Multi-core devices for safety-critical systems: a survey

Multi-core devices are envisioned to support the development of next-generation safety-critical systems, enabling the on-chip integration of functions of different criticality. This integration provides multiple system-level potential benefits such as cost, size, power, and weight reduction. However, safety certification becomes a challenge and several fundamental safety technical requirements must be addressed, such as temporal and spatial independence, reliability, and diagnostic coverage. This survey provides a categorization and overview at different device abstraction levels (nanoscale, component, and device) of selected key research contributions that support the compliance with these fundamental safety requirements.This work has been partially supported by the Spanish Ministry of Economy and Competitiveness under grant TIN2015-65316-P, Basque Government under grant KK-2019-00035 and the HiPEAC Network of Excellence. The Spanish Ministry of Economy and Competitiveness has also partially supported Jaume Abella under Ramon y Cajal postdoctoral fellowship (RYC-2013-14717).Peer ReviewedPostprint (author's final draft

DeSyRe: on-Demand System Reliability

The DeSyRe project builds on-demand adaptive and reliable Systems-on-Chips (SoCs). As fabrication technology scales down, chips are becoming less reliable, thereby incurring increased power and performance costs for fault tolerance. To make matters worse, power density is becoming a significant limiting factor in SoC design, in general. In the face of such changes in the technological landscape, current solutions for fault tolerance are expected to introduce excessive overheads in future systems. Moreover, attempting to design and manufacture a totally defect and fault-free system, would impact heavily, even prohibitively, the design, manufacturing, and testing costs, as well as the system performance and power consumption. In this context, DeSyRe delivers a new generation of systems that are reliable by design at well-balanced power, performance, and design costs. In our attempt to reduce the overheads of fault-tolerance, only a small fraction of the chip is built to be fault-free. This fault-free part is then employed to manage the remaining fault-prone resources of the SoC. The DeSyRe framework is applied to two medical systems with high safety requirements (measured using the IEC 61508 functional safety standard) and tight power and performance constraints

LBDR: An efficient unicast routing support for CMPs

LBDR is a routing distributed layer based on minimum logic that removes the need for routing tables at switches on network-on-chips (NoCs) in CMPs and enables the implementation of many routing algorithms on most of regular and irregular toplogies we may find in the near future in a multi-core system.Rodrigo Mocholí, S. (2008). LBDR: An efficient unicast routing support for CMPs. http://hdl.handle.net/10251/13476Archivo delegad

Revisiting the high-performance reconfigurable computing for future datacenters

Modern datacenters are reinforcing the computational power and energy efficiency by assimilating field programmable gate arrays (FPGAs). The sustainability of this large-scale integration depends on enabling multi-tenant FPGAs. This requisite amplifies the importance of communication architecture and virtualization method with the required features in order to meet the high-end objective. Consequently, in the last decade, academia and industry proposed several virtualization techniques and hardware architectures for addressing resource management, scheduling, adoptability, segregation, scalability, performance-overhead, availability, programmability, time-to-market, security, and mainly, multitenancy. This paper provides an extensive survey covering three important aspects-discussion on non-standard terms used in existing literature, network-on-chip evaluation choices as a mean to explore the communication architecture, and virtualization methods under latest classification. The purpose is to emphasize the importance of choosing appropriate communication architecture, virtualization technique and standard language to evolve the multi-tenant FPGAs in datacenters. None of the previous surveys encapsulated these aspects in one writing. Open problems are indicated for scientific community as well

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

Cost Effective Routing Implementations for On-chip Networks

Arquitecturas de múltiples núcleos como multiprocesadores (CMP) y soluciones multiprocesador para sistemas dentro del chip (MPSoCs) actuales se basan en la eficacia de las redes dentro del chip (NoC) para la comunicación entre los diversos núcleos. Un diseño eficiente de red dentro del chip debe ser escalable y al mismo tiempo obtener valores ajustados de área, latencia y consumo de energía. Para diseños de red dentro del chip de propósito general se suele usar topologías de malla 2D ya que se ajustan a la distribución del chip. Sin embargo, la aparición de nuevos retos debe ser abordada por los diseñadores. Una mayor probabilidad de defectos de fabricación, la necesidad de un uso optimizado de los recursos para aumentar el paralelismo a nivel de aplicación o la necesidad de técnicas eficaces de ahorro de energía, puede ocasionar patrones de irregularidad en las topologías. Además, el soporte para comunicación colectiva es una característica buscada para abordar con eficacia las necesidades de comunicación de los protocolos de coherencia de caché. En estas condiciones, un encaminamiento eficiente de los mensajes se convierte en un reto a superar. El objetivo de esta tesis es establecer las bases de una nueva arquitectura para encaminamiento distribuido basado en lógica que es capaz de adaptarse a cualquier topología irregular derivada de una estructura de malla 2D, proporcionando así una cobertura total para cualquier caso resultado de soportar los retos mencionados anteriormente. Para conseguirlo, en primer lugar, se parte desde una base, para luego analizar una evolución de varios mecanismos, y finalmente llegar a una implementación, que abarca varios módulos para alcanzar el objetivo mencionado anteriormente. De hecho, esta última implementación tiene por nombre eLBDR (effective Logic-Based Distributed Routing). Este trabajo cubre desde el primer mecanismo, LBDR, hasta el resto de mecanismos que han surgido progresivamente.Rodrigo Mocholí, S. (2010). Cost Effective Routing Implementations for On-chip Networks [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/8962Palanci

Scalable Emulation of Heterogeneous Systems

The breakdown of Dennard's transistor scaling has driven computing systems toward application-specific accelerators, which can provide orders-of-magnitude improvements in performance and energy efficiency over general-purpose processors. To enable the radical departures from conventional approaches that heterogeneous systems entail, research infrastructure must be able to model processors, memory and accelerators, as well as system-level changes---such as operating system or instruction set architecture (ISA) innovations---that might be needed to realize the accelerators' potential. Unfortunately, existing simulation tools that can support such system-level research are limited by the lack of fast, scalable machine emulators to drive execution. To fill this need, in this dissertation we first present a novel machine emulator design based on dynamic binary translation that makes the following improvements over the state of the art: it scales on multicore hosts while remaining memory efficient, correctly handles cross-ISA differences in atomic instruction semantics, leverages the host floating point (FP) unit to speed up FP emulation without sacrificing correctness, and can be efficiently instrumented to---among other possible uses---drive the execution of a full-system, cross-ISA simulator with support for accelerators. We then demonstrate the utility of machine emulation for studying heterogeneous systems by leveraging it to make two additional contributions. First, we quantify the trade-offs in different coupling models for on-chip accelerators. Second, we present a technique to reuse the private memories of on-chip accelerators when they are otherwise inactive to expand the system's last-level cache, thereby reducing the opportunity cost of the accelerators' integration