Effects of Humidity on the Electro-Optical-Thermal Characteristics of High-Power LEDs

LEDs are subjected to environments with high moisture in many applications. In this paper, the experiments reveal photometric and colorimetric degradation at high humidity. Corresponding spectral power analysis and parameter extraction indicate that the flip-chip bonded LED samples show accelerated chip failure compared to the conventionally bonded samples. The chip-related failure induces greater heat accumulation, which correlates with the increase in heating power observed in the package. However, the temperature rise and thermal resistance for the flip-chip bonded LEDs do not increase substantially as compared to the conventionally bonded LEDs. This is because the junction temperature can be reduced with a flip-chip die-bonding configuration where the heat generated in the LED chip is dissipated effectively onto the AlN substrate, thereby reducing the increase in temperature rise and thermal resistance. The experimental results are supported by evaluation of the derivative structure functions. In addition, as the thermal resistance of the LED package varies with different humidity levels, there is a need to specify the conditions of humidity in data sheets as LED manufacturers routinely specify a universal thermal resistance value under a fixed operating condition

Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package

Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA).Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions

Electricity from photovoltaic solar cells: Flat-Plate Solar Array Project final Report. Volume III: Silicon sheet: wafers and ribbons

The Flat-Plate Solar Array (FSA) Project, funded by the U.S. Government and managed by the Jet Propulsion Laboratory, was formed in 1975 to develop the module/array technology needed to attain widespread terrestrial use of photovoltaics by 1985. To accomplish this, the FSA Project established and managed an Industry, University, and Federal Government Team to perform the needed research and development. The primary objective of the Silicon Sheet Task of the FSA Project was the development of one or more low-cost technologies for producing silicon sheet suitable for processing into cost-eompetitive solar cells. Silicon sheet refers to high-purity crystalline silicon of size and thickness for fabrication into solar cells. The Task effort began with state-of-the-art sheet technologies and then solicited and supported any new silicon sheet alternatives that had the potential to achieve the Project goals. A total of 48 contracts were awarded that covered work in the areas of ingot growth and casting, wafering, ribbon growth, other sheet technologies, and programs of supportive research. Periodic reviews of each sheet technology were held, assessing the technical progress and the long-range potential. Technologies that failed to achieve their promise, or seemed to have lower probabilities for success in comparison with others, were dropped. A series of workshops was initiated to assess the state of the art, to provide insights into problems remaining to be addressed, and to support technology transfer. The Task made and fostered significant improvements in silicon sheet including processing of both ingot and ribbon technologies. An additional important outcome was the vastly improved understanding of the characteristics associated with high-quality sheet, and the control of the parameters required for higher efficiency solar cells. Although significant sheet cost reductions were made, the technology advancements required to meet the Task cost goals were not achieved. This FSA Final Report (JPL Publication 86-31, 5101-289, DOE/JPL 1012-125, October 1986) is composed of eight volumes, consisting of an Executive Summary and seven technology reports: Volume I: Executive Summary. Volume II: Silicon Material. Volume III: Silicon Sheet: Wafers and Ribbons Volume IV: High-Efficiency Solar Celis. Volume V: Process Development. Volume VI: Engineering Sciences and Reliability. Volume VII: Module Encapsulation. Volume VIII: Project Analysis and Integration. Two supplemental reports included in the final report package are: FSA Project: 10 Years of Progress, JPL Document 400-279. 5101-279, October 1985. Summary of FSA Project Documentation: Abstracts of Published Documents, 1975 to 1986, JPL Publication 82-79 (Revision 1),5101-221, DOE/JPL-1 012-76, September 1986

