Testing for delay defects utilizing test data compression techniques

textAs technology shrinks new types of defects are being discovered and new fault models are being created for those defects. Transition delay and path delay fault models are two such models that have been created, but they still fall short in that they are unable to obtain a high test coverage of smaller delay defects; these defects can cause functional behavior to fail and also indicate potential reliability issues. The first part of this dissertation addresses these problems by presenting an enhanced timing-based delay fault testing technique that incorporates the use of standard delay ATPG, along with timing information gathered from standard static timing analysis. Utilizing delay fault patterns typically increases the test data volume by 3-5X when compared to stuck-at patterns. Combined with the increase in test data volume associated with the increase in gate count that typically accompanies the miniaturization of technology, this adds up to a very large increase in test data volume that directly affect test time and thus the manufacturing cost. The second part of this dissertation presents a technique for improving test compression and reducing test data volume by using multiple expansion ratios while determining the configuration of the scan chains for each of the expansion ratios using a dependency analysis procedure that accounts for structural dependencies as well as free variable dependencies to improve the probability of detecting faults. Finally, this dissertation addresses the problem of unknown values (X’s) in the output response data corrupting the data and degrading the performance of the output response compactor and thus the overall amount of test compression. Four techniques are presented that focus on handling response data with large percentages of X’s. The first uses X-canceling MISR architecture that is based on deterministically observing scan cells, and the second is a hybrid approach that combines a simple X-masking scheme with the X-canceling MISR for further gains in test compression. The third and fourth techniques revolve around reiterative LFSR X-masking, which take advantage of LFSR-encoded masks that can be reused for multiple scan slices in novel ways.Electrical and Computer Engineerin

Testability considerations for implementing an embedded memory subsystem

textThere are a number of testability considerations for VLSI design, but test coverage, test time, accuracy of test patterns and correctness of design information for DFD (Design for debug) are the most important ones in design with embedded memories. The goal of DFT (Design-for-Test) is to achieve zero defects. When it comes to the memory subsystem in SOCs (system on chips), many flavors of memory BIST (built-in self test) are able to get high test coverage in a memory, but often, no proper attention is given to the memory interface logic (shadow logic). Functional testing and BIST are the most prevalent tests for this logic, but functional testing is impractical for complicated SOC designs. As a result, industry has widely used at-speed scan testing to detect delay induced defects. Compared with functional testing, scan-based testing for delay faults reduces overall pattern generation complexity and cost by enhancing both controllability and observability of flip-flops. However, without proper modeling of memory, Xs are generated from memories. Also, when the design has chip compression logic, the number of ATPG patterns is increased significantly due to Xs from memories. In this dissertation, a register based testing method and X prevention logic are presented to tackle these problems. An important design stage for scan based testing with memory subsystems is the step to create a gate level model and verify with this model. The flow needs to provide a robust ATPG netlist model. Most industry standard CAD tools used to analyze fault coverage and generate test vectors require gate level models. However, custom embedded memories are typically designed using a transistor-level flow, there is a need for an abstraction step to generate the gate models, which must be equivalent to the actual design (transistor level). The contribution of the research is a framework to verify that the gate level representation of custom designs is equivalent to the transistor-level design. Compared to basic stuck-at fault testing, the number of patterns for at-speed testing is much larger than for basic stuck-at fault testing. So reducing test and data volume are important. In this desertion, a new scan reordering method is introduced to reduce test data with an optimal routing solution. With in depth understanding of embedded memories and flows developed during the study of custom memory DFT, a custom embedded memory Bit Mapping method using a symbolic simulator is presented in the last chapter to achieve high yield for memories.Electrical and Computer Engineerin

KAPow: A System Identification Approach to Online Per-Module Power Estimation in FPGA Designs

In a modern FPGA system-on-chip design, it is often insufficient to simply assess the total power consumption of the entire circuit by design-time estimation or runtime power rail measurement. Instead, to make better runtime decisions, it is desirable to understand the power consumed by each individual module in the system. In this work, we combine boardlevel power measurements with register-level activity counting to build an online model that produces a breakdown of power consumption within the design. Online model refinement avoids the need for a time-consuming characterisation stage and also allows the model to track long-term changes to operating conditions. Our flow is named KAPow, a (loose) acronym for ‘K’ounting Activity for Power estimation, which we show to be accurate, with per-module power estimates as close to ±5mW of true measurements, and to have low overheads. We also demonstrate an application example in which a permodule power breakdown can be used to determine an efficient mapping of tasks to modules and reduce system-wide power consumption by over 8%

MEMS-Based Terahertz Photoacoustic Chemical Sensing System

Advancements in microelectromechanical system (MEMS) technology over the last several decades has been a driving force behind miniaturizing and improving sensor designs. In this work, a specialized cantilever pressure sensor was designed, modeled, and fabricated to investigate the photoacoustic (PA) response of gases to terahertz (THz) radiation under low-vacuum conditions associated with high-resolution spectroscopy. Microfabricated cantilever devices made using silicon-on-insulator (SOI) wafers were tested in a custom-built test chamber in this first ever demonstration of a cantilever-based PA chemical sensor and spectroscopy system in the THz frequency regime. The THz radiation source was amplitude modulated to excite acoustic waves in the chamber, and PA molecular spectroscopy of a gas species was performed. An optical measurement technique was used to evaluate the PA effect on the cantilever sensor; a laser beam was reflected off the cantilever tip and through an iris to a photodiode. As the cantilever movement deflected the laser beam, the beam was clipped by an iris and generated the PA signal. Experimental data indicated a predominantly linear response in signal amplitude from the photodiode measurement technique, which directly correlated to measured cantilever deflections. Using the custom-designed PA chamber and MEMS cantilever sensor, excellent low-pressure PA spectral data of methyl cyanide (CH3CN) at 2 to 40 mTorr range has been obtained. At low chamber pressures, the sensitivity of our system was 1.97 × 10−5 cm−1 and had an excellent normalized noise equivalent absorption (NNEA) coefficient of 1.39 × 10−9 cm−1 W Hz-½ using a 0.5 s signal averaging time

A broadcast-based test scheme for reducing test size and application time

[[abstract]]We present efficient method for reducing test application time by broadcasting test configuration. We compare our method based on single, multiple, 1-1 in-order mapping, even distribution, nearest signal probability matching, and in-order pseudo-exhaustive method. The results of our experiments indicate that our method reducing the test pattern number and the test application time by running the ATPG tool provided by SIS.[[conferencedate]]20060521~20060524[[conferencelocation]]Island of Kos, Greec

Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka