Initial detailed routing algorithms

In this work, we present a study of the problem of routing in the context of the VLSI physical synthesis flow. We study the fundamental routing algorithms such as maze routing, A*, and Steiner tree-based algorithms, as well as some global routing algorithms, namely FastRoute 4.0 and BoxRouter 2.0. We dissect some of the major state of the art initial detailed routing tools, such as RegularRoute, TritonRoute, SmartDR and Dr.CU 2.0. We also propose an initial detailed routing flow, and present an implementation of the proposed routing flow, with a track assignment technique that models the problem as an instance of the maximum independent weighted set (MWIS) and utilizes integer linear programming (ILP) as a solver. The implementation of the proposed initial detailed routing flow also includes an implementation of multiple-source and multiple-target A* for terminal andnet connection with adjustable rules and weights. Finally, we also present a study of the results obtained by the implementation of the proposed initial detailed routing flow and a comparison with the ISPD 2019 contest winners, considering the ISPD 2019 and benchmark suite and evaluation tools.Neste trabalho, apresentamos um estudo do problema de roteamento no contexto do fluxo de síntese física de circuitos integrados VLSI. Nós estudamos algoritmos de roteamento fundamentais como roteamento de labirinto, A* e baseados em árvores de Steiner, além de alguns algoritmos de roteamento global como FastRoute 4.0 e BoxRouter 2.0. Nós dissecamos alguns dos principais trabalhos de roteamento detalhado inicial do estado da arte, como RegularRoute, TritonRoute, SmartDR e Dr.CU 2.0. Também propomos um fluxo de roteamento detalhado inicial, e apresentamos uma implementação do fluxo de roteametno proposto, com uma técnica de assinalamento de trilhas que modela o problema como uma instância do problema do conjunto independente de peso máximo e usa programação linear inteira como um resolvedor. A implementação do fluxo de rotemaento detalhado inicial proposto também inclui uma implementação de um A* com múltiplas fontes e múltiplos destinos para conexão de terminais e redes, com regras e pesos ajustáveis. Por fim, nós apresentamos um estudo dos resultados obtidos pela implementação do fluxo de roteamento detalhado inicial proposto e comparamos com os vencedores do ISPD 2019 contest considerando a suíte de teste e ferramentas de avaliação do ISPD 2019

Computer aids for the design of large scale integrated circuits.

The work described in this thesis is concerned with the development of CADIC (Computer Aided Design of Integrated Circuits), a suite of computer programs which allows the user to design integrated circuit layouts at the geometric level. Initially, a review of existing computer aids to integrated circuit design is carried out. Advantages and disadvantages of each computer aid is discused, and the approach taken by CADIC justified in the light of the review. The hardware associated with a design aid can greatly influence its performance and useability. For this reason, a critical review of available graphic terminals is also undertaken. The requirements, logistics, and operation of CADIC is then discussed in detail. CADIC provides a consise range of features to aid in the design and testing of integrated circuit layouts. The most important features are however CADIC's high efficiency in processing layout data, and the implementation of complete on-line design rule checking. Utilization of these features allows CADIC to substantially reduce the lengthy design turnaround time normally associated with manual design aids. Finally, the performance of CADIC is presented. Analysis of the results show that CADIC is very efficient at data processing, especially when small sections of the layout are considered. CADIC can also perform complete on-line design rule checking well within the time it takes the designer to start adding the next shape

Improved Physical Design for Manufacturing Awareness and Advanced VLSI

Increasing challenges arise with each new semiconductor technology node, especially in advanced nodes, where the industry tries to extract every ounce of benefit as it approaches the limits of physics, through manufacturing-aware design technology co-optimization and design-based equivalent scaling. The increasing complexity of design and process technologies, and ever-more complex design rules, also become hurdles for academic researchers, separating academic researchers from the most up-to-date technical issues.This thesis presents innovative methodologies and optimizations to address the above challenges. There are three directions in this thesis: (i) manufacturing-aware design technology co-optimization; (ii) advanced node design-based equivalent scaling; and (iii) an open source academic detailed routing flow.To realize manufacturing-aware design technology co-optimization, this thesis presents two works: (i) a multi-row detailed placement optimization for neighbor diffusion effect mitigation between neighboring standard cells; and (ii) a post-routing optimization to generate 2D block mask layout for dummy segment removal in self-aligned multiple patterning.To achieve advanced node design-based equivalent scaling, this thesis presents two improved physical design methodologies: (i) a post-placement flop tray generation approach for clock power reduction; and (ii) a detailed placement approach to exploit inter-row M1 routing for congestion and wirelength reduction.To address the increasing gap between academia and industry, this thesis presents two works toward an open source academic detailed routing flow: (i) a complete, robust, scalable and design ruleaware dynamic programming-based pin access analysis framework; and (ii) TritonRoute – the open source detailed router that is capable of delivering DRC-clean detailed routing solutions in advanced nodes.This thesis concludes with a summary of its contributions and open directions for future research

