Delay Measurements and Self Characterisation on FPGAs

This thesis examines new timing measurement methods for self delay characterisation of Field-Programmable Gate Arrays (FPGAs) components and delay measurement of complex circuits on FPGAs. Two novel measurement techniques based on analysis of a circuit's output failure rate and transition probability is proposed for accurate, precise and efficient measurement of propagation delays. The transition probability based method is especially attractive, since it requires no modifications in the circuit-under-test and requires little hardware resources, making it an ideal method for physical delay analysis of FPGA circuits. The relentless advancements in process technology has led to smaller and denser transistors in integrated circuits. While FPGA users benefit from this in terms of increased hardware resources for more complex designs, the actual productivity with FPGA in terms of timing performance (operating frequency, latency and throughput) has lagged behind the potential improvements from the improved technology due to delay variability in FPGA components and the inaccuracy of timing models used in FPGA timing analysis. The ability to measure delay of any arbitrary circuit on FPGA offers many opportunities for on-chip characterisation and physical timing analysis, allowing delay variability to be accurately tracked and variation-aware optimisations to be developed, reducing the productivity gap observed in today's FPGA designs. The measurement techniques are developed into complete self measurement and characterisation platforms in this thesis, demonstrating their practical uses in actual FPGA hardware for cross-chip delay characterisation and accurate delay measurement of both complex combinatorial and sequential circuits, further reinforcing their positions in solving the delay variability problem in FPGAs

One way Doppler extractor. Volume 1: Vernier technique

A feasibility analysis, trade-offs, and implementation for a One Way Doppler Extraction system are discussed. A Doppler error analysis shows that quantization error is a primary source of Doppler measurement error. Several competing extraction techniques are compared and a Vernier technique is developed which obtains high Doppler resolution with low speed logic. Parameter trade-offs and sensitivities for the Vernier technique are analyzed, leading to a hardware design configuration. A detailed design, operation, and performance evaluation of the resulting breadboard model is presented which verifies the theoretical performance predictions. Performance tests have verified that the breadboard is capable of extracting Doppler, on an S-band signal, to an accuracy of less than 0.02 Hertz for a one second averaging period. This corresponds to a range rate error of no more than 3 millimeters per second

