Mechanical Diaphragm Structure Design of a MEMS-Based Piezoresistive Pressure Sensor for Sensitivity and Linearity Enhancement

An improved design of the micro-electromechanical system (MEMS) piezoresistive pressure sensor with a combination of a petal edge, a beam, a peninsula, three cross beams and a center boss is proposed in this work for an operating range of low pressure in order to improve the sensor performance, i.e. the sensitivity and the linearity. The finite element method (FEM) is utilized to predict the stress and the deflection of the MEMS piezoresistive pressure sensor under the applied pressure of 1-5 kPa. The functional forms of the longitudinal stress, the transverse stress and the deflection are formulated by using the power law and then are used to optimize the geometry of the proposed design. The simulation results show that the proposed design is able to produce the high sensitivity up to 34 mV/kPa with the low nonlinearity of 0.11% full-scale span (FSS). The nonlinearity error is lowered by the proposed design of the peninsula, three cross beams and the center boss. The sensitivity is enhanced by increasing the petal edge width. The sensor performance of the proposed design is also compared to that of the previous design in the literature. The comparison reveals that the proposed design can perform better than the previous one

Development of Multifunctional E-skin Sensors

Electronic skin (e-skin) is a hot topic due to its enormous potential for health monitoring, functional prosthesis, robotics, and human-machine-interfaces (HMI). For these applications, pressure and temperature sensors and energy harvesters are essential. Their performance may be tuned by their films micro-structuring, either through expensive and time-consuming photolithography techniques or low-cost yet low-tunability approaches. This PhD thesis aimed to introduce and explore a new micro-structuring technique to the field of e-skin – laser engraving – to produce multifunctional e-skin devices able to sense pressure and temperature while being self-powered. This technique was employed to produce moulds for soft lithography, in a low-cost, fast, and highly customizable way. Several parameters of the technique were studied to evaluate their impact in the performance of the devices, such as moulds materials, laser power and speed, and design variables. Amongst the piezoresistive sensors produced, sensors suitable for blood pressure wave detection at the wrist [sensitivity of – 3.2 kPa-1 below 119 Pa, limit of detection (LOD) of 15 Pa], general health monitoring (sensitivity of 4.5 kPa-1 below 10 kPa, relaxation time of 1.4 ms, micro-structured film thickness of only 133 µm), and robotics and functional prosthesis (sensitivity of – 6.4 × 10-3 kPa-1 between 1.2 kPa and 100 kPa, stable output over 27 500 cycles) were obtained. Temperature sensors with micro-cones were achieved with a temperature coefficient of resistance (TCR) of 2.3 %/°C. Energy harvesters based on micro-structured composites of polydimethylsiloxane (PDMS) and zinc tin oxide (ZnSnO3) nanowires (NWs; 120 V and 13 µA at > 100 N) or zinc oxide (ZnO) nanorods (NRs; 6 V at 2.3 N) were produced as well. The work described herein unveils the tremendous potential of the laser engraving technique to produce different e-skin devices with adjustable performance to suit distinct applications, with a high benefit/cost ratio

MEMS Accelerometers

Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc

Material selection for optimum design of MEMS pressure sensors

Abstract: Choice of the most suitable material out of the universe of engineering materials available to the designers is a complex task. It often requires a compromise, involving conflicts between different design objectives. Materials selection for optimum design of a Micro-Electro-Mechanical-Systems (MEMS) pressure sensor is one such case. For optimum performance, simultaneous maximization of deflection of a MEMS pressure sensor diaphragm and maximization of its resonance frequency are two key but totally conflicting requirements. Another limitation in material selection of MEMS/Microsystems is the lack of availability of data containing accurate micro-scale properties of MEMS materials. This paper therefore, presents a material selection case study addressing these two challenges in optimum design of MEMS pressure sensors, individually as well as simultaneously, using Ashby’s method. First, data pertaining to micro-scale properties of MEMS materials has been consolidated and then the Performance and Material Indices that address the MEMS pressure sensor’s conflicting design requirements are formulated. Subsequently, by using the micro-scale materials properties data, candidate materials for optimum performance of MEMS pressure sensors have been determined. Manufacturability of pressure sensor diaphragm using the candidate materials, pointed out by this study, has been discussed with reference to the reported devices. Supported by the previous literature, our analysis re-emphasizes that silicon with 110 crystal orientation [Si (110)], which has been extensively used in a number of micro-scale devices and applications, is also a promising material for MEMS pressure sensor diaphragm. This paper hence identifies an unexplored opportunity to use Si (110) diaphragm to improve the performance of diaphragm based MEMS pressure sensors