensive.</p><p>Methods of testing TSVs prior to bonding continue to be a difficult problem due to test</p><p>access and testability issues. Although some built-in self-test (BIST) techniques have been</p><p>proposed, these techniques have numerous drawbacks that render them impractical. In this dissertation, a low-cost test architecture is introduced to enable pre-bond TSV test through</p><p>TSV probing. This has the benefit of not needing large analog test components on the die,</p><p>which is a significant drawback of many BIST architectures. Coupled with an optimization</p><p>method described in this dissertation to create parallel test groups for TSVs, test time for</p><p>pre-bond TSV tests can be significantly reduced. The pre-bond probing methodology is</p><p>expanded upon to allow for pre-bond scan test as well, to enable both pre-bond TSV and</p><p>structural test to bring pre-bond known-good-die (KGD) test under a single test paradigm.</p><p>The addition of boundary registers on functional TSV paths required for pre-bond</p><p>probing results in an increase in delay on inter-die functional paths. This cost of test</p><p>architecture insertion can be a significant drawback, especially considering that one benefit</p><p>of 3D integration is that critical paths can be partitioned between dies to reduce their delay.</p><p>This dissertation derives a retiming flow that is used to recover the additional delay added</p><p>to TSV paths by test cell insertion.</p><p>Reducing the cost of test for 3D-SICs is crucial considering that more tests are necessary</p><p>during 3D-SIC manufacturing. To reduce test cost, the test architecture and test</p><p>scheduling for the stack must be optimized to reduce test time across all necessary test</p><p>insertions. This dissertation examines three paradigms for 3D integration - hard dies, firm</p><p>dies, and soft dies, that give varying degrees of control over 2D test architectures on each</p><p>die while optimizing the 3D test architecture. Integer linear programming models are developed</p><p>to provide an optimal 3D test architecture and test schedule for the dies in the 3D</p><p>stack considering any or all post-bond test insertions. Results show that the ILP models</p><p>outperform other optimization methods across a range of 3D benchmark circuits.</p><p>In summary, this dissertation targets testing and design-for-test (DFT) of 3D SICs.</p><p>The proposed techniques enable pre-bond TSV and structural test while maintaining a</p><p>relatively low test cost. Future work will continue to enable testing of 3D SICs to move</p><p>industry closer to realizing the true potential of 3D integration.</p>Dissertatio
A survey on scheduling and mapping techniques in 3D Network-on-chip
Network-on-Chips (NoCs) have been widely employed in the design of
multiprocessor system-on-chips (MPSoCs) as a scalable communication solution.
NoCs enable communications between on-chip Intellectual Property (IP) cores and
allow those cores to achieve higher performance by outsourcing their
communication tasks. Mapping and Scheduling methodologies are key elements in
assigning application tasks, allocating the tasks to the IPs, and organising
communication among them to achieve some specified objectives. The goal of this
paper is to present a detailed state-of-the-art of research in the field of
mapping and scheduling of applications on 3D NoC, classifying the works based
on several dimensions and giving some potential research directions
Design for pre-bond testability in 3D integrated circuits
In this dissertation we propose several DFT techniques specific to 3D
stacked IC systems. The goal has explicitly been to create techniques that
integrate easily with existing IC test systems. Specifically, this means
utilizing scan- and wrapper-based techniques, two foundations
of the digital IC test industry.
First, we describe a general test architecture for 3D ICs. In this
architecture, each tier of a 3D design is wrapped in test control logic that
both manages tier test
pre-bond and integrates the tier into the large test architecture post-bond.
We describe a new kind of boundary scan to provide the necessary test control
and observation of the partial circuits, and we propose
a new design methodology for test hardcore that ensures both pre-bond functionality
and post-bond optimality. We present the application of these techniques to
the 3D-MAPS test vehicle, which has proven their effectiveness.
Second, we extend these DFT techniques to circuit-partitioned designs. We find
that boundary scan design is generally sufficient, but that some 3D designs require
special DFT treatment. Most importantly, we demonstrate that the functional
partitioning inherent in 3D design can potentially decrease the total test cost
of verifying a circuit.
Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm
co-designs the pre-bond and post-bond wrappers to simultaneously minimize test
time and routing cost. On average, our algorithm utilizes over 90% of the wires
in both the pre-bond and post-bond wrappers.
Finally, we look at the 3D vias themselves to develop a low-cost, high-volume
pre-bond test methodology appropriate for production-level test. We describe
the shorting probes methodology, wherein large test probes are used to contact
multiple small 3D vias. This technique is an all-digital test method that
integrates seamlessly into existing test flows. Our
experimental results demonstrate two key facts: neither the large capacitance
of the probe tips nor the process variation in the 3D vias and the probe tips
significantly hinders the testability of the circuits.
