Algorithms for DFM in electronic design automation

As the dimension of features in integrated circuits (IC) keeps shrinking to fulfill Moore’s law, the manufacturing process has no choice but confronting the limit of physics at the expense of design flexibility. On the other hand, IC designs inevitably becomes more complex to meet the increasing demand of computational power. To close this gap, design for manufacturing (DFM) becomes the key to enable an easy and low-cost IC fabrication. Therefore, efficient electronic design automation (EDA) algorithms must be developed for DFM to address the design constraints and help the designers to better facilitate the manufacture process. As the core of manufacturing ICs, conventional lithography systems (193i) reach their limit for the 22 nm technology node and beyond. Consequently, several advanced lithography techniques are proposed, such as multiple patterning lithography (MPL), extreme ultra-violet lithography (EUV), electron beam (E-beam), and block copolymer directed self-assembly (DSA); however, DFM algorithms are essential for them to achieve better printability of a design. In this dissertation, we focus on analyzing the compatibility of designs and various advanced lithography techniques, and develop efficient algorithms to enable the manufacturing. We first explore E-Beam, one of the promising candidates for IC fabrication beyond the 10 nm technology node. To address its low throughput issue, the character projection technique has been proposed, and its stencil planning can be optimized with an awareness of overlapping characters. 2D stencil planning is proved NP-Hard. With the assumption of standard cells, the 2D problem can be partitioned into 1D row ordering subproblems; however, it is also considered hard, and no efficient optimal solution has been provided so far. We propose a polynomial time optimal algorithm to solve the 1D row ordering problem, which serves as the major subroutine for the entire stencil planning problem. Technical proofs and experimental results verify that our algorithm is efficient and indeed optimal. As the most popular and practical lithography technique, MPL utilizes multiple exposures to print a single layout and thus allows placement of features within the minimum distance. Therefore, a feasible decomposition of the layout is a must to adopt MPL, and it is usually formulated as a graph k-coloring problem, which is computationally difficult for k > 2. We study the k-colorability of rectangular and diagonal grid graphs as induced subgraphs of a rectangular or diagonal grid respectively, since it has direct applications in printing contact/via layouts. It remains an open question on how hard it is to color grid graphs due to their regularity and sparsity. In this dissertation, we conduct a complete analysis of the k-coloring problems on rectangular and diagonal grid graphs, and particularly the NP-completeness of 3-coloring on a diagonal grid graph is proved. In practice, we propose an exact 3-coloring algorithm for those graphs and conduct experiments to verify its performance and effectiveness. Besides, we also develop an efficient algorithm for model based MPL, because it is more expensive but accurate than the rule based decomposition. As one of the alternative lithography techniques, block copolymer directed self-assembly (DSA) is studied. It has emerged as a low-cost, high- throughput option in the pursuit of alternatives to traditional optical lithography. However, issues of defectivity have hampered DSA’s viability for large-scale patterning. Recent studies have shown the copolymer fill level to be a crucial factor in defectivity, as template overfill can result in malformed DSA structures and poor LCDU after etching. For this reason, the use of sub-DSA resolution assist features (SDRAFs) as a method of evening out template density has been demonstrated. In this dissertation, we propose an algorithm to place SDRAFs in random logic contact/via layouts. By adopting this SDRAF placement scheme, we can significantly improve the density unevenness and the resources used are also optimized. We also apply our knowledge in coloring grid graphs to the problem of group-and-coloring in DSA-MPL hybrid lithography. We derive a solution to group-3-coloring and prove the NP-completeness of grouping-2-coloring