Performance-Based Optical Proximity Correction

Ph.DDOCTOR OF PHILOSOPH

PHYSICS-BASED SHAPE MORPHING AND PACKING FOR LAYOUT DESIGN

The packing problem, also named layout design, has found wide applications in the mechanical engineering field. In most cases, the shapes of the objects do not change during the packing process. However, in some applications such as vehicle layout design, shape morphing may be required for some specific components (such as water and fuel reservoirs). The challenge is to fit a component of sufficient size in the available space in a crowded environment (such as the vehicle under-hood) while optimizing the overall performance objectives of the vehicle and improving design efficiency. This work is focused on incorporating component shape design into the layout design process, i.e. finding the optimal locations and orientations of all the components within a specified volume, as well as the suitable shapes of selected ones. The first major research issue is to identify how to efficiently and accurately morph the shapes of components respecting the functional constraints. Morphing methods depend on the geometrical representation of the components. The traditional parametric representation may lend itself easily to modification, but it relies on assumption that the final approximate shape of the object is known, and therefore, the morphing freedom is very limited. To morph objects whose shape can be changed arbitrarily in layout design, a mesh based morphing method based on a mass-spring physical model is developed. For this method, there is no need to explicitly specify the deformations and the shape morphing freedom is not confined. The second research issue is how to incorporate component shape design into a layout design process. Handling the complete problem at once may be beyond our reach,therefore decomposition and multilevel approaches are used. At the system level, a genetic algorithm (GA) is applied to find the positions and orientations of the objects, while at the sub-system or component level, morphing is accomplished for select components. Although different packing applications may have different objectives and constraints, they all share some common issues. These include CAD model preprocessing for packing purpose, data format translation during the packing process if performance evaluation and morphing use different representation methods, efficiency of collision detection methods, etc. These common issues are all brought together under the framework of a general methodology for layout design with shape morphing. Finally, practical examples of vehicle under-hood/underbody layout design with the mass-spring physical model based shape morphing are demonstrated to illustrate the proposed approach before concluding and proposing continuing work

トランジスタ・アレイ方式に基づくアナログレイアウトにおける密度最適化

In integrated circuit design of advanced technology nodes, layout density uniformity significantly influences the manufacturability due to the CMP variability. In analog design, especially, designers are suffering from passing the density checking since there are few useful tools. To tackle this issue, we focus on a transistor-array(TA)-style analog layout, and propose a density optimization algorithm consistent with complicated design rules. Based on TA-style, we introduce a density-aware layout format to explicitly control the layout pattern density, and provide the mathematical optimization approach. Hence, a design flow incorporating our density optimization can drastically reduce the design time with fewer iterations. In a design case of an OPAMP layout in a 65nm CMOS process, the result demonstrates that the proposed approach achieves more than 48× speed-up compared with conventional manual layout, meanwhile, it shows a good circuit performance in the post-layout simulation.北九州市立大

