610 research outputs found

    Development and implementation of automated interferometric microscope for study of MEMS inertial sensors

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    Microelectromechanical systems (MEMS) are quickly becoming ubiquitous in commercial and military applications. As the use of such devices increases their reliability becomes of great importance. Although there has been significant research in the areas of MEMS errors, there is a lack of work regarding long term reliability of packaged systems. Residual thermomechanical stresses might relax over time which affects physical distances within a package, ultimately influencing the performance of a device. One reason that there has not been sufficient work performed on the long-term effects on structures might be the lack of a tool capable of characterizing the effects. MEMS devices have been measured for shape and its changes using interferometric techniques for some time now. Commercially available systems are able to make high resolution measurements, however they might lack loading options. To study aging effects on components a test might need to run continuously for days or weeks, with systematic operations performed throughout the process. Such a procedure is conducive to an automated data acquisition system. A system has been developed at WPI using a Twyman-Green interferometer and a custom software suite. The abilities of this system are demonstrated through analysis performed on MEMS tuning fork gyroscope (TFG) sensors. Specifically, shape is recorded to investigate die bond relaxation as a function of time and thermal cycle. Also presented are measurements made using stroboscopic illumination on operating gyroscopes, in situ. The effect of temperature on the performance of the sensors is investigated using a customized precision rate table

    Improved micro-contact resistance model that considers material deformation, electron transport and thin film characteristics

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    This paper reports on an improved analytic model forpredicting micro-contact resistance needed for designing microelectro-mechanical systems (MEMS) switches. The originalmodel had two primary considerations: 1) contact materialdeformation (i.e. elastic, plastic, or elastic-plastic) and 2) effectivecontact area radius. The model also assumed that individual aspotswere close together and that their interactions weredependent on each other which led to using the single effective aspotcontact area model. This single effective area model wasused to determine specific electron transport regions (i.e. ballistic,quasi-ballistic, or diffusive) by comparing the effective radius andthe mean free path of an electron. Using this model required thatmicro-switch contact materials be deposited, during devicefabrication, with processes ensuring low surface roughness values(i.e. sputtered films). Sputtered thin film electric contacts,however, do not behave like bulk materials and the effects of thinfilm contacts and spreading resistance must be considered. Theimproved micro-contact resistance model accounts for the twoprimary considerations above, as well as, using thin film,sputtered, electric contact

    Evaluation of Pavement Roughness and Vehicle Vibrations for Road Surface Profiling

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    The research explores aspects of road surface measurement and monitoring, targeting some of the main challenges in the field, including cost and portability of high-speed inertial profilers. These challenges are due to the complexities of modern profilers to integrate various sensors while using advanced algorithms and processes to analyse measured sensor data. Novel techniques were proposed to improve the accuracy of road surface longitudinal profiles using inertial profilers. The thesis presents a Half-Wavelength Peak Matching (HWPM) model, designed for inertial profilers that integrate a laser displacement sensor and an accelerometer to evaluate surface irregularities. The model provides an alternative approach to drift correction in accelerometers, which is a major challenge when evaluating displacement from acceleration. The theory relies on using data from the laser displacement sensor to estimate a correction offset for the derived displacement. The study also proposes an alternative technique to evaluating vibration velocity, which improves on computational factors when compared to commonly used methods. The aim is to explore a different dimension to road roughness evaluation, by investigating the effect of surface irregularities on vehicle vibration. The measured samples show that the drift in the displacement calculated from the accelerometer increased as the vehicle speed at which the road measurement was taken increased. As such, the significance of the HWPM model is more apparent at higher vehicle speeds, where the results obtained show noticeable improvements to current techniques. All results and analysis carried out to validate the model are based on real-time data obtained from an inertial profiler that was designed and developed for the research. The profiler, which is designed for portability, scalability and accuracy, provides a Power Over Ethernet (POE) enabled solution to cope with the demand for high data transmission rates.

    Development of MEMS Piezoelectric Vibration Energy Harvesters with Wafer-Level Integrated Tungsten Proof-Mass for Ultra Low Power Autonomous Wireless Sensors

