Enhancing Power Efficient Design Techniques in Deep Submicron Era

Excessive power dissipation has been one of the major bottlenecks for design and manufacture in the past couple of decades. Power efficient design has become more and more challenging when technology scales down to the deep submicron era that features the dominance of leakage, the manufacture variation, the on-chip temperature variation and higher reliability requirements, among others. Most of the computer aided design (CAD) tools and algorithms currently used in industry were developed in the pre deep submicron era and did not consider the new features explicitly and adequately. Recent research advances in deep submicron design, such as the mechanisms of leakage, the source and characterization of manufacture variation, the cause and models of on-chip temperature variation, provide us the opportunity to incorporate these important issues in power efficient design. We explore this opportunity in this dissertation by demonstrating that significant power reduction can be achieved with only minor modification to the existing CAD tools and algorithms. First, we consider peak current, which has become critical for circuit's reliability in deep submicron design. Traditional low power design techniques focus on the reduction of average power. We propose to reduce peak current while keeping the overhead on average power as small as possible. Second, dual Vt technique and gate sizing have been used simultaneously for leakage savings. However, this approach becomes less effective in deep submicron design. We propose to use the newly developed process-induced mechanical stress to enhance its performance. Finally, in deep submicron design, the impact of on-chip temperature variation on leakage and performance becomes more and more significant. We propose a temperature-aware dual Vt approach to alleviate hot spots and achieve further leakage reduction. We also consider this leakage-temperature dependency in the dynamic voltage scaling approach and discover that a commonly accepted result is incorrect for the current technology. We conduct extensive experiments with popular design benchmarks, using the latest industry CAD tools and design libraries. The results show that our proposed enhancements are promising in power saving and are practical to solve the low power design challenges in deep submicron era

Multi-objective Pareto front and particle swarm optimization algorithms for power dissipation reduction in microprocessors

The progress of microelectronics making possible higher integration densities, and a considerable development of on-board systems are currently undergoing, this growth comes up against a limiting factor of power dissipation. Higher power dissipation will cause an immediate spread of generated heat which causes thermal problems. Consequently, the system's total consumed energy will increase as the system temperature increase. High temperatures in microprocessors and large thermal energy of computer systems produce huge problems of system confidence, performance, and cooling expenses. Power consumed by processors are mainly due to the increase in number of cores and the clock frequency, which is dissipated in the form of heat and causes thermal challenges for chip designers. As the microprocessor’s performance has increased remarkably in Nano-meter technology, power dissipation is becoming non-negligible. To solve this problem, this article addresses power dissipation reduction issues for high performance processors using multi-objective Pareto front (PF), and particle swarm optimization (PSO) algorithms to achieve power dissipation as a prior computation that reduces the real delay of a target microprocessor unit. Simulation is verified the conceptual fundamentals and optimization of joint body and supply voltages (Vth-VDD) which showing satisfactory findings

The Thermal-Constrained Real-Time Systems Design on Multi-Core Platforms -- An Analytical Approach