Sincronização em sistemas integrados a alta velocidade

Doutoramento em Engenharia ElectrotécnicaA distribui ção de um sinal relógio, com elevada precisão espacial (baixo skew) e temporal (baixo jitter ), em sistemas sí ncronos de alta velocidade tem-se revelado uma tarefa cada vez mais demorada e complexa devido ao escalonamento da tecnologia. Com a diminuição das dimensões dos dispositivos e a integração crescente de mais funcionalidades nos Circuitos Integrados (CIs), a precisão associada as transições do sinal de relógio tem sido cada vez mais afectada por varia ções de processo, tensão e temperatura. Esta tese aborda o problema da incerteza de rel ogio em CIs de alta velocidade, com o objetivo de determinar os limites do paradigma de desenho sí ncrono. Na prossecu ção deste objectivo principal, esta tese propõe quatro novos modelos de incerteza com âmbitos de aplicação diferentes. O primeiro modelo permite estimar a incerteza introduzida por um inversor est atico CMOS, com base em parâmetros simples e su cientemente gen éricos para que possa ser usado na previsão das limitações temporais de circuitos mais complexos, mesmo na fase inicial do projeto. O segundo modelo, permite estimar a incerteza em repetidores com liga ções RC e assim otimizar o dimensionamento da rede de distribui ção de relógio, com baixo esfor ço computacional. O terceiro modelo permite estimar a acumula ção de incerteza em cascatas de repetidores. Uma vez que este modelo tem em considera ção a correla ção entre fontes de ruí do, e especialmente util para promover t ecnicas de distribui ção de rel ogio e de alimentação que possam minimizar a acumulação de incerteza. O quarto modelo permite estimar a incerteza temporal em sistemas com m ultiplos dom ínios de sincronismo. Este modelo pode ser facilmente incorporado numa ferramenta autom atica para determinar a melhor topologia para uma determinada aplicação ou para avaliar a tolerância do sistema ao ru ído de alimentação. Finalmente, usando os modelos propostos, são discutidas as tendências da precisão de rel ogio. Conclui-se que os limites da precisão do rel ogio são, em ultima an alise, impostos por fontes de varia ção dinâmica que se preveem crescentes na actual l ogica de escalonamento dos dispositivos. Assim sendo, esta tese defende a procura de solu ções em outros ní veis de abstração, que não apenas o ní vel f sico, que possam contribuir para o aumento de desempenho dos CIs e que tenham um menor impacto nos pressupostos do paradigma de desenho sí ncrono.Distributing a the clock simultaneously everywhere (low skew) and periodically everywhere (low jitter) in high-performance Integrated Circuits (ICs) has become an increasingly di cult and time-consuming task, due to technology scaling. As transistor dimensions shrink and more functionality is packed into an IC, clock precision becomes increasingly a ected by Process, Voltage and Temperature (PVT) variations. This thesis addresses the problem of clock uncertainty in high-performance ICs, in order to determine the limits of the synchronous design paradigm. In pursuit of this main goal, this thesis proposes four new uncertainty models, with di erent underlying principles and scopes. The rst model targets uncertainty in static CMOS inverters. The main advantage of this model is that it depends only on parameters that can easily be obtained. Thus, it can provide information on upcoming constraints very early in the design stage. The second model addresses uncertainty in repeaters with RC interconnects, allowing the designer to optimise the repeater's size and spacing, for a given uncertainty budget, with low computational e ort. The third model, can be used to predict jitter accumulation in cascaded repeaters, like clock trees or delay lines. Because it takes into consideration correlations among variability sources, it can also be useful to promote oorplan-based power and clock distribution design in order to minimise jitter accumulation. A fourth model is proposed to analyse uncertainty in systems with multiple synchronous domains. It can be easily incorporated in an automatic tool to determine the best topology for a given application or to evaluate the system's tolerance to power-supply noise. Finally, using the proposed models, this thesis discusses clock precision trends. Results show that limits in clock precision are ultimately imposed by dynamic uncertainty, which is expected to continue increasing with technology scaling. Therefore, it advocates the search for solutions at other abstraction levels, and not only at the physical level, that may increase system performance with a smaller impact on the assumptions behind the synchronous design paradigm

Precise Timing of Digital Signals: Circuits and Applications

With the rapid advances in process technologies, the performance of state-of-the-art integrated circuits is improving steadily. The drive for higher performance is accompanied with increased emphasis on meeting timing constraints not only at the design phase but during device operation as well. Fortunately, technology advancements allow for even more precise control of the timing of digital signals, an advantage which can be used to provide solutions that can address some of the emerging timing issues. In this thesis, circuit and architectural techniques for the precise timing of digital signals are explored. These techniques are demonstrated in applications addressing timing issues in modern digital systems. A methodology for slow-speed timing characterization of high-speed pipelined datapaths is proposed. The technique uses a clock-timing circuit to create shifted versions of a slow-speed clock. These clocks control the data flow in the pipeline in the test mode. Test results show that the design provides an average timing resolution of 52.9ps in 0.18μm CMOS technology. Results also demonstrate the ability of the technique to track the performance of high-speed pipelines at a reduced clock frequency and to test the clock-timing circuit itself. In order to achieve higher resolutions than that of an inverter/buffer stage, a differential (vernier) delay line is commonly used. To allow for the design of differential delay lines with programmable delays, a digitally-controlled delay-element is proposed. The delay element is monotonic and achieves a high degree of transfer characteristics' (digital code vs. delay) linearity. Using the proposed delay element, a sub-1ps resolution is demonstrated experimentally in 0.18μm CMOS. The proposed delay element with a fixed delay step of 2ps is used to design a high-precision all-digital phase aligner. High-precision phase alignment has many applications in modern digital systems such as high-speed memory controllers, clock-deskew buffers, and delay and phase-locked loops. The design is based on a differential delay line and a variation tolerant phase detector using redundancy. Experimental results show that the phase aligner's range is from -264ps to +247ps which corresponds to an average delay step of approximately 2.43ps. For various input phase difference values, test results show that the difference is reduced to less than 2ps at the output of the phase aligner. On-chip time measurement is another application that requires precise timing. It has applications in modern automatic test equipment and on-chip characterization of jitter and skew. In order to achieve small conversion time, a flash time-to-digital converter is proposed. Mismatch between the various delay comparators limits the time measurement precision. This is demonstrated through an experiment in which a 6-bit, 2.5ps resolution flash time-to-digital converter provides an effective resolution of only 4-bits. The converter achieves a maximum conversion rate of 1.25GSa/s