VLSI Routing for Advanced Technology

Routing is a major step in VLSI design, the design process of complex integrated circuits (commonly known as chips). The basic task in routing is to connect predetermined locations on a chip (pins) with wires which serve as electrical connections. One main challenge in routing for advanced chip technology is the increasing complexity of design rules which reflect manufacturing requirements. In this thesis we investigate various aspects of this challenge. First, we consider polygon decomposition problems in the context of VLSI design rules. We introduce different width notions for polygons which are important for width-dependent design rules in VLSI routing, and we present efficient algorithms for computing width-preserving decompositions of rectilinear polygons into rectangles. Such decompositions are used in routing to allow for fast design rule checking. A main contribution of this thesis is an O(n) time algorithm for computing a decomposition of a simple rectilinear polygon with n vertices into O(n) rectangles, preseverving two-dimensional width. Here the two-dimensional width at a point of the polygon is defined as the edge length of a largest square that contains the point and is contained in the polygon. In order to obtain these results we establish a connection between such decompositions and Voronoi diagrams. Furthermore, we consider implications of multiple patterning and other advanced design rules for VLSI routing. The main contribution in this context is the detailed description of a routing approach which is able to manage such advanced design rules. As a main algorithmic concept we use multi-label shortest paths where certain path properties (which model design rules) can be enforced by defining labels assigned to path vertices and allowing only certain label transitions. The described approach has been implemented in BonnRoute, a VLSI routing tool developed at the Research Institute for Discrete Mathematics, University of Bonn, in cooperation with IBM. We present experimental results confirming that a flow combining BonnRoute and an external cleanup step produces far superior results compared to an industry standard router. In particular, our proposed flow runs more than twice as fast, reduces the via count by more than 20%, the wiring length by more than 10%, and the number of remaining design rule errors by more than 60%. These results obtained by applying our multiple patterning approach to real-world chip instances provided by IBM are another main contribution of this thesis. We note that IBM uses our proposed combined BonnRoute flow as the default tool for signal routing

DSA-aware multiple patterning for the manufacturing of vias: Connections to graph coloring problems, IP formulations, and numerical experiments

In this paper, we investigate the manufacturing of vias in integrated circuits with a new technology combining lithography and Directed Self Assembly (DSA). Optimizing the production time and costs in this new process entails minimizing the number of lithography steps, which constitutes a generalization of graph coloring. We develop integer programming formulations for several variants of interest in the industry, and then study the computational performance of our formulations on true industrial instances. We show that the best integer programming formulation achieves good computational performance, and indicate potential directions to further speed-up computational time and develop exact approaches feasible for production