Thermal Characterization and Lifetime Prediction of LED Boards for SSL Lamp

This work presents a detailed 3-D thermo-mechanical modelling of two LED board technologies to compare their performance. LED board are considered to be used in high power 800 lumen retrofit SSL (Solid State Lighting) lamp. Thermal, mechanical and life time properties are evaluated by numerical modelling. Experimental results measured on fabricated LED board samples are compared to calculated data. Main role of LED board in SSL lamp is to transport heat from LED die to a heat sink and keep the thermal stresses in all layers as low as possible. The work focuses on improving of new LED board thermal management. Moreover, reliability and lifetime of LED board has been inspected by numerical calculation and validated by experiment. Thermally induced stress has been studied for wide temperature range that can affect the LED boards (-40 to +125°C). Numerical modelling of thermal performance, thermal stress distribution and lifetime has been carried out with ANSYS structural analysis where temperature dependent stress-strain material properties have been taken into account. The objective of this study is to improve not only the thermal performance of new LED board, but also identification of potential problems from mechanical fatigue point of view. Accelerated lifetime testing (e.g., mechanical) is carried out in order to study the failure behaviour of current and newly developed LED board

Immuno Magnetic Thermosensitive Liposomes For Cancer Therapy

The present work describes the encapsulation of the drug doxorubicin (DOX) in immuno paramagnetic thermosensitive liposomes. DOX is the most common chemotherapeutic agent for the treatment of a variety of carcinomas. However, the pure drug has high cytotoxicity and therefore requires a targeted and biocompatible delivery system. The introduction includes concepts, modalities, and functionalities of the project. First, a detailed description of the cell type (triple-negative breast cancer) is given. Furthermore, the importance of liposomal doxorubicin is explained and the current state of research is shown. The importance of modification to achieve thermosensitive properties and the procedure for co-encapsulation with Gd chelate to achieve paramagnetic properties is also discussed. In addition, the first part describes the surface modification with ADAM8 antibodies, which leads to improved targeting. The second part of the thesis covers the different materials and methods used in this paper. The production of the liposomes LipTS, LipTS-GD, LipTS-GD-CY, LipTS-GD-CY-MAB and the loading of DOX using an ammonium sulfate gradient method were described in detail. The results part deals with the physicochemical characterization using dynamic light scattering and laser Doppler velocimetry, which confirmed a uniform monodisperse distribution of the liposomes. These properties facilitate the approach of liposomes to target cancer cells. The influence of lipid composition of liposomes, co-encapsulation with Gd chelate and surface modification of liposomes was evaluated and described accordingly. The size and structure of the individual liposomal formulations were determined by atomic force microscopy and transmission electron microscopy. Morphological examination of the liposomes confirmed agreement with the sizes obtained by dynamic light scattering. Temperature-dependent AFM images showed an intact liposome structure at 37 °C, whereas heating by UHF-MRI led to a lipid film indicating the destruction of the lipid bilayer. Furthermore, TEM images showed the morphological properties of the liposomes and gave a more precise indication of how Gd-chelate accumulates within the liposomes. Liposomes with Gd-chelate showed well-separated vesicles, suggesting that Gd- chelate is deposited in the lipid bilayer of the liposomes. Gd was encapsulated in the hydrophilic core whereas chelate was extended into the lipid bilayer. By differential scanning calorimetry and drug release, the heat-sensitive functionality of the liposomes could be determined. Liposomes showed a beginning of phase transition temperature at about 38 °C, which can be achieved by UHF-MRI exposure. The maximum phase transition temperature in the case of LipTS-GD and LipTS-GD-CY-MAB was 42 °C and 40 °C, respectively. A proof of concept study for the thermosensitive properties of liposomes and a time-dependent DOX release profile in hyperthermia was performed. Gd-chelate is encapsulated in both LipTS-GD and LipTS-GD-CY-MAB and led to paramagnetic properties of the liposomes. This facilitates imaging mediated DOX delivery and diagnosis of the solid tumor and metastatic cells. The change in relaxation rate R1 of liposomes was quantified before and after heating above Tm (T> Tm). The relaxivity of the liposomes was obtained from the adapted slope of the relaxation rate against the Gd concentration. Remarkably, the relaxation rate and relaxivity increased after heating the liposomes above Tm (T> Tm), suggesting that the liposomes opened, released Gd chelate, and the exchange of water molecules became faster and more practicable. Toxicity studies describe the different mechanisms for induced DOX toxicity. The increased cytotoxic effect at elevated temperatures showed that the induced toxicity is thermally dependent, i.e. DOX was released from the liposomes. The high viability of the cells at 37 °C indicates that the liposomes were intact at normal physiological temperatures. Under UHF-MRI treatment, cell toxicity due to elevated temperature was observed. The cellular uptake of liposomes under UHF-MRI was followed by a confocal laser scanning microscope. An increase in fluorescence intensity was observed after UHF-MRI exposure. The study of the uptake pathway showed that the majority of liposomes were mainly uptake by clathrin-mediated endocytosis. In addition, the liposomes were modified with anti-ADAM8 antibodies (MAB 1031) to allow targeted delivery. The cellular binding capabilities of surface-modified and non-modified liposomes were tested on cells that had ADAM8 overexpression and on ADAM8 knockdown cells. Surface-modified liposomes showed a significant increase in binding ability, indicating significant targeting against cells that overexpress ADAM8 on their surface. In addition, cells with knockdown ADAM8 could not bind a significant amount of modified liposomes. The biocompatibility of liposomes was assessed using a hemolysis test, which showed neglected hemolytic potential and an activated thromboplastin time (aPTT), where liposomes showed minimal interference with blood clotting. Hemocompatibility studies may help to understand the correlation between in vitro and in vivo. The chorioallantois model was used in ovo to evaluate systematic biocompatibility in an alternative animal model. In the toxicity test, liposomes were injected intravenously into the chicken embryo. The liposomes showed a neglectable harmful effect on embryo survival. While free DOX has a detrimental effect on the survival of chicken embryos, this confirms the safety profile of liposomes compared to free DOX. LipTS-GD-CY-MAB were injected into the vascular system of the chicken embryo on egg development day 11 and scanned under UHF-MRI to evaluate the magnetic properties of the liposomes in a biological system with T2-weighted images (3D). The liposomal formulation had distinct magnetic properties under UHF MRI and the chick survived the scan. In summary, immunomagnetic heat-sensitive liposomes are a novel drug for the treatment of TNBC. It is used both for the diagnosis and therapy of solid and metastasizing tumors without side effects on the neighboring tissue. Furthermore, a tumor in the CAM model will be established. Thereafter, the selective targeting of the liposomes will be visualized and quantitated using fluorescence and UHF-MRI. Liposomes are yet to be tested on mice as a xenograft triple-negative breast cancer model, in which further investigation on the effect of DOX-LipTS-GD-CY-MAB is evaluated. On one hand, the liposomes will be evaluated regarding their targetability and their selective binding. On the other hand, the triggered release of DOX from the liposomes after UHF-MRI exposure will be quantitated, as well as evaluate the DOX-Liposomes therapeutic effect on the tumor

