Low Cost Power and Supply Noise Estimation and Control in Scan Testing of VLSI Circuits

Test power is an important issue in deep submicron semiconductor testing. Too much power supply noise and too much power dissipation can result in excessive temperature rise, both leading to overkill during delay test. Scan-based test has been widely adopted as one of the most commonly used VLSI testing method. The test power during scan testing comprises shift power and capture power. The power consumed in the shift cycle dominates the total power dissipation. It is crucial for IC manufacturing companies to achieve near constant power consumption for a given timing window in order to keep the chip under test (CUT) at a near constant temperature, to make it easy to characterize the circuit behavior and prevent delay test over kill. To achieve constant test power, first, we built a fast and accurate power model, which can estimate the shift power without logic simulation of the circuit. We also proposed an efficient and low power X-bit Filling process, which could potentially reduce both the shift power and capture power. Then, we introduced an efficient test pattern reordering algorithm, which achieves near constant power between groups of patterns. The number of patterns in a group is determined by the thermal constant of the chip. Experimental results show that our proposed power model has very good correlation. Our proposed X-Fill process achieved both minimum shift power and capture power. The algorithm supports multiple scan chains and can achieve constant power within different regions of the chip. The greedy test pattern reordering algorithm can reduce the power variation from 29-126 percent to 8-10 percent or even lower if we reduce the power variance threshold. Excessive noise can significantly affect the timing performance of Deep Sub-Micron (DSM) designs and cause non-trivial additional delay. In delay test generation, test compaction and test fill techniques can produce excessive power supply noise. This can result in delay test overkill. Prior approaches to power supply noise aware delay test compaction are too costly due to many logic simulations, and are limited to static compaction. We proposed a realistic low cost delay test compaction flow that guardbands the delay using a sequence of estimation metrics to keep the circuit under test supply noise more like functional mode. This flow has been implemented in both static compaction and dynamic compaction. We analyzed the relationship between delay and voltage drop, and the relationship between effective weighted switching activity (WSA) and voltage drop. Based on these correlations, we introduce the low cost delay test pattern compaction framework considering power supply noise. Experimental results on ISCAS89 circuits show that our low cost framework is up to ten times faster than the prior high cost framework. Simulation results also verify that the low cost model can correctly guardband every path‟s extra noise-induced delay. We discussed the rules to set different constraints in the levelized framework. The veto process used in the compaction can be also applied to other constraints, such as power and temperature

High Quality Test Generation Targeting Power Supply Noise

Delay test is an essential structural manufacturing test used to determine the maximal frequency at which a chip can run without incurring any functional failures. The central unsolved challenge is achieving high delay correlation with the functional test, which is dominated by power supply noise (PSN). Differences in PSN between functional and structural tests can lead to differences in chip operating frequencies of 30% or more. Pseudo functional test (PFT), based on a multiple-cycle clocking scheme, has better PSN correlation with functional test compared with traditional two-cycle at-speed test. However, PFT is vulnerable to under-testing when applied to delay test. This work aims to generate high quality PFT patterns, achieving high PSN correlation with functional test. First, a simulation-based don’t-care filling algorithm, Bit-Flip, is proposed to improve the PSN for PFT. It relies on randomly flipping a group of bits in the test pattern to explore the search space and find patterns that stress the circuits with the worst-case, but close to functional PSN. Experimental results on un-compacted patterns show Bit-Flip is able to improve PSN as much as 38.7% compared with the best random fill. Second, techniques are developed to improve the efficiency of Bit-Flip. A set of partial patterns, which sensitize transitions on critical cells, are pre-computed and later used to guide the selection of bits to flip. Combining random and deterministic flipping, we achieve similar PSN control as Bit-Flip but with much less simulation time. Third, we address the problem of automatic test pattern generation for extracting circuit timing sensitivity to power supply noise during post-silicon validation. A layout-aware path selection algorithm selects long paths to fully span the power delivery network. The selected patterns are intelligently filled to bring the PSN to a desired level. These patterns can be used to understand timing sensitivity in post-silicon validation by repeatedly applying the path delay test while sweeping the PSN experienced by the path from low to high. Finally, the impacts of compression on power supply noise control are studied. Illinois Scan and embedded deterministic test (EDT) patterns are generated. Then Bit-Flip is extended to incorporate the compression constraints and applied to compressible patterns. The experimental results show that EDT lowers the maximal PSN by 24.15% and Illinois Scan lowers it by 2.77% on un-compacted patterns

