Radiation safety based on the sky shine effect in reactor

In the reactor operation, neutrons and gamma rays are the most dominant radiation. As protection, lead and concrete shields are built around the reactor. However, the radiation can penetrate the water shielding inside the reactor pool. This incident leads to the occurrence of sky shine where a physical phenomenon of nuclear radiation sources was transmitted panoramic that extends to the environment. The effect of this phenomenon is caused by the fallout radiation into the surrounding area which causes the radiation dose to increase. High doses of exposure cause a person to have stochastic effects or deterministic effects. Therefore, this study was conducted to measure the radiation dose from sky shine effect that scattered around the reactor at different distances and different height above the reactor platform. In this paper, the analysis of the radiation dose of sky shine effect was measured using the experimental metho

Addressing Manufacturing Challenges in NoC-based ULSI Designs

Hernández Luz, C. (2012). Addressing Manufacturing Challenges in NoC-based ULSI Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/1669

Network-on-Chip Synchronization

Technology scaling has enabled the number of cores within a System on Chip (SoC) to increase significantly. Globally Asynchronous Locally Synchronous (GALS) systems using Dynamic Voltage and Frequency Scaling (DVFS) operate each of these cores on distinct and dynamic clock domains. The main communication method between these cores is increasingly more likely to be a Network-on-Chip (NoC). Typically, the interfaces between these clock domains experience multi-cycle synchronization latencies due to their use of “brute-force” synchronizers. This dissertation aims to improve the performance of NoCs and thereby SoCs as a whole by reducing this synchronization latency. First, a survey of NoC improvement techniques is presented. One such improvement technique: a multi-layer NoC, has been successfully simulated. Given how one of the most commonly used techniques is DVFS, a thorough analysis and simulation of brute-force synchronizer circuits in both current and future process technologies is presented. Unfortunately, a multi-cycle latency is unavoidable when using brute-force synchronizers, so predictive synchronizers which require only a single cycle of latency have been proposed. To demonstrate the impact of these predictive synchronizer circuits at a high level, multi-core system simulations incorporating these circuits have been completed. Multiple forms of GALS NoC configurations have been simulated, including multi-synchronous, NoC-synchronous, and single-synchronizer. Speedup on the SPLASH benchmark suite was measured to directly quantify the performance benefit of predictive synchronizers in a full system. Additionally, Mean Time Between Failures (MTBF) has been calculated for each NoC synchronizer configuration to determine the reliability benefit possible when using predictive synchronizers

Exploration and Design of High Performance Variation Tolerant On-Chip Interconnects

Siirretty Doriast

Ring oscillator clocks and margins

How much margin do we have to add to the delay lines of a bundled-data circuit? This paper is an attempt to give a methodical answer to this question, taking into account all sources of variability and the existing EDA machinery for timing analysis and sign-off. The paper is based on the study of the margins of a ring oscillator that substitutes a PLL as clock generator. A timing model is proposed that shows that a 12% margin for delay lines can be sufficient to cover variability in a 65nm technology. In a typical scenario, performance and energy improvements between 15% and 35% can be obtained by using a ring oscillator instead of a PLL. The paper concludes that a synchronous circuit with a ring oscillator clock shows similar benefits in performance and energy as those of bundled-data asynchronous circuits.Peer ReviewedPostprint (author's final draft

Dynamic Voltage and Frequency Scaling for Wireless Network-on-Chip

Previously, research and design of Network-on-Chip (NoC) paradigms where mainly focused on improving the performance of the interconnection networks. With emerging wide range of low-power applications and energy constrained high-performance applications, it is highly desirable to have NoCs that are highly energy efficient without incurring performance penalty. In the design of high-performance massive multi-core chips, power and heat have become dominant constrains. Increased power consumption can raise chip temperature, which in turn can decrease chip reliability and performance and increase cooling costs. It was proven that Small-world Wireless Network-on-Chip (SWNoC) architecture which replaces multi-hop wire-line path in a NoC by high-bandwidth single hop long range wireless links, reduces the overall energy dissipation when compared to wire-line mesh-based NoC architecture. However, the overall energy dissipation of the wireless NoC is still dominated by wire-line links and switches (buffers). Dynamic Voltage Scaling is an efficient technique for significant power savings in microprocessors. It has been proposed and deployed in modern microprocessors by exploiting the variance in processor utilization. On a Network-on-Chip paradigm, it is more likely that the wire-line links and buffers are not always fully utilized even for different applications. Hence, by exploiting these characteristics of the links and buffers over different traffic, DVFS technique can be incorporated on these switches and wire-line links for huge power savings. In this thesis, a history based DVFS mechanism is proposed. This mechanism uses the past utilization of the wire-line links & buffers to predict the future traffic and accordingly tune the voltage and frequency for the links and buffers dynamically for each time window. This mechanism dynamically minimizes the power consumption while substantially maintaining a high performance over the system. Performance analysis on these DVFS enabled Wireless NoC shows that, the overall energy dissipation is improved by around 40% when compared Small-world Wireless NoCs

Doctor of Philosophy

dissertationPortable electronic devices will be limited to available energy of existing battery chemistries for the foreseeable future. However, system-on-chips (SoCs) used in these devices are under a demand to offer more functionality and increased battery life. A difficult problem in SoC design is providing energy-efficient communication between its components while maintaining the required performance. This dissertation introduces a novel energy-efficient network-on-chip (NoC) communication architecture. A NoC is used within complex SoCs due it its superior performance, energy usage, modularity, and scalability over traditional bus and point-to-point methods of connecting SoC components. This is the first academic research that combines asynchronous NoC circuits, a focus on energy-efficient design, and a software framework to customize a NoC for a particular SoC. Its key contribution is demonstrating that a simple, asynchronous NoC concept is a good match for low-power devices, and is a fruitful area for additional investigation. The proposed NoC is energy-efficient in several ways: simple switch and arbitration logic, low port radix, latch-based router buffering, a topology with the minimum number of 3-port routers, and the asynchronous advantages of zero dynamic power consumption while idle and the lack of a clock tree. The tool framework developed for this work uses novel methods to optimize the topology and router oorplan based on simulated annealing and force-directed movement. It studies link pipelining techniques that yield improved throughput in an energy-efficient manner. A simulator is automatically generated for each customized NoC, and its traffic generators use a self-similar message distribution, as opposed to Poisson, to better match application behavior. Compared to a conventional synchronous NoC, this design is superior by achieving comparable message latency with half the energy

Méthodologies de conception ASIC pour des systèmes sur puce 3D hétérogènes à base de réseaux sur puce 3D

Dans cette thèse, nous étudions les architectures 3D NoC grâce à des implémentations de conception physiques en utilisant la technologie 3D réel mis en oeuvre dans l'industrie. Sur la base des listes d'interconnexions en déroute, nous procédons à l'analyse des performances d'évaluer le bénéfice de l'architecture 3D par rapport à sa mise en oeuvre 2D. Sur la base du flot de conception 3D proposé en se concentrant sur la vérification temporelle tirant parti de l'avantage du retard négligeable de la structure de microbilles pour les connexions verticales, nous avons mené techniques de partitionnement de NoC 3D basé sur l'architecture MPSoC y compris empilement homogène et hétérogène en utilisant Tezzaron 3D IC technlogy. Conception et mise en oeuvre de compromis dans les deux méthodes de partitionnement est étudiée pour avoir un meilleur aperçu sur l'architecture 3D de sorte qu'il peut être exploitée pour des performances optimales. En utilisant l'approche 3D homogène empilage, NoC topologies est explorée afin d'identifier la meilleure topologie entre la topologie 2D et 3D pour la mise en œuvre MPSoC 3D sous l'hypothèse que les chemins critiques est fondée sur les liens inter-routeur. Les explorations architecturales ont également examiné les différentes technologies de traitement. mettant en évidence l'effet de la technologie des procédés à la performance d'architecture 3D en particulier pour l'interconnexion dominant du design. En outre, nous avons effectué hétérogène 3D d'empilage pour la mise en oeuvre MPSoC avec l'approche GALS de style et présenté plusieurs analyses de conception physiques connexes concernant la conception 3D et la mise en œuvre MPSoC utilisant des outils de CAO 2D. Une analyse plus approfondie de l'effet microbilles pas à la performance de l'architecture 3D à l'aide face-à-face d'empilement est également signalé l'identification des problèmes et des limitations à prendre en considération pendant le processus de conception.In this thesis, we study the exploration 3D NoC architectures through physical design implementations using real 3D technology used in the industry. Based on the proposed 3D design flow focusing on timing verification by leveraging the benefit of negligible delay of microbumps structure for vertical connections, we have conducted partitioning techniques for 3D NoC-based MPSoC architecture including homogeneous and heterogeneous stacking using Tezzaron 3D IC technlogy. Design and implementation trade-off in both partitioning methods is investigated to have better insight about 3D architecture so that it can be exploited for optimal performance. Using homogeneous 3D stacking approach, NoC architectures are explored to identify the best topology between 2D and 3D topology for 3D MPSoC implementation. The architectural explorations have also considered different process technologies highlighting the wire delay effect to the 3D architecture performance especially for interconnect-dominated design. Additionally, we performed heterogeneous 3D stacking of NoC-based MPSoC implementation with GALS style approach and presented several physical designs related analyses regarding 3D MPSoC design and implementation using 2D EDA tools. Finally we conducted an exploration of 2D EDA tool on different 3D architecture to evaluate the impact of 2D EDA tools on the 3D architecture performance. Since there is no commercialize 3D design tool until now, the experiment is important on the basis that designing 3D architecture using 2D EDA tools does not have a strong and direct impact to the 3D architecture performance mainly because the tools is dedicated for 2D architecture design.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Doctor of Philosophy

dissertationCommunication surpasses computation as the power and performance bottleneck in forthcoming exascale processors. Scaling has made transistors cheap, but on-chip wires have grown more expensive, both in terms of latency as well as energy. Therefore, the need for low energy, high performance interconnects is highly pronounced, especially for long distance communication. In this work, we examine two aspects of the global signaling problem. The first part of the thesis focuses on a high bandwidth asynchronous signaling protocol for long distance communication. Asynchrony among intellectual property (IP) cores on a chip has become necessary in a System on Chip (SoC) environment. Traditional asynchronous handshaking protocol suffers from loss of throughput due to the added latency of sending the acknowledge signal back to the sender. We demonstrate a method that supports end-to-end communication across links with arbitrarily large latency, without limiting the bandwidth, so long as line variation can be reliably controlled. We also evaluate the energy and latency improvements as a result of the design choices made available by this protocol. The use of transmission lines as a physical interconnect medium shows promise for deep submicron technologies. In our evaluations, we notice a lower energy footprint, as well as vastly reduced wire latency for transmission line interconnects. We approach this problem from two sides. Using field solvers, we investigate the physical design choices to determine the optimal way to implement these lines for a given back-end-of-line (BEOL) stack. We also approach the problem from a system designer's viewpoint, looking at ways to optimize the lines for different performance targets. This work analyzes the advantages and pitfalls of implementing asynchronous channel protocols for communication over long distances. Finally, the innovations resulting from this work are applied to a network-on-chip design example and the resulting power-performance benefits are reported