Design automation algorithms for advanced lithography

In circuit manufacturing, as the technology nodes keep shrinking, conventional 193 nm immersion lithography (193i) has reached its printability limit. To continue the scaling with Moore's law, different kinds of advanced lithography have been proposed, such as multiple patterning lithography (MPL), extreme ultraviolet (EUV), electron beam lithography (EBL) and directed self-assembly (DSA). While these new technologies create enormous opportunities, they also pose great design challenges due to their unique process characteristics and stringent constraints. In order to smoothly adopt these advanced lithography technologies in integrated circuit (IC) fabrication, effective electronic design automation (EDA) algorithms must be designed and integrated into computer-aided design (CAD) tools to address the underlying design constraints and help the circuit designer to better facilitate the lithography process. In this thesis, we focus on algorithmic design and efficient implementation of EDA algorithm for advanced lithography, including directed self-assembly (DSA) and self-aligned double patterning (SADP), to conquer the physical challenges and improve the manufacturing yield. The first advanced lithography technology we explore is self-aligned double patterning (SADP). SADP has the significant advantage over traditional litho-etch-litho-etch (LELE) double patterning in its ability to eliminate overlay, making it a preferable DPL choice for the 14 nm technology node. As in any DPL technology, layout decomposition is the key problem. While the layout decomposition problem for LELE DPL has been well studied in the literature, only a few attempts have been made for the SADP layout decomposition problem. This thesis studies the SADP decomposition problem in different scenarios. SADP has been successfully deployed in 1D patterns and has several applications; however, applying it to 2D patterns turns out to be much more difficult. All previous exact algorithms were based on computationally expensive methods such as SAT or ILP. Other previous algorithms were heuristics without a guarantee that an overlay-free solution can be found even if one exists. The SADP decomposition problem on general 2D layout is proven to be NP-complete. However, we show that if we restrict the overlay, the problem is polynomial-time solvable, and present an exact algorithm to determine if a given 2D layout has a no-overlay SADP decomposition. When designing the layout decomposition algorithms, it is usually useful to take the layout structure into consideration. As most of the current IC layouts adopt a row-based standard cell design style, we can take advantage of its characteristics and design more efficient algorithms compared to the algorithms for general 2D patterns. In particular, the fixed widths of standard cells and power tracks on top and bottom of cells suggest that improvements can be made over the algorithms for general decomposition problem. We present a shortest-path based polynomial time SADP decomposition algorithm for row-based standard cell layout that efficiently finds decompositions with minimum overlay violations. Our proposed algorithm takes advantage of the fixed width of the cells and the alternating power tracks between the rows to limit the possible decompositions and thus achieve high efficiency. The next advanced lithography technology we discuss in the thesis is directed self-assembly (DSA). Block copolymer directed self-assembly (DSA) is a promising technique for patterning contact holes and vias in 7 nm technology nodes. To pattern contacts/vias with DSA, guiding templates are usually printed first with conventional lithography (193i) that has a coarser pitch resolution. Contact holes are then patterned with DSA process. The guiding templates play the role of defining the DSA patterns, which have a finer resolution than the templates. As a result, different patterns can be obtained through controlling the templates. It is shown that DSA lithography is very promising in patterning contacts/vias in 7 nm technology node. However, to utilize DSA for full-chip manufacturing, EDA for DSA must be fully explored because EDA is the key enabler for manufacturing, and the EDA research for DSA is still lagging behind. To pattern the contact layer with DSA, we must ensure that all the contacts in the layout require only feasible DSA templates. Nevertheless, the original layout may not be designed in a DSA-friendly way. However, even with an optimized library, infeasible templates may be introduced after the physical design phase. We propose a simulated-annealing (SA) based scheme to perform full-chip level contact layer optimization. According to the experimental results, the DSA conflicts in the contact layer are reduced by close to 90% on average after applying the proposed optimization algorithm. It is a current trend that industry is transiting from the random 2D designs to highly regular 1D gridded designs for sub-20 nm nodes and fabricating circuit designs with print-cut technology. In this process, the randomly distributed cuts may be too dense to be printed by single patterning lithography. DSA has proven its success in contact hole patterning, and can be easily expanded to cut printing for 1D gridded designs. Nevertheless, the irregular distribution of cuts still presents a great challenge for DSA, as the self-assembly process usually forms regular patterns. As a result, the cut layer must be optimized for the DSA process. To address the above problem, we propose an efficient algorithm to optimize cut layers without hurting the original circuit logic. Our work utilizes a technique called `line-end extension' to move the cuts and extend the functional wires without changing the original functionality of the circuit. Consequently, the cuts can be redistributed and grouped into valid DSA templates. Multiple patterning lithography has been widely adopted for today's circuit manufacturing. However, increasing the number of masks will make the manufacturing process more expensive. By incorporating DSA into the multiple patterning process, it is possible to reduce the number of masks and achieve a cost-effective solution. We study the decomposition problem for the contact layer in row-based standard cell layout with DSA-MP complementary lithography. We explore several heuristic-based approaches, and propose an algorithm that decomposes a standard cell row optimally in polynomial-time. Our experiments show that our algorithm is guaranteed to find a minimum cost solution if one exists, while the heuristic cannot or only finds a sub-optimal solution. Our results show that the DSA-MP complementary approach is very promising for the future advanced nodes. As in any lithography technique, the process variation control and proximity correction are the most important issues. As the DSA templates are patterned by conventional lithography, the patterned templates are prone to deviate from mask shapes due to process variations, which will ultimately affect the contacts after the DSA process even for the same type of template. Therefore, in order to enable the DSA technology in contact/via layer printing, it is extremely important to accurately model and detect hotspots, as well as estimate the contact pitch and locations during the verification phase. We propose a machine learning based design automation framework for DSA verification. A novel DSA model and a set of features are included. We implemented the proposed ML-based flow and performed extensive experiments on comparing the performances of learning algorithms and features. The experimental results show that our approach is much more efficient than the traditional approach, and can produce highly accurate results

Analog layout design automation: ILP-based analog routers

The shrinking design window and high parasitic sensitivity in the advanced technology have imposed special challenges on the analog and radio frequency (RF) integrated circuit design. In this thesis, we propose a new methodology to address such a deficiency based on integer linear programming (ILP) but without compromising the capability of handling any special constraints for the analog routing problems. Distinct from the conventional methods, our algorithm utilizes adaptive resolutions for various routing regions. For a more congested region, a routing grid with higher resolution is employed, whereas a lower-resolution grid is adopted to a less crowded routing region. Moreover, we strengthen its speciality in handling interconnect width control so as to route the electrical nets based on analog constraints while considering proper interconnect width to address the acute interconnect parasitics, mismatch minimization, and electromigration effects simultaneously. In addition, to tackle the performance degradation due to layout dependent effects (LDEs) and take advantage of optical proximity correction (OPC) for resolution enhancement of subwavelength lithography, in this thesis we have also proposed an innovative LDE-aware analog layout migration scheme, which is equipped with our special routing methodology. The LDE constraints are first identified with aid of a special sensitivity analysis and then satisfied during the layout migration process. Afterwards the electrical nets are routed by an extended OPC-inclusive ILP-based analog router to improve the final layout image fidelity while the routability and analog constraints are respected in the meantime. The experimental results demonstrate the effectiveness and efficiency of our proposed methods in terms of both circuit performance and image quality compared to the previous works

