Modeling Solder Ball Array Interconnects for Power Module Optimization

PowerSynth is a software platform that can co-optimize power modules utilizing a 2D topology and wire bond interconnects. The novel 3D architectures being proposed at the University of Arkansas utilize solder ball interconnects instead of wire bonds. Therefore, they currently cannot be optimized using PowerSynth. This paper examines methods to accurately model the parasitic inductance of solder balls and ball grid arrays so they may be implemented into software for optimization. Proposed mathematical models are validated against ANSYS Electromagnetics Suite simulations. A comparison of the simulated data shows that mathematical models are well suited for implementation into optimization software platforms. Experimental measurements proved to be inconclusive and necessitate future work

Statistical Power Supply Dynamic Noise Prediction in Hierarchical Power Grid and Package Networks

One of the most crucial high performance systems-on-chip design challenge is to front their power supply noise sufferance due to high frequencies, huge number of functional blocks and technology scaling down. Marking a difference from traditional post physical-design static voltage drop analysis, /a priori dynamic voltage drop/evaluation is the focus of this work. It takes into account transient currents and on-chip and package /RLC/ parasitics while exploring the power grid design solution space: Design countermeasures can be thus early defined and long post physical-design verification cycles can be shortened. As shown by an extensive set of results, a carefully extracted and modular grid library assures realistic evaluation of parasitics impact on noise and facilitates the power network construction; furthermore statistical analysis guarantees a correct current envelope evaluation and Spice simulations endorse reliable result

Accurate a priori signal integrity estimation using a multilevel dynamic interconnect model for deep submicron VLSI design.

A multilevel dynamic interconnect model was derived for accurate a priori signal integrity estimates. Cross-talk and delay estimations over interconnects in deep submicron technology were analyzed systematically using this model. Good accuracy and excellent time-efficiency were found compared with electromagnetic simulations. We aim to build a dynamic interconnect library with this model to facilitate the interconnect issues for future VLSI design

Embedded passive components for improved power plane decoupling

In this paper, a detailed power integrity study is described that compares the behavior of surface-mount devices and embedded components for power decoupling. Through measurements and simulations, it is found that when the layer count of the board is low, there is no significant difference between both technologies. When the number of layers increases, the short connection for the embedded components is clearly superior to the surface-mount capacitor. The resonance frequencies for the embedded capacitor do not change significantly with the increased layer count. The case with the surface-mount capacitor however, shows a large increase in parasitic inductance due to the long vias through the board

Equivalent Circuit Model of High-Performance VCSELs

In this work, a general equivalent circuit model based on the carrier reservoir splitting approach in high-performance multi-mode vertical-cavity surface-emitting lasers (VCSELs) is presented. This model accurately describes the intrinsic dynamic behavior of these VCSELs for the case where the lasing modes do not share a common carrier reservoir. Moreover, this circuit model is derived from advanced multi-mode rate equations that take into account the effect of spatial hole-burning, gain compression, and inhomogeneity in the carrier distribution between the lasing mode ensembles. The validity of the model is confirmed through simulation of the intrinsic modulation response of these lasers.DFG, 43659573, SFB 787: Halbleiter - Nanophotonik: Materialien, Modelle, BauelementeDFG, 414044773, Open Access Publizieren 2019 - 2020 / Technische Universität Berli