Viscoplastic behavior of diamond die attach subjected to high temperature conditions

In power electronic applications, diamond based semi-conductors appears to be a new way to widely increase the capabilities of power electronic converters. The main prospective expected is an increasing in system integration and power capabilities. The Diamonix project concerns the elaboration of a single-crystal diamond substrate with electronic quality and its associated packaging. The designed structure has to resist to temperatures varying between -50°C and +300°C. This paper deals with an experimental and numerical study of the diamond die attach solution. The development of a packaging for diamond component relies in particular on a specific choice of solder’s alloys for the junction die/substrate. To carry out this junction, AuGe and AlSi eutectic alloys were chosen and characterized; the choice of these two kinds of solders i.e. AuGe and AlSi is motivated by the practical elaboration process and the restrictions of hazardous substances (RoHS). The first solder has a melting temperature of 356°C; the second has a higher melting point of 577°C. In this paper, we present some numerical results obtained from FE simulations of two 2D configurations of simplified electronic packaging. The power electronic packaging is composed of a diamond die and a copper metallized Si3N4 ceramic substrate which are brazed together with either AuGe or AlSi solder alloy. To predict the thermomechanical behavior of the solders, a particular constitutive behavior law was implemented as a User MATerial subroutine which is based on a viscoplastic unified McDowell formulation, coupled with porous damage equations. The mechanical law can describe precisely the viscoplastic damage phenomenon of solder subjected to high thermal cycling and to optimize the thermo-mechanical modeling for advanced package developmen