Taken together, this body of work defines a complete test methodology for
testing 3D ICs pre-bond, eliminating one of the key hurdles to the
commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka
On Energy Efficient Computing Platforms
In accordance with the Moore's law, the increasing number of on-chip integrated transistors has enabled modern computing platforms with not only higher processing power but also more affordable prices. As a result, these platforms, including portable devices, work stations and data centres, are becoming an inevitable part of the human society. However, with the demand for portability and raising cost of power, energy efficiency has emerged to be a major concern for modern computing platforms.
As the complexity of on-chip systems increases, Network-on-Chip (NoC) has been proved as an efficient communication architecture which can further improve system performances and scalability while reducing the design cost. Therefore, in this thesis, we study and propose energy optimization approaches based on NoC architecture, with special focuses on the following aspects.
As the architectural trend of future computing platforms, 3D systems have many bene ts including higher integration density, smaller footprint, heterogeneous integration, etc. Moreover, 3D technology can signi cantly improve the network communication and effectively avoid long wirings, and therefore, provide higher system performance and energy efficiency.
With the dynamic nature of on-chip communication in large scale NoC based systems, run-time system optimization is of crucial importance in order to achieve higher system reliability and essentially energy efficiency. In this thesis, we propose an agent based system design approach where agents are on-chip components which monitor and control system parameters such as supply voltage, operating frequency, etc. With this approach, we have analysed the implementation alternatives for dynamic voltage and frequency scaling and power gating techniques at different granularity, which reduce both dynamic and leakage energy consumption.
Topologies, being one of the key factors for NoCs, are also explored for energy saving purpose. A Honeycomb NoC architecture is proposed in this thesis with turn-model based deadlock-free routing algorithms. Our analysis and simulation based evaluation show that Honeycomb NoCs outperform their Mesh based counterparts in terms of network cost, system performance as well as energy efficiency.Siirretty Doriast
Design Methods and Tools for Application-Specific Predictable Networks-on-Chip
As the complexity of applications grows with each new generation, so does the demand for computation power. To satisfy the computation demands at manageable power levels, we see a shift in the design paradigm from single processor systems to Multiprocessor Systems-on-Chip (MPSoCs). MPSoCs leverage the parallelism in applications to increase the performance at the same power levels. To further improve the computation to power consumption ratio, MPSoCs for embedded applications are heterogeneous and integrate cores that are specialized to perform the different functionalities of the application. With technology scaling, wire power consumption is increasing compared to logic, making communication as expensive as computation. Therefore customizing the interconnect is necessary to achieve energy efficiency. Designing an optimal application specific Network-on-Chip (NoC), that meets application demands, requires the exploration of a large design space. Automatic design and optimization of the NoC is required in order to achieve fast design closure, especially for heterogeneous MPSoCs. To continue to meet the computation requirements of future applications new technologies are emerging. Three dimensional integration promises to increase the number of transistors by stacking multiple silicon layers. This will lead to an increase in the number of cores of the MPSoCs resulting in increased communication demands. To compensate for the increase in the wire delay in new technology nodes as well as to reduce the power consumption further, multi-synchronous design is becoming popular. With multiple clock signals, different parts of the MPSoC can be clocked at different frequencies according to the current demands of the application and can even be shutdown when they are not used at all. This further complicates the design of the NoC.Many applications require different levels of guarantee from the NoC in order to perform their functionality correctly. As communication traffic patterns become more complex, the performance of the NoC can no longer be predicted statically. Therefore designing the interconnect network requires that such guarantees are provided during the dynamic operation of the system which includes the interaction with major subsystems (i.e., main memory) and not just the interconnect itself. In this thesis, I present novel methods to design application-specific NoCs that meet performance demands, under the constraints of new technologies. To provide different levels of Quality of Service, I integrate methods to estimate the NoC performance during the design phase of the interconnect topology. I present methods and architectures for NoCs to efficiently access memory systems, in order to achieve predictable operation of the systems from the point of view of the communication as well as the bottleneck target devices. Therefore the main contribution of the thesis is twofold: scientific as I propose new algorithms to perform topology synthesis and engineering by presenting extensive experiments and architectures for NoC design
Automated Hardware Prototyping for 3D Network on Chips
Vor mehr als 50 Jahren stellte Intel® Mitbegründer Gordon Moore eine Prognose zum Entwicklungsprozess der Transistortechnologie auf. Er prognostizierte, dass sich die Zahl der Transistoren in integrierten Schaltungen alle zwei Jahre verdoppeln wird. Seine Aussage ist immer noch gültig, aber ein Ende von Moores Gesetz ist in Sicht. Mit dem Ende von Moore’s Gesetz müssen neue Aspekte untersucht werden, um weiterhin die Leistung von integrierten Schaltungen zu steigern. Zwei mögliche Ansätze für "More than Moore” sind 3D-Integrationsverfahren und heterogene Systeme. Gleichzeitig entwickelt sich ein Trend hin zu Multi-Core Prozessoren, basierend auf Networks on chips (NoCs).