Design Rules in VLSI Routing

One of the last major steps in the design of highly integrated circuits (VLSI design) is routing. The task of routing is to compute disjoint sets of wires connecting different parts of a chip in order to realize the desired electrical connectivity. Design rules define restrictions on the minimum distance and geometry of metal shapes. The intent of most design rules is to forbid patterns that cannot be manufactured well in the lithographic production process. This process has become extremely difficult with the current small feature sizes of 32 nm and below, which are still being manufactured using 193 nm wavelength technology. Because of this, the design rules of modern technologies have become very complex, and computing a routing with a sufficiently low number of design rule violations is a difficult task for automated routing tools. In this thesis we present in detail how design rules can be handled efficiently. We develop an appropriate design rule model which considerably reduces complexity while not being too restrictive. This involves mapping complex polygon-based rules to simpler rectangle-based rules and building equivalence classes of shapes with respect to their minimum distance requirements. Our model enables efficient checking of minimum distance rules, which has to be done dozens of times in each routing run. We also discuss efficient data structures that are necessary to achieve this. We implemented our design rule model within BonnRoute, the routing tool of the BonnTools, a software package for VLSI physical design developed at the Research Institute for Discrete Mathematics at the University of Bonn in cooperation with IBM. The result is a new module of BonnRoute, called BonnRoutRules, which computes this design rule model and embeds BonnRoute in the complex routing environment of current technologies. The BonnRouteRules module was a key part in enabling BonnRoute to route current 32 nm and 22 nm chips. We describe the combined routing flow used by IBM in practice, in which BonnRoute solves the main routing task and an industrial standard router is used for postprocessing. We present detailed experimental results of this flow on real-world designs. The results show that this combined flow produces routings with almost no remaining design rule violations, which proves that our design rule model works well in practice. Furthermore, compared to the industrial standard router alone, the combination with BonnRoute provides several significant benefits: It has 24% less runtime, 5% less wiring length, and over 90% less detours, which shows that with this flow we have an excellent routing tool in practice

Nonlinear opinion models and other networked systems

Networks play a critical role in many physical, biological, and social systems. In this thesis, we investigate tools to model and analyze networked systems. We first examine some of the ways in which we can model social dynamics that take place on networks. We then study two recently developed data-analysis methods that employ a network framework and explore new ways in which they can be used to find meaningful signals in large data sets. In the first half of the thesis, we study opinion dynamics on networks. We begin by examining a class of opinion models, known as coevolving voter models (CVM), that couple the mechanisms of opinion formation and changing social connections. We then propose a version of CVMs that incorporates nonlinearity. In our models, we assume that individuals strive to achieve harmony and avoid disagreement, both by changing their social connections to reflect their opinions and by changing their opinions to reflect their social connections. By taking a minimalist approach to modeling social dynamics, we hope to gain a deeper understanding of how these two mechanisms can give rise to social phenomena such as the ``majority illusion''. Comparing several versions of CVMs, we find that seemingly small changes in update rules can lead to strikingly different behaviors. A particularly interesting feature of our nonlinear CVMs is that, under certain conditions, the opinion state that is held initially by a minority of the nodes can effectively spread to almost every node in a network if the minority nodes view themselves as the majority. We then discuss an ongoing project that involves another class of opinion models called bounded-confidence models. Specifically, we examine extensions of bounded-confidence models on hypergraphs and discuss some preliminary findings. In the second half of the thesis, we study problems in data analysis. We begin by considering topological structures as a tool to study integrated circuit (IC) devices. In particular, we examine a problem in the design and manufacturing of IC devices using topological data analysis (TDA), which is based on network structures called simplicial complexes. Failures in IC devices generally occur near the tolerance limits of photolithography systems, such as at the minimum separation distance between adjacent electronic components. However, for complex arrangements of electronic components, simply ensuring minimal separation is insufficient to guarantee that one can manufacture an IC design accurately and reliably. We apply tools from TDA to compare data from IC designs. Without inputting domain knowledge, we are able to infer several results about the IC design-manufacturing process. Finally, we discuss an ongoing project in the analysis of network data. Specifically, we explore applications of a recently developed algorithm called network dictionary learning (NDL) and discuss problems of network reconstruction and denoising using NDL on both synthetic and real-world networks