Towards an embedded board-level tester: study of a configurable test processor

The demand for electronic systems with more features, higher performance, and less power consumption increases continuously. This is a real challenge for design and test engineers because they have to deal with electronic systems with ever-increasing complexity maintaining production and test costs low and meeting critical time to market deadlines. For a test engineer working at the board-level, this means that manufacturing defects must be detected as soon as possible and at a low cost. However, the use of classical test techniques for testing modern printed circuit boards is not sufficient, and in the worst case these techniques cannot be used at all. This is mainly due to modern packaging technologies, a high device density, and high operation frequencies of modern printed circuit boards. This leads to very long test times, low fault coverage, and high test costs. This dissertation addresses these issues and proposes an FPGA-based test approach for printed circuit boards. The concept is based on a configurable test processor that is temporarily implemented in the on-board FPGA and provides the corresponding mechanisms to communicate to external test equipment and co-processors implemented in the FPGA. This embedded test approach provides the flexibility to implement test functions either in the external test equipment or in the FPGA. In this manner, tests are executed at-speed increasing the fault coverage, test times are reduced, and the test system can be adapted automatically to the properties of the FPGA and devices located on the board. An essential part of the FPGA-based test approach deals with the development of a test processor. In this dissertation the required properties of the processor are discussed, and it is shown that the adaptation to the specific test scenario plays a very important role for the optimization. For this purpose, the test processor is equipped with configuration parameters at the instruction set architecture and microarchitecture level. Additionally, an automatic generation process for the test system and for the computation of some of the processor’s configuration parameters is proposed. The automatic generation process uses as input a model known as the device under test model (DUT-M). In order to evaluate the entire FPGA-based test approach and the viability of a processor for testing printed circuit boards, the developed test system is used to test interconnections to two different devices: a static random memory (SRAM) and a liquid crystal display (LCD). Experiments were conducted in order to determine the resource utilization of the processor and FPGA-based test system and to measure test time when different test functions are implemented in the external test equipment or the FPGA. It has been shown that the introduced approach is suitable to test printed circuit boards and that the test processor represents a realistic alternative for testing at board-level.Der Bedarf an elektronischen Systemen mit zusätzlichen Merkmalen, höherer Leistung und geringerem Energieverbrauch nimmt ständig zu. Dies stellt eine erhebliche Herausforderung für Entwicklungs- und Testingenieure dar, weil sie sich mit elektronischen Systemen mit einer steigenden Komplexität zu befassen haben. Außerdem müssen die Herstellungs- und Testkosten gering bleiben und die Produkteinführungsfristen so kurz wie möglich gehalten werden. Daraus folgt, dass ein Testingenieur, der auf Leiterplatten-Ebene arbeitet, die Herstellungsfehler so früh wie möglich entdecken und dabei möglichst niedrige Kosten verursachen soll. Allerdings sind die klassischen Testmethoden nicht in der Lage, die Anforderungen von modernen Leiterplatten zu erfüllen und im schlimmsten Fall können diese Testmethoden überhaupt nicht verwendet werden. Dies liegt vor allem an modernen Gehäuse-Technologien, der hohen Bauteildichte und den hohen Arbeitsfrequenzen von modernen Leiterplatten. Das führt zu sehr langen Testzeiten, geringer Testabdeckung und hohen Testkosten. Die Dissertation greift diese Problematik auf und liefert einen FPGA-basierten Testansatz für Leiterplatten. Das Konzept beruht auf einem konfigurierbaren Testprozessor, welcher im On-Board-FPGA temporär implementiert wird und die entsprechenden Mechanismen für die Kommunikation mit der externen Testeinrichtung und Co-Prozessoren im FPGA bereitstellt. Dadurch ist es möglich Testfunktionen flexibel entweder auf der externen Testeinrichtung oder auf dem FPGA zu implementieren. Auf diese Weise werden Tests at-speed ausgeführt, um die Testabdeckung zu erhöhen. Außerdem wird die Testzeit verkürzt und das Testsystem automatisch an die Eigenschaften des FPGAs und anderer Bauteile auf der Leiterplatte angepasst. Ein wesentlicher Teil des FPGA-basierten Testansatzes umfasst die Entwicklung eines Testprozessors. In dieser Dissertation wird über die benötigten Eigenschaften des Prozessors diskutiert und es wird gezeigt, dass die Anpassung des Prozessors an den spezifischen Testfall von großer Bedeutung für die Optimierung ist. Zu diesem Zweck wird der Prozessor mit Konfigurationsparametern auf der Befehlssatzarchitektur-Ebene und Mikroarchitektur-Ebene ausgerüstet. Außerdem wird ein automatischer Generierungsprozess für die Realisierung des Testsystems und für die Berechnung einer Untergruppe von Konfigurationsparametern des Prozessors vorgestellt. Der automatische Generierungsprozess benutzt als Eingangsinformation ein Modell des Prüflings (device under test model, DUT-M). Das entwickelte Testsystem wurde zum Testen von Leiterplatten für Verbindungen zwischen dem FPGA und zwei Bauteilen verwendet, um den FPGA-basierten Testansatz und die Durchführbarkeit des Testprozessors für das Testen auf Leiterplatte-Ebene zu evaluieren. Die zwei Bauteile sind ein Speicher mit direktem Zugriff (static random-access memory, SRAM) und eine Flüssigkristallanzeige (liquid crystal display, LCD). Die Experimente wurden durchgeführt, um den Ressourcenverbrauch des Prozessors und Testsystems festzustellen und um die Testzeit zu messen. Dies geschah durch die Implementierung von unterschiedlichen Testfunktionen auf der externen Testeinrichtung und dem FPGA. Dadurch konnte gezeigt werden, dass der FPGA-basierte Ansatz für das Testen von Leiterplatten geeignet ist und dass der Testprozessor eine realistische Alternative für das Testen auf Leiterplatten-Ebene ist