A design-for-casting integrated approach based on rapid simulation and modulus criterion

This paper presents a new approach to the design of cast components and their associated tools. The current methodology is analysed through a case study and its main disadvantages underlined. Then, in order to overcome these identified drawbacks, a new approach is proposed. Knowing that this approach is mainly based on a rapid simulation of the process, basics of a simplified physical model of solidification are presented as well as an associated modulus criterion. Finally, technical matters for a software prototype regarding the implementation of this Rapid Simulation Approach (RSA) in a CAD environment are detailed

Hyperthermia combined with chemotherapy - Biological rationale, clinical application, and treatment results

There is substantial evidence from preclinical data that the antitumor cytotoxicity of selected chemotherapeutic agents either alone or combined with radiation can be enhanced by appropriate heat exposure (40-44 degrees C) of cells or tumor tissues. Based upon these results the integration of hyperthermia as an additional treatment modality, given simultaneously with systemic chemotherapy or in combination with radiochemotherapy, is currently tested at the clinic. Regional hyperthermia combined with chemotherapy or radiochemotherapy showed impressive results (phase II studies) at clinical relevant temperatures in locally advanced tumors of different entities in terms of objective response rate, local tumor control and relapse-free survival. Clinical protocols of well-designed phase III trials on combined treatment modalities integrating hyperthermia are rather limited but for some tumors confirm its clinical benefit. In general, the clinical approach to use hyperthermia has gained much more interest within in the field of medical oncology. One of the major reason is the substantial technical improvements made with the available commercial equipment for local or regional heating, especially in case of deep-seated lesions or systemic heating. Further testing of the potential of hyperthermia combined with chemotherapy or radiochemotherapy in prospective randomized trials are warranted. At this time, hyperthermia as an adjunct to conventional treatment strategies is recommended in the setting of clinical protocols. The results of prospective trials should answer the question for which types of local advanced or metastatic tumors hyperthermia becomes standard as part of a multi-modal treatment strategy

On Mitigation of Side-Channel Attacks in 3D ICs: Decorrelating Thermal Patterns from Power and Activity

Various side-channel attacks (SCAs) on ICs have been successfully demonstrated and also mitigated to some degree. In the context of 3D ICs, however, prior art has mainly focused on efficient implementations of classical SCA countermeasures. That is, SCAs tailored for up-and-coming 3D ICs have been overlooked so far. In this paper, we conduct such a novel study and focus on one of the most accessible and critical side channels: thermal leakage of activity and power patterns. We address the thermal leakage in 3D ICs early on during floorplanning, along with tailored extensions for power and thermal management. Our key idea is to carefully exploit the specifics of material and structural properties in 3D ICs, thereby decorrelating the thermal behaviour from underlying power and activity patterns. Most importantly, we discuss powerful SCAs and demonstrate how our open-source tool helps to mitigate them.Comment: Published in Proc. Design Automation Conference, 201

Thermal measurement and modeling of multi-die packages

Thermal measurement and modeling of multi-die packages became a hot topic recently in different fields like RAM chip packaging or LEDs / LED assemblies, resulting in vertical (stacked) and lateral arrangement. In our present study we show results for a mixed arrangement: an opto-coupler device has been investigated with 4 chips in lateral as well as vertical arrangement. In this paper we give an overview of measurement and modeling techniques and results for stacked and MCM structures, describe our present measurement results together with our structure function based methodology of validating the detailed model of the package being studied. Also, we show how to derive junction-to-pin thermal resistances with a technique using structure functions.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions