3,444 research outputs found
On Mitigation of Side-Channel Attacks in 3D ICs: Decorrelating Thermal Patterns from Power and Activity
Various side-channel attacks (SCAs) on ICs have been successfully
demonstrated and also mitigated to some degree. In the context of 3D ICs,
however, prior art has mainly focused on efficient implementations of classical
SCA countermeasures. That is, SCAs tailored for up-and-coming 3D ICs have been
overlooked so far. In this paper, we conduct such a novel study and focus on
one of the most accessible and critical side channels: thermal leakage of
activity and power patterns. We address the thermal leakage in 3D ICs early on
during floorplanning, along with tailored extensions for power and thermal
management. Our key idea is to carefully exploit the specifics of material and
structural properties in 3D ICs, thereby decorrelating the thermal behaviour
from underlying power and activity patterns. Most importantly, we discuss
powerful SCAs and demonstrate how our open-source tool helps to mitigate them.Comment: Published in Proc. Design Automation Conference, 201
Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits
Three dimensional integrated circuits (3D ICs) have been acknowledged as a promising technology to overcome the interconnect delay bottleneck brought by continuous CMOS scaling. Recent research shows that through-silicon-vias (TSVs), which act as vertical links between layers, pose yield and reliability challenges for 3D design. This thesis presents three original contributions.The first contribution presents a grouping-based technique to improve the yield of 3D ICs under manufacturing TSV defects, where regular and redundant TSVs are partitioned into groups. In each group, signals can select good TSVs using rerouting multiplexers avoiding defective TSVs. Grouping ratio (regular to redundant TSVs in one group) has an impact on yield and hardware overhead. Mathematical probabilistic models are presented for yield analysis under the influence of independent and clustering defect distributions. Simulation results using MATLAB show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratio results in achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios. The second contribution presents an efficient online fault tolerance technique based on redundant TSVs, to detect TSV manufacturing defects and address thermal-induced reliability issue. The proposed technique accounts for both fault detection and recovery in the presence of three TSV defects: voids, delamination between TSV and landing pad, and TSV short-to-substrate. Simulations using HSPICE and ModelSim are carried out to validate fault detection and recovery. Results show that regular and redundant TSVs can be divided into groups to minimise area overhead without affecting the fault tolerance capability of the technique. Synthesis results using 130-nm design library show that 100% repair capability can be achieved with low area overhead (4% for the best case). The last contribution proposes a technique with joint consideration of temperature mitigation and fault tolerance without introducing additional redundant TSVs. This is achieved by reusing spare TSVs that are frequently deployed for improving yield and reliability in 3D ICs. The proposed technique consists of two steps: TSV determination step, which is for achieving optimal partition between regular and spare TSVs into groups; The second step is TSV placement, where temperature mitigation is targeted while optimizing total wirelength and routing difference. Simulation results show that using the proposed technique, 100% repair capability is achieved across all (five) benchmarks with an average temperature reduction of 75.2? (34.1%) (best case is 99.8? (58.5%)), while increasing wirelength by a small amount
Appearance-and-Relation Networks for Video Classification
Spatiotemporal feature learning in videos is a fundamental problem in
computer vision. This paper presents a new architecture, termed as
Appearance-and-Relation Network (ARTNet), to learn video representation in an
end-to-end manner. ARTNets are constructed by stacking multiple generic
building blocks, called as SMART, whose goal is to simultaneously model
appearance and relation from RGB input in a separate and explicit manner.
Specifically, SMART blocks decouple the spatiotemporal learning module into an
appearance branch for spatial modeling and a relation branch for temporal
modeling. The appearance branch is implemented based on the linear combination
of pixels or filter responses in each frame, while the relation branch is
designed based on the multiplicative interactions between pixels or filter
responses across multiple frames. We perform experiments on three action
recognition benchmarks: Kinetics, UCF101, and HMDB51, demonstrating that SMART
blocks obtain an evident improvement over 3D convolutions for spatiotemporal
feature learning. Under the same training setting, ARTNets achieve superior
performance on these three datasets to the existing state-of-the-art methods.Comment: CVPR18 camera-ready version. Code & models available at
https://github.com/wanglimin/ARTNe
- …