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    La génération d’énergie localisée et à petite échelle, par transformation de l’énergie vibratoire disponible dans l’environnement, est une solution attrayante pour améliorer l’autonomie de certains noeuds de capteurs sans-fil pour l’Internet des objets (IoT). Grâce à des microdispositifs inertiels résonants piézoélectriques, il est possible de transformer l’énergie mécanique en électricité. Cette thèse présente une étude exhaustive de cette technologie et propose un procédé pour fabriquer des microgénérateurs MEMS offrant des performances surpassant l’état de l’art. On présente d’abord une revue complète des limites physiques et technologiques pour identifier le meilleur chemin d’amélioration. En évaluant les approches proposées dans la littérature (géométrie, architecture, matériaux, circuits, etc.), nous suggérons des métriques pour comparer l’état de l’art. Ces analyses démontrent que la limite fondamentale est l’énergie absorbée par le dispositif, car plusieurs des solutions existantes répondent déjà aux autres limites. Pour un générateur linéaire résonant, l’absorption d’énergie dépend donc des vibrations disponibles, mais aussi de la masse du dispositif et de son facteur de qualité. Pour orienter la conception de prototypes, nous avons réalisé une étude sur le potentiel des capteurs autonomes dans une automobile. Nous avons évalué une liste des capteurs présents sur un véhicule pour leur compatibilité avec cette technologie. Nos mesures de vibrations sur un véhicule en marche aux emplacements retenus révèlent que l’énergie disponible pour un dispositif linéaire résonant MEMS se situe entre 30 à 150 Hz. Celui-ci pourrait produire autour de 1 à 10 μW par gramme. Pour limiter la taille d’un générateur MEMS pouvant produire 10 μW, il faut une densité supérieure à celle du silicium, ce qui motive l’intégration du tungstène. L’effet du tungstène sur la sensibilité du dispositif est évident, mais nous démontrons également que l’usage de ce matériau permet de réduire l’impact de l’amortissement fluidique sur le facteur de qualité mécanique Qm. En fait, lorsque l’amortissement fluidique domine, ce changement peut améliorer Qm d’un ordre de grandeur, passant de 103 à 104 dans l’air ambiant. Par conséquent, le rendement du dispositif est amélioré sans utiliser un boîtier sous vide. Nous proposons ensuite un procédé de fabrication qui intègre au niveau de la tranche des masses de tungstène de 500 μm d’épais. Ce procédé utilise des approches de collage de tranches et de gravure humide du métal en deux étapes. Nous présentons chaque bloc de fabrication réalisé pour démontrer la faisabilité du procédé, lequel a permis de fabriquer plusieurs prototypes. Ces dispositifs ont été testés en laboratoire, certains démontrant des performances records en terme de densité de puissance normalisée. Notre meilleur design se démarque par une métrique de 2.5 mW-s-1/(mm3(m/s2)2), soit le meilleur résultat répertorié dans l’état de l’art. Avec un volume de 3.5 mm3, il opère à 552.7 Hz et produit 2.7 μW à 1.6 V RMS à partir d’une accélération de 1 m/s2. Ces résultats démontrent que l’intégration du tungstène dans les microgénérateurs MEMS est très avantageuse et permet de s’approcher davantage des requis des applications réelles.Small scale and localized power generation, using vibration energy harvesting, is considered as an attractive solution to enhance the autonomy of some wireless sensor nodes used in the Internet of Things (IoT). Conversion of the ambient mechanical energy into electricity is most often done through inertial resonant piezoelectric microdevices. This thesis presents an extensive study of this technology and proposes a process to fabricate MEMS microgenerators with record performances compared to the state of the art. We first present a complete review of the physical and technological limits of this technology to asses the best path of improvement. Reported approaches (geometries, architectures, materials, circuits) are evaluated and figures of merit are proposed to compare the state of the art. These analyses show that the fundamental limit is the absorbed energy, as most proposals to date partially address the other limits. The absorbed energy depends on the level of vibrations available, but also on the mass of the device and its quality factor for a linear resonant generator. To guide design of prototypes, we conducted a study on the potential of autonomous sensors in vehicles. A survey of sensors present on a car was realized to estimate their compatibility with energy harvesting technologies. Vibration measurements done on a running vehicle at relevant locations showed that the energy available for MEMS devices is mostly located in a frequency range of 30 to 150 Hz and could generate power in the range of 1-10 μW per gram from a linear resonator. To limit the size of a MEMS generator capable of producing 10 μW, a higher mass density compared to silicon is needed, which motivates the development of a process that incorporates tungsten. Although the effect of tungsten on the device sensitivity is well known, we also demonstrate that it reduces the impact of the fluidic damping on the mechanical quality factor Qm. If fluidic damping is dominant, switching to tungsten can improve Qm by an order of magnitude, going from 103 to 104 in ambient air. As a result, the device efficiency is improved despite the lack of a vacuum package. We then propose a fabrication process flow to integrate 500 μm thick tungsten masses at the wafer level. This process combines wafer bonding with a 2-step wet metal etching approach. We present each of the fabrication nodes realized to demonstrate the feasibility of the process, which led to the fabrication of several prototypes. These devices are tested in the lab, with some designs demonstrating record breaking performances in term of normalized power density. Our best design is noteworthy for its figure of merit that is around 2.5 mW-s-1/(mm3(m/s2)2), which is the best reported in the state of the art. With a volume of 3.5 mm3, it operates at 552.7 Hz and produces 2.7 μW at 1.6 V RMS from an acceleration of 1 m/s2. These results therefore show that tungsten integration in MEMS microgenerators is very advantageous, allowing to reduce the gap with needs of current applications