Analysis of variation in on-chip waveguide distribution schemes and optical receiver circuits

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2006.Page 103 blank.Includes bibliographical references (p. 99-102).Recently, optical interconnect has emerged as a possible alternative to electrical interconnect at chip-to-chip and on-chip length scales because of its potential to overcome power, delay, and bandwidth limitations of traditional electrical interconnect. This thesis examines the issues of variation involved in the implementation of a robust on-chip optical signal distribution network. First, the variation within the on-chip waveguide network is analyzed in terms of susceptibility to lithographic uncertainties and refractive index variations. Then, the robustness of an ultrashort pulse-based receiver circuit architecture is analyzed. Some variation sources considered are optical input power variation, load capacitance variation, parasitic capacitive coupling, and power supply noise. Simulation results show that, for both the passive waveguide network and the optical receiver circuit, variation can result in clock skew and jitter, which limit the frequencies at which the distribution network can operate. The impact of technology scaling on the optical receiver circuit architecture is assessed with respect to variation. The robustness of the optical network is compared with that of an all-electrical signal distribution network.(cont.) Results indicate, for the optical signal distribution network, that a trade-off exists between power consumption and robustness towards most sources of variation. In addition, the ultrashort pulse-based receiver circuit design demonstrates robustness towards many variation sources in the presence of technology scaling. The existence of variation in reasonable amounts will not obstruct the functionality of the receiver circuit. However, additional measures must be taken to minimize power supply variation and parasitic capacitive coupling, which will have a greater impact on robustness in future technology nodes.by Karthik Balakrishnan.S.M

Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations

Three-dimensional (3-D) integration is a promising solution to further enhance the density and performance of modern integrated circuits (ICs). In 3-D ICs, multiple dies (tiers or planes) are vertically stacked. These dies can be designed and fabricated separately. In addition, these dies can be fabricated in different technologies. The effect of different sources of variations on 3-D circuits, consequently, differ from 2-D ICs. As technology scales, these variations significantly affect the performance of circuits. Therefore, it is increasingly important to accurately and efficiently model different sources of variations in 3-D ICs. The process, voltage, and temperature variations in 3-D ICs are investigated in this dissertation. Related modeling and design techniques are proposed to design a robust 3-D IC. Process variations in 3-D ICs are first analyzed. The effect of process variations on synchronization and 3-D clock distribution networks, is carefully studied. A novel statistical model is proposed to describe the timing variation in 3-D clock distribution networks caused by process variations. Based on this model, different topologies of 3-D clock distribution networks are compared in terms of skew variation. A set of guidelines is proposed to design 3-D clock distribution networks with low clock uncertainty. Voltage variations are described by power supply noise. Power supply noise in 3-D ICs is investigated considering different characteristics of potential 3-D power grids in this thesis. A new algorithm is developed to fast analyze the steady-state IR-drop in 3-D power grids. The first droop of power supply noise, also called resonant supply noise, is usually the deepest voltage drop in power distribution networks. The effect of resonant supply noise on 3-D clock distribution networks is investigated. The combined effect of process variations and power supply noise is modeled by skitter consisting of both skew and jitter. A novel statistical model of skitter is proposed. Based on this proposed model and simulation results, a set of guidelines has been proposed to mitigate the negative effect of process and voltage variations on 3-D clock distribution networks. Thermal issues in 3-D ICs are considered by carefully modeling thermal through silicon vias (TTSVs) in this dissertation. TTSVs are vertical vias which do not carry signals, dedicated to facilitate the propagation of heat to reduce the temperature of 3-D ICs. Two analytic models are proposed to describe the heat transfer in 3-D circuits related to TTSVs herein, providing proper closed-form expressions for the thermal resistance of the TTSVs. The effect of different physical and geometric parameters of TTSVs on the temperature of 3-D ICs is analyzed. The proposed models can be used to fast and accurately estimate the temperature to avoid the overuse of TTSVs occupying a large portion of area. A set of models and design techniques is proposed in this dissertation to describe and mitigate the deleterious effects of process, voltage, and temperature variations in 3-D ICs. Due to the continuous shrink in the feature size of transistors, the large number of devices within one circuit, and the high operating frequency, the effect of these variations on the performance of 3-D ICs becomes increasingly significant. Accurately and efficiently estimating and controlling these variations are, consequently, critical tasks for the design of 3-D ICs