Neben dem Ende des Mooreschen Gesetzes ergeben sich bei immer kleiner werdenden Technologiegrößen, vor allem jenseits der 60 nm, neue Herausforderungen. Eine Schwierigkeit ist die Wärmeableitung in großskalierten integrierten Schaltkreisen und die daraus resultierende Überhitzung des Chips. Um diesem Problem in modernen Multi-Core Architekturen zu begegnen, muss auch die Verlustleistung der Netzwerkressourcen stark reduziert werden. Diese Arbeit umfasst eine durch Hardware gesteuerte Kombination aus Frequenzskalierung und Power Gating für 3D On-Chip Netzwerke, einschließlich eines FPGA Prototypen. Dafür wurde ein Takt-synchrones 2D Netzwerk auf ein dreidimensionales asynchrones Netzwerk mit mehreren Frequenzbereichen erweitert. Zusätzlich wurde ein skalierbares Online-Power-Management System mit geringem Ressourcenaufwand entwickelt.
Die Verifikation neuer Hardwarekomponenten ist einer der zeitaufwendigsten Schritte im Entwicklungsprozess hochintegrierter digitaler Schaltkreise. Um diese Aufgabe zu beschleunigen und um eine parallele Softwareentwicklung zu ermöglichen, wurde im Rahmen dieser Arbeit ein automatisiertes und benutzerfreundliches Tool für den Entwurf neuer Hardware Projekte entwickelt. Eine grafische Benutzeroberfläche zum Erstellen des gesamten Designablaufs, vom Erstellen der Architektur, Parameter Deklaration, Simulation, Synthese und Test ist Teil dieses Werkzeugs. Zudem stellt die Größe der Architektur für die Erstellung eines Prototypen eine besondere Herausforderung dar. Frühere Arbeiten haben es versäumt, eine schnelles und unkompliziertes Prototyping, insbesondere von Architekturen mit mehr als 50 Prozessorkernen, zu realisieren. Diese Arbeit umfasst eine Design Space Exploration und FPGA-basierte Prototypen von verschiedenen 3D-NoC Implementierungen mit mehr als 80 Prozessoren
Embedded dynamic programming networks for networks-on-chip
PhD ThesisRelentless technology downscaling and recent technological advancements
in three dimensional integrated circuit (3D-IC) provide a promising
prospect to realize heterogeneous system-on-chip (SoC) and homogeneous
chip multiprocessor (CMP) based on the networks-onchip
(NoCs) paradigm with augmented scalability, modularity and
performance. In many cases in such systems, scheduling and managing
communication resources are the major design and implementation
challenges instead of the computing resources. Past research
efforts were mainly focused on complex design-time or simple heuristic
run-time approaches to deal with the on-chip network resource
management with only local or partial information about the network.
This could yield poor communication resource utilizations and amortize
the benefits of the emerging technologies and design methods.
Thus, the provision for efficient run-time resource management in
large-scale on-chip systems becomes critical. This thesis proposes a
design methodology for a novel run-time resource management infrastructure
that can be realized efficiently using a distributed architecture,
which closely couples with the distributed NoC infrastructure. The
proposed infrastructure exploits the global information and status
of the network to optimize and manage the on-chip communication
resources at run-time.
There are four major contributions in this thesis. First, it presents a
novel deadlock detection method that utilizes run-time transitive closure
(TC) computation to discover the existence of deadlock-equivalence
sets, which imply loops of requests in NoCs. This detection scheme,
TC-network, guarantees the discovery of all true-deadlocks without
false alarms in contrast to state-of-the-art approximation and heuristic
approaches. Second, it investigates the advantages of implementing
future on-chip systems using three dimensional (3D) integration and
presents the design, fabrication and testing results of a TC-network
implemented in a fully stacked three-layer 3D architecture using a
through-silicon via (TSV) complementary metal-oxide semiconductor
(CMOS) technology. Testing results demonstrate the effectiveness
of such a TC-network for deadlock detection with minimal computational
delay in a large-scale network. Third, it introduces an adaptive
strategy to effectively diffuse heat throughout the three dimensional
network-on-chip (3D-NoC) geometry. This strategy employs a dynamic
programming technique to select and optimize the direction of data
manoeuvre in NoC. It leads to a tool, which is based on the accurate
HotSpot thermal model and SystemC cycle accurate model, to simulate
the thermal system and evaluate the proposed approach. Fourth, it
presents a new dynamic programming-based run-time thermal management
(DPRTM) system, including reactive and proactive schemes, to
effectively diffuse heat throughout NoC-based CMPs by routing packets
through the coolest paths, when the temperature does not exceed
chip’s thermal limit. When the thermal limit is exceeded, throttling is
employed to mitigate heat in the chip and DPRTM changes its course
to avoid throttled paths and to minimize the impact of throttling on
chip performance.
This thesis enables a new avenue to explore a novel run-time resource
management infrastructure for NoCs, in which new methodologies
and concepts are proposed to enhance the on-chip networks for
future large-scale 3D integration.Iraqi Ministry of Higher Education and Scientific Research (MOHESR)
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