Circuits and Systems Advances in Near Threshold Computing

Modern society is witnessing a sea change in ubiquitous computing, in which people have embraced computing systems as an indispensable part of day-to-day existence. Computation, storage, and communication abilities of smartphones, for example, have undergone monumental changes over the past decade. However, global emphasis on creating and sustaining green environments is leading to a rapid and ongoing proliferation of edge computing systems and applications. As a broad spectrum of healthcare, home, and transport applications shift to the edge of the network, near-threshold computing (NTC) is emerging as one of the promising low-power computing platforms. An NTC device sets its supply voltage close to its threshold voltage, dramatically reducing the energy consumption. Despite showing substantial promise in terms of energy efficiency, NTC is yet to see widescale commercial adoption. This is because circuits and systems operating with NTC suffer from several problems, including increased sensitivity to process variation, reliability problems, performance degradation, and security vulnerabilities, to name a few. To realize its potential, we need designs, techniques, and solutions to overcome these challenges associated with NTC circuits and systems. The readers of this book will be able to familiarize themselves with recent advances in electronics systems, focusing on near-threshold computing

Efficient Time of Arrival Calculation for Acoustic Source Localization Using Wireless Sensor Networks

Acoustic source localization is a very useful tool in surveillance and tracking applications. Potential exists for ubiquitous presence of acoustic source localization systems. However, due to several significant challenges they are currently limited in their applications. Wireless Sensor Networks (WSN) offer a feasible solution that can allow for large, ever present acoustic localization systems. Some fundamental challenges remain. This thesis presents some ideas for helping solve the challenging problems faced by networked acoustic localization systems. We make use of a low-power WSN designed specifically for distributed acoustic source localization. Our ideas are based on three important observations. First, sounds emanating from a source will be free of reflections at the beginning of the sound. We make use of this observation by selectively processing only the initial parts of a sound to be localized. Second, the significant features of a sound are more robust to various interference sources. We perform key feature recognition such as the locations of significant zero crossings and local peaks. Third, these features which are compressed descriptors, can also be used for distributed pattern matching. For this we perform basic pattern analysis by comparing sampled signals from various nodes in order to determine better Time Of Arrivals (TOA). Our implementation tests these ideas in a predictable test environment. A complete system for general sounds is left for future wor

The Chameleon Architecture for Streaming DSP Applications

We focus on architectures for streaming DSP applications such as wireless baseband processing and image processing. We aim at a single generic architecture that is capable of dealing with different DSP applications. This architecture has to be energy efficient and fault tolerant. We introduce a heterogeneous tiled architecture and present the details of a domain-specific reconfigurable tile processor called Montium. This reconfigurable processor has a small footprint (1.8 mm$^2$ in a 130 nm process), is power efficient and exploits the locality of reference principle. Reconfiguring the device is very fast, for example, loading the coefficients for a 200 tap FIR filter is done within 80 clock cycles. The tiles on the tiled architecture are connected to a Network-on-Chip (NoC) via a network interface (NI). Two NoCs have been developed: a packet-switched and a circuit-switched version. Both provide two types of services: guaranteed throughput (GT) and best effort (BE). For both NoCs estimates of power consumption are presented. The NI synchronizes data transfers, configures and starts/stops the tile processor. For dynamically mapping applications onto the tiled architecture, we introduce a run-time mapping tool

Millimeter-Scale and Energy-Efficient RF Wireless System

This dissertation focuses on energy-efficient RF wireless system with millimeter-scale dimension, expanding the potential use cases of millimeter-scale computing devices. It is challenging to develop RF wireless system in such constrained space. First, millimeter-sized antennae are electrically-small, resulting in low antenna efficiency. Second, their energy source is very limited due to the small battery and/or energy harvester. Third, it is required to eliminate most or all off-chip devices to further reduce system dimension. In this dissertation, these challenges are explored and analyzed, and new methods are proposed to solve them. Three prototype RF systems were implemented for demonstration and verification. The first prototype is a 10 cubic-mm inductive-coupled radio system that can be implanted through a syringe, aimed at healthcare applications with constrained space. The second prototype is a 3x3x3 mm far-field 915MHz radio system with 20-meter NLOS range in indoor environment. The third prototype is a low-power BLE transmitter using 3.5x3.5 mm planar loop antenna, enabling millimeter-scale sensors to connect with ubiquitous IoT BLE-compliant devices. The work presented in this dissertation improves use cases of millimeter-scale computers by presenting new methods for improving energy efficiency of wireless radio system with extremely small dimensions. The impact is significant in the age of IoT when everything will be connected in daily life.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/147686/1/yaoshi_1.pd

Physical parameter-aware Networks-on-Chip design

PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable and power-efficient communication fabric for chip multiprocessors (CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine both the performance and the reliability of such systems, with a significant power demand that is expected to increase due to developments in both technology and architecture. In terms of architecture, an important trend in many-core systems architecture is to increase the number of cores on a chip while reducing their individual complexity. This trend increases communication power relative to computation power. Moreover, technology-wise, power-hungry wires are dominating logic as power consumers as technology scales down. For these reasons, the design of future very large scale integration (VLSI) systems is moving from being computation-centric to communication-centric. On the other hand, chip’s physical parameters integrity, especially power and thermal integrity, is crucial for reliable VLSI systems. However, guaranteeing this integrity is becoming increasingly difficult with the higher scale of integration due to increased power density and operating frequencies that result in continuously increasing temperature and voltage drops in the chip. This is a challenge that may prevent further shrinking of devices. Thus, tackling the challenge of power and thermal integrity of future many-core systems at only one level of abstraction, the chip and package design for example, is no longer sufficient to ensure the integrity of physical parameters. New designtime and run-time strategies may need to work together at different levels of abstraction, such as package, application, network, to provide the required physical parameter integrity for these large systems. This necessitates strategies that work at the level of the on-chip network with its rising power budget. This thesis proposes models, techniques and architectures to improve power and thermal integrity of Network-on-Chip (NoC)-based many-core systems. The thesis is composed of two major parts: i) minimization and modelling of power supply variations to improve power integrity; and ii) dynamic thermal adaptation to improve thermal integrity. This thesis makes four major contributions. The first is a computational model of on-chip power supply variations in NoCs. The proposed model embeds a power delivery model, an NoC activity simulator and a power model. The model is verified with SPICE simulation and employed to analyse power supply variations in synthetic and real NoC workloads. Novel observations regarding power supply noise correlation with different traffic patterns and routing algorithms are found. The second is a new application mapping strategy aiming vii to minimize power supply noise in NoCs. This is achieved by defining a new metric, switching activity density, and employing a force-based objective function that results in minimizing switching density. Significant reductions in power supply noise (PSN) are achieved with a low energy penalty. This reduction in PSN also results in a better link timing accuracy. The third contribution is a new dynamic thermal-adaptive routing strategy to effectively diffuse heat from the NoC-based threedimensional (3D) CMPs, using a dynamic programming (DP)-based distributed control architecture. Moreover, a new approach for efficient extension of two-dimensional (2D) partially-adaptive routing algorithms to 3D is presented. This approach improves three-dimensional networkon- chip (3D NoC) routing adaptivity while ensuring deadlock-freeness. Finally, the proposed thermal-adaptive routing is implemented in field-programmable gate array (FPGA), and implementation challenges, for both thermal sensing and the dynamic control architecture are addressed. The proposed routing implementation is evaluated in terms of both functionality and performance. The methodologies and architectures proposed in this thesis open a new direction for improving the power and thermal integrity of future NoC-based 2D and 3D many-core architectures