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

통계적 주파수 검출기 기반 기준 주파수를 사용하지 않는 클록 및 데이터 복원 회로의 설계 방법론

학위논문(박사) -- 서울대학교대학원 : 공과대학 전기·정보공학부, 2022. 8. 정덕균.In this thesis, a design of a high-speed, power-efficient, wide-range clock and data recovery (CDR) without a reference clock is proposed. A frequency acquisition scheme using a stochastic frequency detector (SFD) based on the Alexander phase detector (PD) is utilized for the referenceless operation. Pat-tern histogram analysis is presented to analyze the frequency acquisition behavior of the SFD and verified by simulation. Based on the information obtained by pattern histogram analysis, SFD using autocovariance is proposed. With a direct-proportional path and a digital integral path, the proposed referenceless CDR achieves frequency lock at all measurable conditions, and the measured frequency acquisition time is within 7μs. The prototype chip has been fabricated in a 40-nm CMOS process and occupies an active area of 0.032 mm2. The proposed referenceless CDR achieves the BER of less than 10-12 at 32 Gb/s and exhibits an energy efficiency of 1.15 pJ/b at 32 Gb/s with a 1.0 V supply.본 논문은 기준 클럭이 없는 고속, 저전력, 광대역으로 동작하는 클럭 및 데이터 복원회로의 설계를 제안한다. 기준 클럭이 없는 동작을 위해서 알렉산더 위상 검출기에 기반한 통계적 주파수 검출기를 사용하는 주파수 획득 방식이 사용된다. 통계적 주파수 검출기의 주파수 추적 양상을 분석하기 위해 패턴 히스토그램 분석 방법론을 제시하였고 시뮬레이션을 통해 검증하였다. 패턴 히스토그램 분석을 통해 얻은 정보를 바탕으로 자기공분산을 이용한 통계적 주파수 검출기를 제안한다. 직접 비례 경로와 디지털 적분 경로를 통해 제안된 기준 클럭이 없는 클럭 및 데이터 복원회로는 모든 측정 가능한 조건에서 주파수 잠금을 달성하는 데 성공하였고, 모든 경우에서 측정된 주파수 추적 시간은 7μs 이내이다. 40-nm CMOS 공정을 이용하여 만들어진 칩은 0.032 mm2의 면적을 차지한다. 제안하는 클럭 및 데이터 복원회로는 32 Gb/s의 속도에서 비트에러율 10-12 이하로 동작하였고, 에너지 효율은 32Gb/s의 속도에서 1.0V 공급전압을 사용하여 1.15 pJ/b을 달성하였다.CHAPTER 1 INTRODUCTION 1 1.1 MOTIVATION 1 1.2 THESIS ORGANIZATION 13 CHAPTER 2 BACKGROUNDS 14 2.1 CLOCKING ARCHITECTURES IN SERIAL LINK INTERFACE 14 2.2 GENERAL CONSIDERATIONS FOR CLOCK AND DATA RECOVERY 24 2.2.1 OVERVIEW 24 2.2.2 JITTER 26 2.2.3 CDR JITTER CHARACTERISTICS 33 2.3 CDR ARCHITECTURES 39 2.3.1 PLL-BASED CDR – WITH EXTERNAL REFERENCE CLOCK 39 2.3.2 DLL/PI-BASED CDR 44 2.3.3 PLL-BASED CDR – WITHOUT EXTERNAL REFERENCE CLOCK 47 2.4 FREQUENCY ACQUISITION SCHEME 50 2.4.1 TYPICAL FREQUENCY DETECTORS 50 2.4.1.1 DIGITAL QUADRICORRELATOR FREQUENCY DETECTOR 50 2.4.1.2 ROTATIONAL FREQUENCY DETECTOR 54 2.4.2 PRIOR WORKS 56 CHAPTER 3 DESIGN OF THE REFERENCELESS CDR USING SFD 58 3.1 OVERVIEW 58 3.2 PROPOSED FREQUENCY DETECTOR 62 3.2.1 MOTIVATION 62 3.2.2 PATTERN HISTOGRAM ANALYSIS 68 3.2.3 INTRODUCTION OF AUTOCOVARIANCE TO STOCHASTIC FREQUENCY DETECTOR 75 3.3 CIRCUIT IMPLEMENTATION 83 3.3.1 IMPLEMENTATION OF THE PROPOSED REFERENCELESS CDR 83 3.3.2 CONTINUOUS-TIME LINEAR EQUALIZER (CTLE) 85 3.3.3 DIGITALLY-CONTROLLED OSCILLATOR (DCO) 87 3.4 MEASUREMENT RESULTS 89 CHAPTER 4 CONCLUSION 99 APPENDIX A DETAILED FREQUENCY ACQUISITION WAVEFORMS OF THE PROPOSED SFD 100 BIBLIOGRAPHY 108 초 록 122박