Regular cell design approach considering lithography-induced process variations

The deployment delays for EUVL, forces IC design to continue using 193nm wavelength lithography with innovative and costly techniques in order to faithfully print sub-wavelength features and combat lithography induced process variations. The effect of the lithography gap in current and upcoming technologies is to cause severe distortions due to optical diffraction in the printed patterns and thus degrading manufacturing yield. Therefore, a paradigm shift in layout design is mandatory towards more regular litho-friendly cell designs in order to improve line pattern resolution. However, it is still unclear the amount of layout regularity that can be introduced and how to measure the benefits and weaknesses of regular layouts. This dissertation is focused on searching the degree of layout regularity necessary to combat lithography variability and outperform the layout quality of a design. The main contributions that have been addressed to accomplish this objective are: (1) the definition of several layout design guidelines to mitigate lithography variability; (2) the proposal of a parametric yield estimation model to evaluate the lithography impact on layout design; (3) the development of a global Layout Quality Metric (LQM) including a Regularity Metric (RM) to capture the degree of layout regularity of a layout implementation and; (4) the creation of different layout architectures exploiting the benefits of layout regularity to outperform line-pattern resolution, referred as Adaptive Lithography Aware Regular Cell Designs (ALARCs). The first part of this thesis provides several regular layout design guidelines derived from lithography simulations so that several important lithography related variation sources are minimized. Moreover, a design level methodology, referred as gate biasing, is proposed to overcome systematic layout dependent variations, across-field variations and the non-rectilinear gate effect (NRG) applied to regular fabrics by properly configuring the drawn transistor channel length. The second part of this dissertation proposes a lithography yield estimation model to predict the amount of lithography distortion expected in a printed layout due to lithography hotspots with a reduced set of lithography simulations. An efficient lithography hotspot framework to identify the different layout pattern configurations, simplify them to ease the pattern analysis and classify them according to the lithography degradation predicted using lithography simulations is presented. The yield model is calibrated with delay measurements of a reduced set of identical test circuits implemented in a CMOS 40nm technology and thus actual silicon data is utilized to obtain a more realistic yield estimation. The third part of this thesis presents a configurable Layout Quality Metric (LQM) that considering several layout aspects provides a global evaluation of a layout design with a single score. The LQM can be leveraged by assigning different weights to each evaluation metric or by modifying the parameters under analysis. The LQM is here configured following two different set of partial metrics. Note that the LQM provides a regularity metric (RM) in order to capture the degree of layout regularity applied in a layout design. Lastly, this thesis presents different ALARC designs for a 40nm technology using different degrees of layout regularity and different area overheads. The quality of the gridded regular templates is demonstrated by automatically creating a library containing 266 cells including combinational and sequential cells and synthesizing several ITC'99 benchmark circuits. Note that the regular cell libraries only presents a 9\% area penalty compared to the 2D standard cell designs used for comparison and thus providing area competitive designs. The layout evaluation of benchmark circuits considering the LQM shows that regular layouts can outperform other 2D standard cell designs depending on the layout implementation.Los continuos retrasos en la implementación de la EUVL, fuerzan que el diseño de IC se realice mediante litografía de longitud de onda de 193 nm con innovadoras y costosas técnicas para poder combatir variaciones de proceso de litografía. La gran diferencia entre la longitud de onda y el tamaño de los patrones causa severas distorsiones debido a la difracción óptica en los patrones impresos y por lo tanto degradando el yield. En consecuencia, es necesario realizar un cambio en el diseño de layouts hacia diseños más regulares para poder mejorar la resolución de los patrones. Sin embargo, todavía no está claro el grado de regularidad que se debe introducir y como medir los beneficios y los perjuicios de los diseños regulares. El objetivo de esta tesis es buscar el grado de regularidad necesario para combatir las variaciones de litografía y mejorar la calidad del layout de un diseño. Las principales contribuciones para conseguirlo son: (1) la definición de diversas reglas de diseño de layout para mitigar las variaciones de litografía; (2) la propuesta de un modelo para estimar el yield paramétrico y así evaluar el impacto de la litografía en el diseño de layout; (3) el diseño de una métrica para analizar la calidad de un layout (LQM) incluyendo una métrica para capturar el grado de regularidad de un diseño (RM) y; (4) la creación de diferentes tipos de layout explotando los beneficios de la regularidad, referidos como Adaptative Lithography Aware Regular Cell Designs (ALARCs). La primera parte de la tesis, propone las diversas reglas de diseño para layouts regulares derivadas de simulaciones de litografía de tal manera que las fuentes de variación de litografía son minimizadas. Además, se propone una metodología de diseño para layouts regulares, referida como "gate biasing" para contrarrestar las variaciones sistemáticas dependientes del layout, las variaciones en la ventana de proceso del sistema litográfico y el efecto de puerta no rectilínea para configurar la longitud del canal del transistor correctamente. La segunda parte de la tesis, detalla el modelo de estimación del yield de litografía para predecir mediante un número reducido de simulaciones de litografía la cantidad de distorsión que se espera en un layout impreso debida a "hotspots". Se propone una eficiente metodología que identifica los distintos patrones de un layout, los simplifica para facilitar el análisis de los patrones y los clasifica en relación a la degradación predecida mediante simulaciones de litografía. El modelo de yield se calibra utilizando medidas de tiempo de un número reducido de idénticos circuitos de test implementados en una tecnología CMOS de 40nm y de esta manera, se utilizan datos de silicio para obtener una estimación realista del yield. La tercera parte de este trabajo, presenta una métrica para medir la calidad del layout (LQM), que considera diversos aspectos para dar una evaluación global de un diseño mediante un único valor. La LQM puede ajustarse mediante la asignación de diferentes pesos para cada métrica de evaluación o modificando los parámetros analizados. La LQM se configura mediante dos conjuntos de medidas diferentes. Además, ésta incluye una métrica de regularidad (RM) para capturar el grado de regularidad que se aplica en un diseño. Finalmente, esta disertación presenta los distintos diseños ALARC para una tecnología de 40nm utilizando diversos grados de regularidad y diferentes impactos en área. La calidad de estos diseños se demuestra creando automáticamente una librería de 266 celdas incluyendo celdas combinacionales y secuenciales y, sintetizando diversos circuitos ITC'99. Las librerías regulares solo presentan un 9% de impacto en área comparado con diseños de celdas estándar 2D y por tanto proponiendo diseños competitivos en área. La evaluación de los circuitos considerando la LQM muestra que los diseños regulares pueden mejorar otros diseños 2D dependiendo de la implementación del layout