Si3N4 photonic integration platform at 1 \ub5m for optical interconnects

Vertical-cavity surface-emitting lasers (VCSELs) are the predominant technology for high-speed short-range interconnects in data centers. Most short-range interconnects rely on GaAs-based multi-mode VCSELs and multi-mode fiber links operating at 850 nm. Recently, GaAs-based high-speed single-mode VCSELs at wavelengths > 1 \ub5m have been demonstrated, which increases the interconnect reach using a single-mode fiber while maintaining low energy dissipation. If a suitable platform for passive wavelength- and space-multiplexing were developed in this wavelength range, this single-mode technology could deliver the multi-Tb/s interconnect capacity that will be required in future data centers. In this work, we show the first passive Si3N4 platform in the 1-\ub5m band (1030-1075 nm) with an equivalent loss < 0.3 dB/cm, which is compatible with the system requirements of high-capacity interconnects. The waveguide structure is optimized to achieve simultaneously single-mode operation and low bending radius, and we demonstrate a wide range of high-performance building blocks, including arrayed waveguide gratings, Mach-Zehnder interferometers, splitters and low-loss fiber interfaces. This technology could be instrumental in scaling up the capacity and reducing the footprint of VCSEL-based optical interconnects and, thanks to the broad transparency in the near-infrared and compatibility with the Yb fiber amplifier window, enabling new applications in other domains as optical microscopy and nonlinear optics

Photonic integration enabling new multiplexing concepts in optical board-to-board and rack-to-rack interconnects

New broadband applications are causing the datacenters to proliferate, raising the bar for higher interconnection speeds. So far, optical board-to-board and rack-to-rack interconnects relied primarily on low-cost commodity optical components assembled in a single package. Although this concept proved successful in the first generations of optical-interconnect modules, scalability is a daunting issue as signaling rates extend beyond 25 Gb/s. In this paper we present our work towards the development of two technology platforms for migration beyond Infiniband enhanced data rate (EDR), introducing new concepts in board-to-board and rack-to-rack interconnects. The first platform is developed in the framework of MIRAGE European project and relies on proven VCSEL technology, exploiting the inherent cost, yield, reliability and power consumption advantages of VCSELs. Wavelength multiplexing, PAM-4 modulation and multi-core fiber (MCF) multiplexing are introduced by combining VCSELs with integrated Si and glass photonics as well as BiCMOS electronics. An in-plane MCF-to-SOI interface is demonstrated, allowing coupling from the MCF cores to 340x400 nm Si waveguides. Development of a low-power VCSEL driver with integrated feed-forward equalizer is reported, allowing PAM-4 modulation of a bandwidth-limited VCSEL beyond 25 Gbaud. The second platform, developed within the frames of the European project PHOXTROT, considers the use of modulation formats of increased complexity in the context of optical interconnects. Powered by the evolution of DSP technology and towards an integration path between inter and intra datacenter traffic, this platform investigates optical interconnection system concepts capable to support 16QAM 40GBd data traffic, exploiting the advancements of silicon and polymer technologies

lOptical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL

Polymer-based integrated optics is attractive for inter-chip optical interconnection applications, for instance, for coupling photonic devices to fibers in high density packaging. In such a hybrid integration scheme, a key challenge is to achieve efficient optical coupling between the photonic chips and waveguides. With the single-mode polymer waveguides, the alignment tolerances become especially critical as compared to the typical accuracies of the patterning processes. We study novel techniques for such coupling requirements. In this paper, we present a waveguide-embedded micro-mirror structure, which can be aligned with high precision, even active alignment method is possible. The structure enables 90 degree bend coupling between a single-mode waveguide and a vertical-emitting/detecting chip, such as, a VCSEL or photodiode, which is embedded under the waveguide layer. Both the mirror structure and low-loss polymer waveguides are fabricated in a process based mainly on the direct-pattern UV nanoimprinting technology and on the use of UV-curable polymeric materials. Fabrication results of the coupling structure with waveguides are presented, and the critical alignment tolerances and manufacturability issues are discussed

High-speed PAM4-based Optical SDM Interconnects with Directly Modulated Long-wavelength VCSEL

