Studies on Core-Based Testing of System-on-Chips Using Functional Bus and Network-on-Chip Interconnects

The tests of a complex system such as a microprocessor-based system-onchip (SoC) or a network-on-chip (NoC) are difficult and expensive. In this thesis, we propose three core-based test methods that reuse the existing functional interconnects-a flat bus, hierarchical buses of multiprocessor SoC's (MPSoC), and a N oC-in order to avoid the silicon area cost of a dedicated test access mechanism (TAM). However, the use of functional interconnects as functional TAM's introduces several new problems. During tests, the interconnects-including the bus arbitrator, the bus bridges, and the NoC routers-operate in the functional mode to transport the test stimuli and responses, while the core under tests (CUT) operate in the test mode. Second, the test data is transported to the CUT through the functional bus, and not directly to the test port. Therefore, special core test wrappers that can provide the necessary control signals required by the different functional interconnect are proposed. We developed two types of wrappers, one buffer-based wrapper for the bus-based systems and another pair of complementary wrappers for the NoCbased systems. Using the core test wrappers, we propose test scheduling schemes for the three functionally different types of interconnects. The test scheduling scheme for a flat bus is developed based on an efficient packet scheduling scheme that minimizes both the buffer sizes and the test time under a power constraint. The schedulingscheme is then extended to take advantage of the hierarchical bus architecture of the MPSoC systems. The third test scheduling scheme based on the bandwidth sharing is developed specifically for the NoC-based systems. The test scheduling is performed under the objective of co-optimizing the wrapper area cost and the resulting test application time using the two complementary NoC wrappers. For each of the proposed methodology for the three types of SoC architec .. ture, we conducted a thorough experimental evaluation in order to verify their effectiveness compared to other methods

Test Planning for 3D SICs using ILP

In this paper we propose a test planning scheme for corebased 3D stacked integrated circuits where the total test cost for wafer sort of each individual chip and the test cost of the complete stack at package test is minimized. We use an Integer Linear Programming (ILP) model to find the optimal test cost, which is given as the weighted sum of the test time and the test access mechanism (TAM). As ILP is time consuming, we use a scheme to bound the test time and the TAM such that the search space is reduced. The proposed bounding scheme and the ILP model were applied on several ITC’02 benchmarks and the results show that optimal solutions were obtained at low computation time

Measuring CADeT Performance by Means of FITTest _BENCH06 Benchmark Circuits

Benchmark circuits provide a basis for both research institutions and industry to measure their methods and products against. This paper focuses on utilization of recently published FITTest _BENCH06 benchmarks for measuring quality of our novel academic design for testability tool called CADeT. The paper presents basic characteristics of benchmarks and CADeT tool, provides results and analysis of implementing individual testing techniques and their constraint-driven combination to particular benchmarks

Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits

Three dimensional integrated circuits (3D ICs) have been acknowledged as a promising technology to overcome the interconnect delay bottleneck brought by continuous CMOS scaling. Recent research shows that through-silicon-vias (TSVs), which act as vertical links between layers, pose yield and reliability challenges for 3D design. This thesis presents three original contributions.The first contribution presents a grouping-based technique to improve the yield of 3D ICs under manufacturing TSV defects, where regular and redundant TSVs are partitioned into groups. In each group, signals can select good TSVs using rerouting multiplexers avoiding defective TSVs. Grouping ratio (regular to redundant TSVs in one group) has an impact on yield and hardware overhead. Mathematical probabilistic models are presented for yield analysis under the influence of independent and clustering defect distributions. Simulation results using MATLAB show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratio results in achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios. The second contribution presents an efficient online fault tolerance technique based on redundant TSVs, to detect TSV manufacturing defects and address thermal-induced reliability issue. The proposed technique accounts for both fault detection and recovery in the presence of three TSV defects: voids, delamination between TSV and landing pad, and TSV short-to-substrate. Simulations using HSPICE and ModelSim are carried out to validate fault detection and recovery. Results show that regular and redundant TSVs can be divided into groups to minimise area overhead without affecting the fault tolerance capability of the technique. Synthesis results using 130-nm design library show that 100% repair capability can be achieved with low area overhead (4% for the best case). The last contribution proposes a technique with joint consideration of temperature mitigation and fault tolerance without introducing additional redundant TSVs. This is achieved by reusing spare TSVs that are frequently deployed for improving yield and reliability in 3D ICs. The proposed technique consists of two steps: TSV determination step, which is for achieving optimal partition between regular and spare TSVs into groups; The second step is TSV placement, where temperature mitigation is targeted while optimizing total wirelength and routing difference. Simulation results show that using the proposed technique, 100% repair capability is achieved across all (five) benchmarks with an average temperature reduction of 75.2? (34.1%) (best case is 99.8? (58.5%)), while increasing wirelength by a small amount

Synthesis for circuit reliability

textElectrical and Computer Engineerin

Proactive model to determine information technologies supporting expansion of air cargo network

Shippers and recipients expect transportation companies to provide more than just the movement of a package between points; certain information must be available to them as well, to enable forecasts and plans within the supply chain. The transportation companies also need the information flow that undergirds a transportation grid, to support ad-hoc routing and strategic structural re-alignment of business processes. This research delineates the information needs for an expanding air cargo network, then develops a new model of the information technologies needed to support expansion into a new country. The captured information will be used by shippers, recipients, and the transportation provider to better guide business decisions. This model will provide a method for transportation companies to balance the tradeoffs between the operating efficiencies, capital expenditures, and customer expectations of their IT systems. The output of the model is a list of technologies – optimized by cost – which meet the specific needs of internal and external customers when expanding air cargo networks into a new country

Experiments applications guide: Advanced Communications Technology Satellite (ACTS)

This applications guide first surveys the capabilities of the Advanced Communication Technology Satellite (ACTS) system (both the flight and ground segments). This overview is followed by a description of the baseband processor (BBP) and microwave switch matrix (MSM) operating modes. Terminals operating with the baseband processor are referred to as low burst rate (LBR); and those operating with the microwave switch matrix, as high burst rate (HBR). Three very small-aperture terminals (VSATs), LBR-1, LBR-2, and HBR, are described for various ACTS operating modes. Also described is the NASA Lewis link evaluation terminal. A section on ACTS experiment opportunities introduces a wide spectrum of network control, telecommunications, system, and scientific experiments. The performance of the VSATs is discussed in detail. This guide is intended as a catalyst to encourage participation by the telecommunications, business, and science communities in a broad spectrum of experiments

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka

A novel scan segmentation design method for avoiding shift timing failure in scan testing

ITC : 2011 IEEE International Test Conference , 20-22 Sep. 2011 , Anaheim, CA, USAHigh power consumption in scan testing can cause undue yield loss which has increasingly become a serious problem for deep-submicron VLSI circuits. Growing evidence attributes this problem to shift timing failures, which are primarily caused by excessive switching activity in the proximities of clock paths that tends to introduce severe clock skew due to IR-drop-induced delay increase. This paper is the first of its kind to address this critical issue with a novel layout-aware scheme based on scan segmentation design, called LCTI-SS (Low-Clock-Tree-Impact Scan Segmentation). An optimal combination of scan segments is identified for simultaneous clocking so that the switching activity in the proximities of clock trees is reduced while maintaining the average power reduction effect on conventional scan segmentation. Experimental results on benchmark and industrial circuits have demonstrated the advantage of the LCTI-SS scheme