Performance and power optimization in VLSI physical design

As VLSI technology enters the nanoscale regime, a great amount of efforts have been made to reduce interconnect delay. Among them, buffer insertion stands out as an effective technique for timing optimization. A dramatic rise in on-chip buffer density has been witnessed. For example, in two recent IBM ASIC designs, 25% gates are buffers. In this thesis, three buffer insertion algorithms are presented for the procedure of performance and power optimization. The second chapter focuses on improving circuit performance under inductance effect. The new algorithm works under the dynamic programming framework and runs in provably linear time for multiple buffer types due to two novel techniques: restrictive cost bucketing and efficient delay update. The experimental results demonstrate that our linear time algorithm consistently outperforms all known RLC buffering algorithms in terms of both solution quality and runtime. That is, the new algorithm uses fewer buffers, runs in shorter time and the buffered tree has better timing. The third chapter presents a method to guarantee a high fidelity signal transmission in global bus. It proposes a new redundant via insertion technique to reduce via variation and signal distortion in twisted differential line. In addition, a new buffer insertion technique is proposed to synchronize the transmitted signals, thus further improving the effectiveness of the twisted differential line. Experimental results demonstrate a 6GHz signal can be transmitted with high fidelity using the new approaches. In contrast, only a 100MHz signal can be reliably transmitted using a single-end bus with power/ground shielding. Compared to conventional twisted differential line structure, our new techniques can reduce the magnitude of noise by 45% as witnessed in our simulation. The fourth chapter proposes a buffer insertion and gate sizing algorithm for million plus gates. The algorithm takes a combinational circuit as input instead of individual nets and greatly reduces the buffer and gate cost of the entire circuit. The algorithm has two main features: 1) A circuit partition technique based on the criticality of the primary inputs, which provides the scalability for the algorithm, and 2) A linear programming formulation of non-linear delay versus cost tradeoff, which formulates the simultaneous buffer insertion and gate sizing into linear programming problem. Experimental results on ISCAS85 circuits show that even without the circuit partition technique, the new algorithm achieves 17X speedup compared with path based algorithm. In the meantime, the new algorithm saves 16.0% buffer cost, 4.9% gate cost, 5.8% total cost and results in less circuit delay

Implementation and evaluation of the sensornet protocol for Contiki

Sensornet Protocol (SP) is a link abstraction layer between the network layer and the link layer for sensor networks. SP was proposed as the core of a future-oriented sensor node architecture that allows flexible and optimized combination between multiple coexisting protocols. This thesis implements the SP sensornet protocol on the Contiki operating system in order to: evaluate the effectiveness of the original SP services; explore further requirements and implementation trade-offs uncovered by the original proposal. We analyze the original SP design and the TinyOS implementation of SP to design the Contiki port. We implement the data sending and receiving part of SP using Contiki processes, and the neighbor management part as a group of global routines. The evaluation consists of a single-hop traffic throughput test and a multihop convergecast test. Both tests are conducted using both simulation and experimentation. We conclude from the evaluation results that SP's link-level abstraction effectively improves modularity in protocol construction without sacrificing performance, and our SP implementation on Contiki lays a good foundation for future protocol innovations in wireless sensor networks

Electromigration modeling and layout optimization for advanced VLSI

textElectromigration (EM) is a critical problem for interconnect reliability in advanced VLSI design. Because EM is a strong function of current density, a smaller cross-sectional area of interconnects can degrade the EM-related lifetime of IC, which is expected to become more severe in future technology nodes. Moreover, as EM is governed by various factors such as temperature, material property, geometrical shape, and mechanical stress, different interconnect structures can have distinct EM issues and solutions to mitigate them. For example, one of the most prominent technologies, die stacking technology of three-dimensional (3D) ICs, can have different EM problems from that of planer ICs, due to their unique interconnects such as through-silicon vias (TSVs). This dissertation investigates EM in various interconnect structures, and applies the EM models to optimize IC layout. First, modeling of EM is developed for chip-level interconnects, such as wires, local vias, TSVs, and multi-scale vias (MSVs). Based on the models, fast and accurate EM-prediction methods are proposed for the chip-level designs. After that, by utilizing the EM-prediction methods, the layout optimization methods are suggested, such as EM-aware routing for 3D ICs and EM-aware redundant via insertion for the future technology nodes in VLSI. Experimental results show that the proposed EM modeling approaches enable fast and accurate EM evaluation for chip design, and the EM-aware layout optimization methods improve EM-robustness of advanced VLSI designs.Electrical and Computer Engineerin