This paper reports the demonstration of high-speed PAM-4 transmission using a 1.5-{\mu}m single-mode vertical cavity surface emitting laser (SM-VCSEL) over multicore fiber with 7 cores over different distances. We have successfully generated up to 70 Gbaud 4-level pulse amplitude modulation (PAM-4) signals with a VCSEL in optical back-to-back, and transmitted 50 Gbaud PAM-4 signals over both 1-km dispersion-uncompensated and 10-km dispersion-compensated in each core, enabling a total data throughput of 700 Gbps over the 7-core fiber. Moreover, 56 Gbaud PAM-4 over 1-km has also been shown, whereby unfortunately not all cores provide the required 3.8 $\times$ 10 $^{-3}$ bit error rate (BER) for the 7% overhead-hard decision forward error correction (7% OH HDFEC). The limited bandwidth of the VCSEL and the adverse chromatic dispersion of the fiber are suppressed with pre-equalization based on accurate end-to-end channel characterizations. With a digital post-equalization, BER performance below the 7% OH-HDFEC limit is achieved over all cores. The demonstrated results show a great potential to realize high-capacity and compact short-reach optical interconnects for data centers.Comment: 7 pages, accepted to publication in 'Journal of Lightwave Technology (JLT

Experimental Demonstration of 503.61-Gbit/s DMT over 10-km 7-Core Fiber with 1.5-\mu m SM-VCSEL for Optical Interconnects

We experimentally demonstrate a net-rate 503.61-Gbit/s discrete multitone (DMT) transmission over 10-km 7-core fiber with 1.5-\mu m single mode VCSEL, where low-complexity kernelrecursive-least-squares algorithm is employed for nonlinear channel equalization.Comment: 3 pages, 44th European Conference on Optical Communication (ECOC 2018), Rome, Italy, 201

Spatial division multiplexing for optical data center networks

P

VCSEL and Integration Techniques for Wavelength-Multiplexed Optical Interconnects

GaAs-based vertical-cavity surface-emitting lasers (VCSELs) are dominating short-reach optical interconnects (OIs) due to their high modulation speed, low power consumption, circular output beam and low fabrication cost. Such OIs provide the high bandwidth connectivity needed for interconnecting servers and switches in data centers. With the rapidly increasing use of Internet-based applications and services, higher bandwidth connectivity and higher aggregate capacity VCSEL-based OIs are needed. Until now, this has been achieved mostly through an increase of the lane rate by higher speed VCSELs and higher order modulation formats. Furthermore, spatial-division-multiplexing has proven effective for increasing the aggregate capacity. Much higher capacity can be achieved by multiple wavelengths per fiber, known as wavelength-divisionmultiplexing (WDM). Moreover, smaller footprint and higher bandwidth density WDM transceivers can be built using monolithic multi-wavelength VCSEL arrays with densely spaced VCSELs. This requires a VCSEL technology where the wavelength of individual VCSELs can be precisely set in a post-epitaxial growth fabrication process and a photonic integrated circuit (PIC) for multiplexing and fiber coupling. Flip-chip integration over grating couplers (GCs) is considered for interfacing VCSELs with waveguides on the PIC. In this thesis, an intra-cavity phase tuning technique is demonstrated for setting the resonance wavelength of VCSELs in a monolithic array with an accuracy in spacing of <1 nm. Uniform performance over the array is achieved by spectral matching and balancing of mirror reflectances, optical confinement factor and optical gain. Single transverse and polarization mode VCSELs, as required for flip-chip integration over GCs, with a record output power of 6 mW are also demonstrated.Finally, an investigation of angled flip-chip integration of a VCSEL over a GC on a silicon photonic integrated circuit (Si-PIC) is presented. Dependencies of coupling efficiency and optical feedback on flip-chip angle and size of the VCSEL die are studied using numerical FDTD simulations. Moreover, flip-chip integration of a VCSEL over a GC on a Si-PIC is experimentally demonstrated. The insertion loss from the VCSEL at the input GC to a singlemode fiber, multimode fiber or flip-chip integrated photodetector over the output GC was measured and quantified. The latter forms an on-PIC optical link

III-V-on-silicon photonic devices for optical communication and sensing

In the paper, we review our work on heterogeneous III-V-on-silicon photonic components and circuits for applications in optical communication and sensing. We elaborate on the integration strategy and describe a broad range of devices realized on this platform covering a wavelength range from 850 nm to 3.85 μm