Over the past decades, the shrinking transistor size enabled more transistors to be integrated into an IC chip, to achieve higher and higher computing performances. However, the semiconductor industry is now reaching a saturation point of Moore’s Law largely due to soaring power consumption and heat dissipation, among other factors. High chip temperature not only significantly increases packing/cooling cost, degrades system performance and reliability, but also increases the energy consumption and even damages the chip permanently. Although designing 2D and even 3D multi-core processors helps to lower the power/thermal barrier for single-core architectures by exploring the thread/process level parallelism, the higher power density and longer heat removal path has made the thermal problem substantially more challenging, surpassing the heat dissipation capability of traditional cooling mechanisms such as cooling fan, heat sink, heat spread, etc., in the design of new generations of computing systems. As a result, dynamic thermal management (DTM), i.e. to control the thermal behavior by dynamically varying computing performance and workload allocation on an IC chip, has been well-recognized as an effective strategy to deal with the thermal challenges. Over the past decades, the shrinking transistor size, benefited from the advancement of IC technology, enabled more transistors to be integrated into an IC chip, to achieve higher and higher computing performances. However, the semiconductor industry is now reaching a saturation point of Moore’s Law largely due to soaring power consumption and heat dissipation, among other factors. High chip temperature not only significantly increases packing/cooling cost, degrades system performance and reliability, but also increases the energy consumption and even damages the chip permanently. Although designing 2D and even 3D multi-core processors helps to lower the power/thermal barrier for single-core architectures by exploring the thread/process level parallelism, the higher power density and longer heat removal path has made the thermal problem substantially more challenging, surpassing the heat dissipation capability of traditional cooling mechanisms such as cooling fan, heat sink, heat spread, etc., in the design of new generations of computing systems. As a result, dynamic thermal management (DTM), i.e. to control the thermal behavior by dynamically varying computing performance and workload allocation on an IC chip, has been well-recognized as an effective strategy to deal with the thermal challenges. Different from many existing DTM heuristics that are based on simple intuitions, we seek to address the thermal problems through a rigorous analytical approach, to achieve the high predictability requirement in real-time system design. In this regard, we have made a number of important contributions. First, we develop a series of lemmas and theorems that are general enough to uncover the fundamental principles and characteristics with regard to the thermal model, peak temperature identification and peak temperature reduction, which are key to thermal-constrained real-time computer system design. Second, we develop a design-time frequency and voltage oscillating approach on multi-core platforms, which can greatly enhance the system throughput and its service capacity. Third, different from the traditional workload balancing approach, we develop a thermal-balancing approach that can substantially improve the energy efficiency and task partitioning feasibility, especially when the system utilization is high or with a tight temperature constraint. The significance of our research is that, not only can our proposed algorithms on throughput maximization and energy conservation outperform existing work significantly as demonstrated in our extensive experimental results, the theoretical results in our research are very general and can greatly benefit other thermal-related research

Managing lifetime reliability, performance, and power tradeoffs in multicore microarchitectures

The objective of this research is to characterize and manage lifetime reliability, microarchitectural performance, and power tradeoffs in multicore processors. This dissertation is comprised of three research themes; 1) modeling and simulation method of interacting multicore processor physics, 2) characterization and management of performance and lifetime reliability tradeoff, and 3) extending Amdahl’s Law for understanding lifetime reliability, performance, and energy efficiency of heterogeneous processors. With continued technology scaling, processor operations are increasingly dominated by multiple distinct physical phenomena and their coupled interactions. Understanding these behaviors requires the modeling of complex physical interactions. This dissertation first presents a novel simulation framework that orchestrates interactions between multiple physical models and microarchitecture simulators to enable research explorations at the intersection of application, microarchitecture, energy, power, thermal, and reliability. Using this framework, workload-induced variation of device degradation is characterized, and its impacts on processor lifetime and performance are analyzed. This research introduces a new metric to quantify performance-reliability tradeoff. Lastly, the theoretical models of heterogeneous multicore processors are proposed for understanding performance, energy efficiency, and lifetime reliability consequences. It is shown that these system metrics are governed by Amdahl’s Law and correlated as a function of processor composition, scheduling method, and Amdahl’s scaling factor. This dissertation highlights the importance of multidimensional analysis and extends the scope of microarchitectural studies by incorporating the physical aspects of processor operations and designs.Ph.D

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

High efficiency smart voltage regulating module for green mobile computing

This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.In this thesis a design for a smart high efficiency voltage regulating module capable of supplying the core of modern microprocessors incorporating dynamic voltage and frequency scaling (DVS) capability is accomplished using a RISC based microcontroller to facilitate all the functions required to control, protect, and supply the core with the required variable operating voltage as set by the DVS management system. Normally voltage regulating modules provide maximum power efficiency at designed peak load, and the efficiency falls off as the load moves towards lesser values. A mathematical model has been derived for the main converter and small signal analysis has been performed in order to determine system operation stability and select a control scheme that would improve converter operation response to transients and not requiring intense computational power to realize. A Simulation model was built using Matlab/Simulink and after experimenting with tuned PID controller and fuzzy logic controllers, a simple fuzzy logic control scheme was selected to control the pulse width modulated converter and several methods were devised to reduce the requirements for computational power making the whole system operation realizable using a low power RISC based microcontroller. The same microcontroller provides circuit adaptations operation in addition to providing protection to load in terms of over voltage and over current protection. A novel circuit technique and operation control scheme enables the designed module to selectively change some of the circuit elements in the main pulse width modulated buck converter so as to improve efficiency over a wider range of loads. In case of very light loads as the case when the device goes into standby, sleep or hibernation mode, a secondary converter starts operating and the main converter stops. The secondary converter adapts a different operation scheme using switched capacitor technique which provides high efficiency at low load currents. A fuzzy logic control scheme was chosen for the main converter for its lighter computational power requirement promoting implementation using ultra low power embedded controllers. Passive and active components were carefully selected to augment operational efficiency. These aspects enabled the designed voltage regulating module to operate with efficiency improvement in off peak load region in the range of 3% to 5%. At low loads as the case when the computer system goes to standby or sleep mode, the efficiency improvent is better than 13% which will have noticeable contribution in extending battery run time thus contributing to lowering the carbon footprint of human consumption

Thermal Aware Design Automation of the Electronic Control System for Autonomous Vehicles

The autonomous vehicle (AV) technology, due to its tremendous social and economical benefits, is transforming the entire world in the coming decades. However, significant technical challenges still need to be overcome until AVs can be safely, reliably, and massively deployed. Temperature plays a key role in the safety and reliability of an AV, not only because a vehicle is subjected to extreme operating temperatures but also because the increasing computations demand more powerful IC chips, which can lead to higher operating temperature and large thermal gradient. In particular, as the underpinning technology for AV, artificial intelligence (AI) requires substantially increased computation and memory resources, which have been growing exponentially through recent years and further exacerbated the thermal problems. High operating temperature and large thermal gradient can reduce the performance, degrade the reliability, and even cause an IC to fail catastrophically. We believe that dealing with thermal issues must be coupled closely in the design phase of the AVs’ electronic control system (ECS). To this end, first, we study how to map vehicle applications to ECS with heterogeneous architecture to satisfy peak temperature constraints and optimize latency and system-level reliability. We present a mathematical programming model to bound the peak temperature for the ECS. We also develop an approach based on the genetic algorithm to bound the peak temperature under varying execution time scenarios and optimize the system-level reliability of the ECS. We present several computationally efficient techniques for system-level mean-time-to-failure (MTTF) computation, which show several orders-of-magnitude speed-up over the state-of-the-art method. Second, we focus on studying the thermal impacts of AI techniques. Specifically, we study how the thermal impacts for the memory bit flipping can affect the prediction accuracy of a deep neural network (DNN). We develop a neuron-level analytical sensitivity estimation framework to quantify this impact and study its effectiveness with popular DNN architectures. Third, we study the problem of incorporating thermal impacts into mapping the parameters for DNN neurons to memory banks to improve prediction accuracy. Based on our developed sensitivity metric, we develop a bin-packing-based approach to map DNN neuron parameters to memory banks with different temperature profiles. We also study the problem of identifying the optimal temperature profiles for memory systems that can minimize the thermal impacts. We show that the thermal aware mapping of DNN neuron parameters on memory banks can significantly improve the prediction accuracy at a high-temperature range than the thermal ignorant for state-of-the-art DNNs

Longevity Framework: Leveraging Online Integrated Aging-Aware Hierarchical Mapping and VF-Selection for Lifetime Reliability Optimization in Manycore Processors

Rapid device aging in the nano era threatens system lifetime reliability, posing a major intrinsic threat to system functionality. Traditional techniques to overcome the aging-induced device slowdown, such as guardbanding are static and incur performance, power, and area penalties. In a manycore processor, the system-level design abstraction offers dynamic opportunities through the control of task-to-core mappings and per-core operation frequency towards more balanced core aging profile across the chip, optimizing the system lifetime reliability while meeting the application performance requirements. This article presents Longevity Framework (LF) that leverages online integrated aging-aware hierarchical mapping and voltage frequency (VF)-selection for lifetime reliability optimization in manycore processors. The mapping exploration is hierarchical to achieve scalability. The VF-selection builds on the trade-offs involved between power, performance, and aging as the VF is scaled while leveraging the per-core DVFS capabilities. The methodology takes the chip-wide process variation into account. Extensive experimentation, comparing the proposed approach with two state-of-the-art methods, for 64-core and 256-core systems running applications from PARSEC and SPLASH-2 benchmark suites, show an improvement of up to 3.2 years in the system lifetime reliability and 4× improvement in the average core health

