Eigenmode-based capacitance calculations with applications in passivation layer design

The design of high-speed metallic interconnects such as microstrips requires the correct characterization of both the conductors and the surrounding dielectric environment, in order to accurately predict their propagation characteristics. A fast boundary integral equation approach is obtained by modeling all materials as equivalent surface charge densities in free space. The capacitive behavior of a finite dielectric environment can then be determined by means of a transformation matrix, relating these charge densities to the boundary value of the electric potential. In this paper, a new calculation method is presented for the important case that the dielectric environment is composed of homogeneous rectangles. The method, based on a surface charge expansion in terms of the Robin eigenfunctions of the considered rectangles, is not only more efficient than traditional methods, but is also more accurate, as shown in some numerical experiments. As an application, the design and behavior of a microstrip passivation layer is treated in some detail

On a Semianalytic Approach for Capacitance Calculation of Interconnects in High Speed Integrated Circuits

This paper describes a fast and accurate semi-analytical procedure for determining capacitance and inductance of multilayer structures with multiple conductors with zero thickness in the top layer. The technique uses the quasi-analytic electrostatic Greens function of multilayer structures, which is integrated to a series expansion valid for uniform charge distributions. The quasi-analytical evaluation of the entries of the Galerkin matrix leads to a very efficient and accurate computer code. Computed results are given for some cases of integrated circuit interconnects to show the advantages and simplicity of our procedure as compared to the methods available in the literature

Finite Element Analysis of Unshielded Four Conductors with Three Levels Systems for Integrated-circuit Interconnects

In this paper an attempt has been made to design and analyze integrated circuit interconnects for unshielded four conductors with three levels systems using Finite Element Method (FEM). We illustrate that FEM is as accurate and effective for modeling multilayered multiconductor transmission lines in strongly inhomogeneous media. We mainly focus on designing of two electrostatic models of unshielded four interconnected lines with three levels system. We computed the capacitance and inductance matrices for these configurations. Also, we determine the quasi-static spectral for the potential distribution of the integrated circuits. DOI: 10.17762/ijritcc2321-8169.150712

3D Capacitance Extraction With the Method of Moments

In this thesis, the Method of Moments has been applied to calculate capacitance between two arbitrary 3D metal conductors or a capacitance matrix for a 3D multi-conductor system. Capacitance extraction has found extensive use for systems involving sets of long par- allel transmission lines in multi-dielectric environment as well as integrated circuit package including three-dimensional conductors located on parallel planes. This paper starts by reviewing fundamental aspects of transient electro-magnetics followed by the governing dif- ferential and integral equations to motivate the application of numerical methods as Method of Moments(MoM), Finite Element Method(FEM), etc. Among these numerical tools, the surface-based integral-equation methodology - MoM is ideally suited to address the prob- lem. It leads to a well-conditioned system with reduced size, as compared to volumetric methods. In this dissertation, the MoM Surface Integral Equation (SIE)-based modeling approach is developed to realize electrostatic capacitance extraction for 3D geometry. MAT- LAB is employed to validate its e?ciency and e?ectiveness along with design of a friendly GUI. As a base example, a parallel-plate capacitor is considered. We evaluate the accu- racy of the method by comparison with FEM simulations as well as the corresponding quasi-analytical solution. We apply this method to the parallel-plate square capacitor and demonstrate how far could the undergraduate result 0C = A ? =d\u27 be from reality. For the completion of the solver, the same method is applied to the calculation of line capacitance for two- and multi-conductor 2D transmission lines

Finite Element Approach for Coupled Striplines Embedded in Dielectric Material

In this paper, we present finite element method (FEM) to investigate the quasi-static analysis of two dimensional (2D) shielded two coupled stripline structures for microelectronic devices. In the proposed method, we specifically determine the values of capacitance per unit length and inductance per unit length of shielded two vertically coupled striplines and shielded two coupled striplines embedded in dielectric material. Extensive simulation results are presented, and some comparative results are given by other methods and found them to be in excellent agreement. Furthermore, we determine the quasi-TEM spectral for the potential distribution of these shielded two coupled striplines

High-Performance Computing for the Electromagnetic Modeling and Simulation of Interconnects

The electromagnetic modeling of packages and interconnects plays a very important role in the design of high-speed digital circuits, and is most efficiently performed by using computer-aided design algorithms. In recent years, packaging has become a critical area in the design of high-speed communication systems and fast computers, and the importance of the software support for their development has increased accordingly. Throughout this project, our efforts have focused on the development of modeling and simulation techniques and algorithms that permit the fast computation of the electrical parameters of interconnects and the efficient simulation of their electrical performance

Computation of Conductance and Capacitance for IC Interconnects on a General Lossy Multilayer Substrate

In this paper a simple method for analysis and modelling of transmission interconnect lines on general lossy multilayer substrates at high bit rates is presented. The analysis is based on semi-analytical Green's function approach and recurrence relation between the coefficients of potential in n and n + 1 layers, respectively. The electromagnetic concept of free charge density is applied. It allows us to obtain integral equations between electric scalar potential and charge density distributions. These equations are solved by the Galerkin procedure of the Method of Moments. New approach is especially adequate to model 2-D layered structures with planar boundaries for frequencies up to 20GHz (quasistationary field approach). The transmission line parameters (capacitance and conductance per unit length) for the given interconnect multilayer geometry are computed. A discussion of the calculated line admittance in terms of technological and geometrical parameters of the structure is given. A comparison of the numerical results from the new procedure with the techniques presented in the previous publications are provided, too