Fundamental Limits of Nanophotonic Design

Nanoscale fabrication techniques, computational inverse design, and fields from silicon photonics to metasurface optics are enabling transformative use of an unprecedented number of structural degrees of freedom in nanophotonics. A critical need is to understand the extreme limits to what is possible by engineering nanophotonic structures. This thesis establishes the first general theoretical framework identifying fundamental limits to light--matter interactions. It derives bounds for applications across nanophotonics, including far-field scattering, optimal wavefront shaping, optical beam switching, and wave communication, as well as the miniaturization of optical components, including perfect absorbers, linear optical analog computing units, resonant optical sensors, multilayered thin films, and high-NA metalenses. The bounds emerge from an infinite set of physical constraints that have to be satisfied by polarization fields in response to an excitation. The constraints encode power conservation in single-scenario scattering and requisite field correlations in multi-scenario scattering. The framework developed in this thesis, encompassing general linear wave scattering dynamics, offers a new way to understand optimal designs and their fundamental limits, in nanophotonics and beyond.Comment: PhD thesi

RAPID-PROTOTYPING OF PDMS-BASED MICROFLUIDIC DEVICES

Microfluidics uses the manipulation of fluids in microchannels to accomplish innumerous goals, and is attractive to analytical chemistry because it can reduce the scale of larger analytical processes. The benefits of the use of microfluidic systems, in comparison with conventional processes, include efficient sample and reagent consumption, low power usage and portability. Most microfluidic applications require a development process based on iterative design and testing of multiple prototype microdevices. Typical microfabrication protocols, however, can require over a week of specialist time in high-maintenance cleanroom facilities, making the iterative process resource-intensive and prohibitive in many locations. Rapid prototyping techniques can alleviate these issues, enabling faster development of microfluidic structures at lower costs. Print-and-peel techniques (PAP), including wax printing and xurography, are low-cost fast-prototyping tools used to create master molds for polydimethylsiloxane (PDMS) miniaturized systems. In this work, three different methods were created to improve the rapid-prototyping of PDMS-based microfluidic devices. Using the wax printing method, PDMS microdevices can now be fabricated from design to testing in less than 1 hour, at the cost of $0.01 per mold, being one of the fastest and cheapest methods to date. If extensive fluidic manipulation is required, xurography becomes the method of choice. The xurography technique presented here is the most rapid tool to fabricate PDMS-based microdevices to date, presenting turnaround times as fast as 5 minutes. The first hybrid technique that can be used either as a PAP or a scaffolding method is also presented here, using the same materials and fabrication process. The green, low-cost, user-friendly elastomeric (GLUE) rapid prototyping method to fabricate PDMS-based devices uses white glue as the patterning material, and is capable of fabricating multi-height molds in a single step, improving even further the development of PDMS microfluidic devices. Device fabrication is only one of the steps in the iterative process of designing a fully-functional microfluidic tool. The design of the microdevice itself plays a crucial role in its performance, which directly impacts processes conducted in miniaturized devices. In this work, the influence of hydrodynamic resistance in sample dispersion on a microfluidic multiplexer was studied using paper-based analytical microfluidic devices (µPADs) as the testbed. When microfluidic devices are not rationally designed, and when the influence of fluidic resistance is not taken into account, sample dispersion can be biased. A bias can influence the output of colorimetric enzymatic assays supported on these microstructures, which are the most common applications of µPADs, demonstrating the need for rational design of microdevices. The third essential component of developing microfluidic devices is their effective testing, especially when incorporating active pumping elements on-chip. To overcome issues in the manual operation or coding for operation of microvalves, a program that can automatically generate sequences for fluidic manipulation in microfluidic processors was written in Python, with the only inputs required from the user being reservoir positions, mixing ratio and the desired input and output reservoirs. To further improve testing and avoid the use of fixed mounts, a modular system was created to aid the testing of devices with different designs, another advance in the area. This research enables better design and testing of microfluidic devices in shorter times and at lower costs, enabling improvements in the interfacing between different unit operations on-chip, a challenge in the microfluidics area. More than that, it also makes this area, traditionally confined into expensive cleanroom facilities, available to more research groups worldwide.Ph.D