Power Management for Deep Submicron Microprocessors

As VLSI technology scales, the enhanced performance of smaller transistors comes at the expense of increased power consumption. In addition to the dynamic power consumed by the circuits there is a tremendous increase in the leakage power consumption which is further exacerbated by the increasing operating temperatures. The total power consumption of modern processors is distributed between the processor core, memory and interconnects. In this research two novel power management techniques are presented targeting the functional units and the global interconnects. First, since most leakage control schemes for processor functional units are based on circuit level techniques, such schemes inherently lack information about the operational profile of higher-level components of the system. This is a barrier to the pivotal task of predicting standby time. Without this prediction, it is extremely difficult to assess the value of any leakage control scheme. Consequently, a methodology that can predict the standby time is highly beneficial in bridging the gap between the information available at the application level and the circuit implementations. In this work, a novel Dynamic Sleep Signal Generator (DSSG) is presented. It utilizes the usage traces extracted from cycle accurate simulations of benchmark programs to predict the long standby periods associated with the various functional units. The DSSG bases its decisions on the current and previous standby state of the functional units to accurately predict the length of the next standby period. The DSSG presents an alternative to Static Sleep Signal Generation (SSSG) based on static counters that trigger the generation of the sleep signal when the functional units idle for a prespecified number of cycles. The test results of the DSSG are obtained by the use of a modified RISC superscalar processor, implemented by SimpleScalar, the most widely accepted open source vehicle for architectural analysis. In addition, the results are further verified by a Simultaneous Multithreading simulator implemented by SMTSIM. Leakage saving results shows an increase of up to 146% in leakage savings using the DSSG versus the SSSG, with an accuracy of 60-80% for predicting long standby periods. Second, chip designers in their effort to achieve timing closure, have focused on achieving the lowest possible interconnect delay through buffer insertion and routing techniques. This approach, though, taxes the power budget of modern ICs, especially those intended for wireless applications. Also, in order to achieve more functionality, die sizes are constantly increasing. This trend is leading to an increase in the average global interconnect length which, in turn, requires more buffers to achieve timing closure. Unconstrained buffering is bound to adversely affect the overall chip performance, if the power consumption is added as a major performance metric. In fact, the number of global interconnect buffers is expected to reach hundreds of thousands to achieve an appropriate timing closure. To mitigate the impact of the power consumed by the interconnect buffers, a power-efficient multi-pin routing technique is proposed in this research. The problem is based on a graph representation of the routing possibilities, including buffer insertion and identifying the least power path between the interconnect source and set of sinks. The novel multi-pin routing technique is tested by applying it to the ISPD and IBM benchmarks to verify the accuracy, complexity, and solution quality. Results obtained indicate that an average power savings as high as 32% for the 130-nm technology is achieved with no impact on the maximum chip frequency

Power Aware Computing on GPUs

Energy and power density concerns in modern processors have led to significant computer architecture research efforts in power-aware and temperature-aware computing. With power dissipation becoming an increasingly vexing problem, power analysis of Graphical Processing Unit (GPU) and its components has become crucial for hardware and software system design. Here, we describe our technique for a coordinated measurement approach that combines real total power measurement and per-component power estimation. To identify power consumption accurately, we introduce the Activity-based Model for GPUs (AMG), from which we identify activity factors and power for microarchitectures on GPUs that will help in analyzing power tradeoffs of one component versus another using microbenchmarks. The key challenge addressed in this thesis is real-time power consumption, which can be accurately estimated using NVIDIA\u27s Management Library (NVML) through Pthreads. We validated our model using Kill-A-Watt power meter and the results are accurate within 10\%. The resulting Performance Application Programming Interface (PAPI) NVML component offers real-time total power measurements for GPUs. This thesis also compares a single NVIDIA C2075 GPU running MAGMA (Matrix Algebra on GPU and Multicore Architectures) kernels, to a 48 core AMD Istanbul CPU running LAPACK