Design and Validation of Network-on-Chip Architectures for the Next Generation of Multi-synchronous, Reliable, and Reconfigurable Embedded Systems

NETWORK-ON-CHIP (NoC) design is today at a crossroad. On one hand, the design principles to efficiently implement interconnection networks in the resource-constrained on-chip setting have stabilized. On the other hand, the requirements on embedded system design are far from stabilizing. Embedded systems are composed by assembling together heterogeneous components featuring differentiated operating speeds and ad-hoc counter measures must be adopted to bridge frequency domains. Moreover, an unmistakable trend toward enhanced reconfigurability is clearly underway due to the increasing complexity of applications. At the same time, the technology effect is manyfold since it provides unprecedented levels of system integration but it also brings new severe constraints to the forefront: power budget restrictions, overheating concerns, circuit delay and power variability, permanent fault, increased probability of transient faults. Supporting different degrees of reconfigurability and flexibility in the parallel hardware platform cannot be however achieved with the incremental evolution of current design techniques, but requires a disruptive approach and a major increase in complexity. In addition, new reliability challenges cannot be solved by using traditional fault tolerance techniques alone but the reliability approach must be also part of the overall reconfiguration methodology. In this thesis we take on the challenge of engineering a NoC architectures for the next generation systems and we provide design methods able to overcome the conventional way of implementing multi-synchronous, reliable and reconfigurable NoC. Our analysis is not only limited to research novel approaches to the specific challenges of the NoC architecture but we also co-design the solutions in a single integrated framework. Interdependencies between different NoC features are detected ahead of time and we finally avoid the engineering of highly optimized solutions to specific problems that however coexist inefficiently together in the final NoC architecture. To conclude, a silicon implementation by means of a testchip tape-out and a prototype on a FPGA board validate the feasibility and effectivenes

Design, Analysis and Test of Logic Circuits under Uncertainty.

