Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Memory and I/O optimized rectilinear steiner minimum tree routing for VLSI

As the size of devices are scaling down at rapid pace, the interconnect delay play a major part in performance of IC chips. Therefore minimizing delay and wire length is the most desired objective. FLUTE (Fast Look-Up table) presented a fast and accurate RSMT (Rectilinear Steiner Minimum Tree) construction for both smaller and higher degree net. FLUTE presented an optimization technique that reduces time complexity for RSMT construction for both smaller and larger degree nets. However for larger degree net this technique induces memory overhead, as it does not consider the memory requirement in constructing RSMT. Since availability of memory is very less and is expensive, it is desired to utilize memory more efficiently which in turn results in reducing I/O time (i.e. reduce the number of I/O disk access). The proposed work presents a Memory Optimized RSMT (MORSMT) construction in order to address the memory overhead for larger degree net. The depth-first search and divide and conquer approach is adopted to build a Memory optimized tree. Experiments are conducted to evaluate the performance of proposed approach over existing model for varied benchmarks in terms of computation time, memory overhead and wire length. The experimental results show that the proposed model is scalable and efficient

A complete design path for the layout of flexible macros

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Doctor of Philosophy

dissertationThe embedded system space is characterized by a rapid evolution in the complexity and functionality of applications. In addition, the short time-to-market nature of the business motivates the use of programmable devices capable of meeting the conflicting constraints of low-energy, high-performance, and short design times. The keys to achieving these conflicting constraints are specialization and maximally extracting available application parallelism. General purpose processors are flexible but are either too power hungry or lack the necessary performance. Application-specific integrated circuits (ASICS) efficiently meet the performance and power needs but are inflexible. Programmable domain-specific architectures (DSAs) are an attractive middle ground, but their design requires significant time, resources, and expertise in a variety of specialties, which range from application algorithms to architecture and ultimately, circuit design. This dissertation presents CoGenE, a design framework that automates the design of energy-performance-optimal DSAs for embedded systems. For a given application domain and a user-chosen initial architectural specification, CoGenE consists of a a Compiler to generate execution binary, a simulator Generator to collect performance/energy statistics, and an Explorer that modifies the current architecture to improve energy-performance-area characteristics. The above process repeats automatically until the user-specified constraints are achieved. This removes or alleviates the time needed to understand the application, manually design the DSA, and generate object code for the DSA. Thus, CoGenE is a new design methodology that represents a significant improvement in performance, energy dissipation, design time, and resources. This dissertation employs the face recognition domain to showcase a flexible architectural design methodology that creates "ASIC-like" DSAs. The DSAs are instruction set architecture (ISA)-independent and achieve good energy-performance characteristics by coscheduling the often conflicting constraints of data access, data movement, and computation through a flexible interconnect. This represents a significant increase in programming complexity and code generation time. To address this problem, the CoGenE compiler employs integer linear programming (ILP)-based 'interconnect-aware' scheduling techniques for automatic code generation. The CoGenE explorer employs an iterative technique to search the complete design space and select a set of energy-performance-optimal candidates. When compared to manual designs, results demonstrate that CoGenE produces superior designs for three application domains: face recognition, speech recognition and wireless telephony. While CoGenE is well suited to applications that exhibit a streaming behavior, multithreaded applications like ray tracing present a different but important challenge. To demonstrate its generality, CoGenE is evaluated in designing a novel multicore N-wide SIMD architecture, known as StreamRay, for the ray tracing domain. CoGenE is used to synthesize the SIMD execution cores, the compiler that generates the application binary, and the interconnection subsystem. Further, separating address and data computations in space reduces data movement and contention for resources, thereby significantly improving performance compared to existing ray tracing approaches

Algorithms for the scaling toward nanometer VLSI physical synthesis

Along the history of Very Large Scale Integration (VLSI), we have successfully scaled down the size of transistors, scaled up the speed of integrated circuits (IC) and the number of transistors in a chip - these are just a few examples of our achievement in VLSI scaling. It is projected to enter the nanometer (timing estimation and buffer planning for global routing and other early stages such as floorplanning. A novel path based buffer insertion scheme is also included, which can overcome the weakness of the net based approaches. Part-2 Circuit clustering techniques with the application in Field-Programmable Gate Array (FPGA) technology mapping The problem of timing driven n-way circuit partitioning with application to FPGA technology mapping is studied and a hierarchical clustering approach is presented for the latest multi-level FPGA architectures. Moreover, a more general delay model is included in order to accurately characterize the delay behavior of the clusters and circuit elements

A Micro Power Hardware Fabric for Embedded Computing

Field Programmable Gate Arrays (FPGAs) mitigate many of the problemsencountered with the development of ASICs by offering flexibility, faster time-to-market, and amortized NRE costs, among other benefits. While FPGAs are increasingly being used for complex computational applications such as signal and image processing, networking, and cryptology, they are far from ideal for these tasks due to relatively high power consumption and silicon usage overheads compared to direct ASIC implementation. A reconfigurable device that exhibits ASIC-like power characteristics and FPGA-like costs and tool support is desirable to fill this void. In this research, a parameterized, reconfigurable fabric model named as domain specific fabric (DSF) is developed that exhibits ASIC-like power characteristics for Digital Signal Processing (DSP) style applications. Using this model, the impact of varying different design parameters on power and performance has been studied. Different optimization techniques like local search and simulated annealing are used to determine the appropriate interconnect for a specific set of applications. A design space exploration tool has been developed to automate and generate a tailored architectural instance of the fabric.The fabric has been synthesized on 160 nm cell-based ASIC fabrication process from OKI and 130 nm from IBM. A detailed power-performance analysis has been completed using signal and image processing benchmarks from the MediaBench benchmark suite and elsewhere with comparisons to other hardware and software implementations. The optimized fabric implemented using the 130 nm process yields energy within 3X of a direct ASIC implementation, 330X better than a Virtex-II Pro FPGA and 2016X better than an Intel XScale processor