    Enhancements of MEMS design flow for Automotive and Optoelectronic applications

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    In the latest years we have been witnesses of a very rapidly and amazing grown of MicroElectroMechanical systems (MEMS) which nowadays represent the outstanding state-of-the art in a wide variety of applications from automotive to commercial, biomedical and optical (MicroOptoElectroMechanicalSystems). The increasing success of MEMS is found in their high miniaturization capability, thus allowing an easy integration with electronic circuits, their low manufacturing costs (that comes directly from low unit pricing and indirectly from cutting service and maintaining costs) and low power consumption. With the always growing interest around MEMS devices the necessity arises for MEMS designers to define a MEMS design flow. Indeed it is widely accepted that in any complex engineering design process, a well defined and documented design flow or procedure is vital. The top-level goal of a MEMS/MOEMS design flow is to enable complex engineering design in the shortest time and with the lowest number of fabrication iterations, preferably only one. These two characteristics are the measures of a good flow, because they translate directly to the industry-desirable reductions of the metrics “time to market” and “costs”. Like most engineering flows, the MEMS design flow begins with the product definition that generally involves a feasibility study and the elaboration of the device specifications. Once the MEMS specifications are set, a Finite Element Method (FEM) model is developed in order to study its physical behaviour and to extract the characteristic device parameters. These latter are used to develop a high level MEMS model which is necessary to the design of the sensor read out electronics. Once the MEMS geometry is completely defined and matches the device specifications, the device layout must be generated, and finally the MEMS sensor is fabricated. In order to have a MEMS sensor working according to specifications at first production run is essential that the MEMS design flow is as close as possible to the optimum design flow. The key factors in the MEMS design flow are the development of a sensor model as close as possible to the real device and the layout realization. This research work addresses these two aspects by developing optimized custom tools (a tool for layout check (LVS) and a tool for parasitic capacitances extraction) and new methodologies (a methodology for post layout simulations) which support the designer during the crucial steps of the design process as well as by presenting the models of two cases studies belonging to leading MEMS applications (a micromirror for laser projection system and a control loop for the shock immunity enhancement in gyroscopes for automotive applications)

    Compliant Torsional Micromirrors with Electrostatic Actuation

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    Due to the existence of fabrication tolerance, property drift and structural stiction in MEMS (Micro Electro Mechanical Systems), characterization of their performances through modeling, simulation and testing is essential in research and development. Due to the microscale dimensions, MEMS are more susceptible and sensitive to even minor external or internal variations. Moreover, due to the current limited capability in micro-assembly, most MEMS devices are fabricated as a single integrated micro-mechanical structure composed of two essential parts, namely, mass and spring, even if it may consist of more than one relatively movable part. And in such a scale of dimensions, low resonant micro-structures or compliant MEMS structures are hard to achieve and difficult to survive. Another problem arises from the limited visibility and accessibility necessary for characterization. Both of these issues are thus attempted in this research work. An investigation on micromirrors with various actuations and suspensions is carried out, with more attention on the micromirrors with compliant suspensions, electrostatic actuation and capable of torsional out-of-plane motion due to their distinct advantages such as the low resonance and the low drive voltage. This investigation presents many feasible modeling methods for prediction and analysis, aiming to avoid the costly microfabrication. Furthermore, both linear and nonlinear methods for structure and electrostatics are all included. Thus, static and dynamic performances of the proposed models are formularized and compared with those from FEA (Finite Element Analysis) simulation. The nonlinear modeling methods included in the thesis are Pseudo Rigid Body Model (PRBM) and hybrid PRBM methods for complex framed microstructures consisting of compliant beam members. The micromachining technologies available for the desired micromirrors are reviewed and an SOI wafer based micromachining process is selected for their fabrication. Though the fabrication was executed outside of the institution at that time, the layout designs of the micro-chips for manufacture have included all related rules or factors, and the results have also demonstrated the successful fabrication. Then investigation on non-contact test methods is presented. Laser Doppler Vibrometer (LDV) is utilized for the measurement of dynamic performances of proposed micromirrors. Two kinds of photo-sensing devices (PSDs), namely, the digitized PSD formed by CCD arrays and the analog PSD composed of a monolithic photosensing cell, are used for static test set-ups. An interferometric method using Mirau objective along with microscope is also employed to perform static tests of the selected micromirrors. Comparison of the tested results and their related theoretical results are presented and discussed, leading to a conclusion that the proposed hybrid PRBM model are appropriate for prediction or analysis of compliantly suspended micromirrors including issues arising from fabrication tolerance, structural or other parametric variations

    MME2010 21st Micromechanics and Micro systems Europe Workshop : Abstracts

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    Energy harvesting from human and machine motion for wireless electronic devices

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