Radiation Hardened by Design Methodologies for Soft-Error Mitigated Digital Architectures

abstract: Digital architectures for data encryption, processing, clock synthesis, data transfer, etc. are susceptible to radiation induced soft errors due to charge collection in complementary metal oxide semiconductor (CMOS) integrated circuits (ICs). Radiation hardening by design (RHBD) techniques such as double modular redundancy (DMR) and triple modular redundancy (TMR) are used for error detection and correction respectively in such architectures. Multiple node charge collection (MNCC) causes domain crossing errors (DCE) which can render the redundancy ineffectual. This dissertation describes techniques to ensure DCE mitigation with statistical confidence for various designs. Both sequential and combinatorial logic are separated using these custom and computer aided design (CAD) methodologies. Radiation vulnerability and design overhead are studied on VLSI sub-systems including an advanced encryption standard (AES) which is DCE mitigated using module level coarse separation on a 90-nm process with 99.999% DCE mitigation. A radiation hardened microprocessor (HERMES2) is implemented in both 90-nm and 55-nm technologies with an interleaved separation methodology with 99.99% DCE mitigation while achieving 4.9% increased cell density, 28.5 % reduced routing and 5.6% reduced power dissipation over the module fences implementation. A DMR register-file (RF) is implemented in 55 nm process and used in the HERMES2 microprocessor. The RF array custom design and the decoders APR designed are explored with a focus on design cycle time. Quality of results (QOR) is studied from power, performance, area and reliability (PPAR) perspective to ascertain the improvement over other design techniques. A radiation hardened all-digital multiplying pulsed digital delay line (DDL) is designed for double data rate (DDR2/3) applications for data eye centering during high speed off-chip data transfer. The effect of noise, radiation particle strikes and statistical variation on the designed DDL are studied in detail. The design achieves the best in class 22.4 ps peak-to-peak jitter, 100-850 MHz range at 14 pJ/cycle energy consumption. Vulnerability of the non-hardened design is characterized and portions of the redundant DDL are separated in custom and auto-place and route (APR). Thus, a range of designs for mission critical applications are implemented using methodologies proposed in this work and their potential PPAR benefits explored in detail.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

A Low Jitter Analog Circuit for Precisely Correcting Timing Skews in Time Interleaved Analog-to-Digital Converters

Time-interleaved analog-to-digital converters are an attractive architecture for achieving a high speed, high resolution ADC in a power efficient manner. However, due to process and manufacturing variations, timing skews occur between the sampling clocks of the sub ADCs within the TI-ADC. These timing skews compromise the spurious free dynamic range of the converter. In addition, jitter on the sampling clocks, degrades the signal-to-noise ratio of the TI-ADC. Therefore, in order to maintain an acceptable spurious free dynamic range and signal to noise ratio, it is necessary to correct the timing skews while adding minimal jitter. Two analog-based architectures for correcting timing skews were investigated, with one being selected for implementation. The selected architecture and additional test circuitry were designed and fabricated in a 0.18µm CMOS process and tested using a 125 MSPS 16 bit ADC. The circuit achieves a correction precision on the order of 10’s of femtoseconds for timing skews as large as approximately 180 picoseconds, while adding less than 200 femtoseconds of rms jitter