X-Vine: Secure and Pseudonymous Routing Using Social Networks

Distributed hash tables suffer from several security and privacy vulnerabilities, including the problem of Sybil attacks. Existing social network-based solutions to mitigate the Sybil attacks in DHT routing have a high state requirement and do not provide an adequate level of privacy. For instance, such techniques require a user to reveal their social network contacts. We design X-Vine, a protection mechanism for distributed hash tables that operates entirely by communicating over social network links. As with traditional peer-to-peer systems, X-Vine provides robustness, scalability, and a platform for innovation. The use of social network links for communication helps protect participant privacy and adds a new dimension of trust absent from previous designs. X-Vine is resilient to denial of service via Sybil attacks, and in fact is the first Sybil defense that requires only a logarithmic amount of state per node, making it suitable for large-scale and dynamic settings. X-Vine also helps protect the privacy of users social network contacts and keeps their IP addresses hidden from those outside of their social circle, providing a basis for pseudonymous communication. We first evaluate our design with analysis and simulations, using several real world large-scale social networking topologies. We show that the constraints of X-Vine allow the insertion of only a logarithmic number of Sybil identities per attack edge; we show this mitigates the impact of malicious attacks while not affecting the performance of honest nodes. Moreover, our algorithms are efficient, maintain low stretch, and avoid hot spots in the network. We validate our design with a PlanetLab implementation and a Facebook plugin.Comment: 15 page

HIGH PERFORMANCE CLOCK DISTRIBUTION FOR HIGH-SPEED VLSI SYSTEMS

Tohoku University堀口 進課

Techniques for Improving Security and Trustworthiness of Integrated Circuits

The integrated circuit (IC) development process is becoming increasingly vulnerable to malicious activities because untrusted parties could be involved in this IC development flow. There are four typical problems that impact the security and trustworthiness of ICs used in military, financial, transportation, or other critical systems: (i) Malicious inclusions and alterations, known as hardware Trojans, can be inserted into a design by modifying the design during GDSII development and fabrication. Hardware Trojans in ICs may cause malfunctions, lower the reliability of ICs, leak confidential information to adversaries or even destroy the system under specifically designed conditions. (ii) The number of circuit-related counterfeiting incidents reported by component manufacturers has increased significantly over the past few years with recycled ICs contributing the largest percentage of the total reported counterfeiting incidents. Since these recycled ICs have been used in the field before, the performance and reliability of such ICs has been degraded by aging effects and harsh recycling process. (iii) Reverse engineering (RE) is process of extracting a circuit’s gate-level netlist, and/or inferring its functionality. The RE causes threats to the design because attackers can steal and pirate a design (IP piracy), identify the device technology, or facilitate other hardware attacks. (iv) Traditional tools for uniquely identifying devices are vulnerable to non-invasive or invasive physical attacks. Securing the ID/key is of utmost importance since leakage of even a single device ID/key could be exploited by an adversary to hack other devices or produce pirated devices. In this work, we have developed a series of design and test methodologies to deal with these four challenging issues and thus enhance the security, trustworthiness and reliability of ICs. The techniques proposed in this thesis include: a path delay fingerprinting technique for detection of hardware Trojans, recycled ICs, and other types counterfeit ICs including remarked, overproduced, and cloned ICs with their unique identifiers; a Built-In Self-Authentication (BISA) technique to prevent hardware Trojan insertions by untrusted fabrication facilities; an efficient and secure split manufacturing via Obfuscated Built-In Self-Authentication (OBISA) technique to prevent reverse engineering by untrusted fabrication facilities; and a novel bit selection approach for obtaining the most reliable bits for SRAM-based physical unclonable function (PUF) across environmental conditions and silicon aging effects