Integrated circuits are increasingly susceptible to uncertainty caused by soft errors, inherently probabilistic devices, and manufacturing variability. As device technologies scale, these effects become detrimental to circuit reliability. In order to address this, we develop methods for analyzing, designing, and testing circuits subject to probabilistic effects. Our main contributions are: 1) a fast, soft-error rate (SER) analyzer that uses functional-simulation signatures to capture error effects, 2) novel design techniques that improve reliability using little area and performance overhead, 3) a matrix-based reliability-analysis framework that captures many types of probabilistic faults, and 4) test-generation/compaction methods aimed at probabilistic faults in logic circuits. SER analysis must account for the main error-masking mechanisms in ICs: logic, timing, and electrical masking. We relate logic masking to node testability of the circuit and utilize functional-simulation signatures, i.e., partial truth tables, to efficiently compute estability (signal probability and observability). To account for timing masking, we compute error-latching windows (ELWs) from timing analysis information. Electrical masking is incorporated into our estimates through derating factors for gate error probabilities. The SER of a circuit is computed by combining the effects of all three masking mechanisms within our SER analyzer called AnSER. Using AnSER, we develop several low-overhead techniques that increase reliability, including: 1) an SER-aware design method that uses redundancy already present within the circuit, 2) a technique that resynthesizes small logic windows to improve area and reliability, and 3) a post-placement gate-relocation technique that increases timing masking by decreasing ELWs. We develop the probabilistic transfer matrix (PTM) modeling framework to analyze effects beyond soft errors. PTMs are compressed into algebraic decision diagrams (ADDs) to improve computational efficiency. Several ADD algorithms are developed to extract reliability and error susceptibility information from PTMs representing circuits. We propose new algorithms for circuit testing under probabilistic faults, which require a reformulation of existing test techniques. For instance, a test vector may need to be repeated many times to detect a fault. Also, different vectors detect the same fault with different probabilities. We develop test generation methods that account for these differences, and integer linear programming (ILP) formulations to optimize test sets.Ph.D.Computer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/61584/1/smita_1.pd

Bibliography of Lewis Research Center technical publications announced in 1985

This compilation of abstracts describes and indexes the technical reporting that resulted from the scientific and engineering work performed and managed by the Lewis Research Center in 1985. All the publications were announced in the 1985 issues of STAR (Scientific and Technical Aerospace Reports) and/or IAA (International Aerospace Abstracts). Included are research reports, journal articles, conference presentations, patents and patent applications, and theses

New Carbon Materials from Biomass and Their Applications

Carbon-based materials, such as chars, activated carbons, one-dimensional carbon nanotubes, and two-dimensional graphene nanosheets, have shown great potential for a wide variety of applications. These materials can be synthesized from any precursor with a high proportion of carbon in its composition. Although fossil fuels have been extensively used as precursors, their unstable cost and supply have led to the synthesis of carbon materials from biomass. Biomass covers all forms of organic materials, including plants both living and in waste form and animal waste products. It appears to be a renewable resource because it yields value-added products prepared using environmentally friendly processes. The applications of these biomass-derived carbon materials include electronic, electromagnetic, electrochemical, environmental and biomedical applications. Thus, novel carbon materials from biomass are a subject of intense research, with strong relevance to both science and technology. The main aim of this reprint is to present the most relevant and recent insights in the field of the synthesis of biomass-derived carbons for sustainable applications, including adsorption, catalysis and/or energy storage applications

Research and Technology Objectives and Plans (RTOP), summary

A compilation of summary portions of each of the Research and Technology Operating Plans (RTOPS) used for management review and control of research currently in progress throughout NASA is presented. Subject, technical monitor, responsible NASA organization, and RTOP number indexes are included

A cumulative index to a continuing bibliography on aeronautical engineering

This bibliography is a cumulative index to the abstracts contained in NASA-SP-7037(184) through NASA-SP-7037(195) of Aeronautical Engineering: A Continuing Bibliography. NASA SP-7037 and its supplements have been compiled through the cooperative efforts of the American Institute of Aeronautics and Astronautics (AIAA) and the National Aeronautics and Space Administration (NASA). This cumulative index includes subject, personal author, corporate source, foreign technology, contract, report number, and accession number indexes