Design and Analysis of Power Distribution Networks in VLSI Circuits.

Rapidly switching currents of the on-chip devices can cause fluctuations in the supply voltage which can be classified as IR and Ldi/dt drops. The voltage fluctuations in a supply network can inject noise in a circuit which may lead to functional failures of the design. Power supply integrity verification is, therefore, a critical concern in high-performance designs. Also, with decreasing supply voltages, gate-delay is becoming increasingly sensitive to supply voltage variation. With ever-diminishing clock periods, accurate analysis of the impact of supply voltage on circuit performance has also become critical. Increasing power consumption and clock frequency have exacerbated the Ldi/dt drop in every new technology generation. The Ldi/dt drop has become the dominant portion of the overall supply-drop in high performance designs. On-die passive decap, which has traditionally been used for suppressing Ldi/dt, has become expensive due to its area and leakage power overhead. This has created an urgent need for novel circuit techniques to suppress the Ldi/dt drop in power distribution networks. We provide accurate algorithmic solutions for determining the worst-case supply-drop and the impact of supply noise on circuit performance. We propose a path-based and a block-based approach for computing the maximum circuit delay under power supply fluctuations. We also propose an early-mode supply-drop estimation approach and a statistical approach for power grid analysis. All the proposed approaches are vectorless and account for both IR and Ldi/dt drops. We also propose a performance-aware decoupling capacitance allocation technique which uses timing slacks to drive the optimization. Finally, we present analog as well as all-digital circuit techniques for inductive supply noise suppression. The proposed all-digital circuit techniques were implemented in a test-chip, fabricated in a 0.13µm CMOS process. Measurements on the test-chip demonstrate a reduction in the supply fluctuations by 57% for a ramp loads and by 75% during resonance. We also present a low-power, all-digital on-chip oscilloscope for accurate measurement of supply noise. Supply noise measurements obtained from the on-chip oscilloscope were validated to conform well to those obtained from a traditional supply-drop monitor and direct on-chip probing.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/58508/1/spant_1.pd

VLSI Design

This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc

Design of Low-Cost Energy Harvesting and Delivery Systems for Self-Powered Devices: Application to Authentication IC

This thesis investigates the development of low-cost energy harvesting and delivery systems for low-power low-duty-cycle devices. Initially, we begin by designing a power management scheme for on-demand power delivery. The baseline implementation is also used to identify critical challenges for low-power energy harvesting. We further propose a robust self-powered energy harvesting and delivery system (EHDS) design as a solution to achieve energy autonomy in standalone systems. The design demonstrates a complete ecosystem for low-overhead pulse-frequency modulated (PFM) harvesting while reducing harvesting window confinement and overall implementation footprint. Two transient-based models are developed for improved accuracy during design space exploration and optimization for both PFM power conversion and energy harvesting. Finally, a low-power authentication IC is demonstrated and projected designs for self-powered System-on-Chips (SoCs) are presented. The proposed designs are proto-typed in two test-chips in a 65nm CMOS process and measurement data showcase improved performance in terms of battery power, cold-start duration, passives (inductance and capacitance) needed, and end-to-end harvesting/conversion efficiency.Ph.D

Circuit and System Level Design Optimization for Power Delivery And Management

As the VLSI technology scales to the nanometer scale, power consumption has become a critical design concern of VLSI circuits. Power gating and dynamic voltage and frequency scaling (DVFS) are two effective power management techniques that are widely utilized in modern chip designs. Various design challenges merge with these power management techniques in nanometer VLSI circuits. For example, power gating introduces unique power integrity issues and trade-offs between switching noise and rush current noise. Assuring power integrity and achieving power efficiency are two highly intertwined design challenges. In addition, these trade-offs significantly vary with the supply voltage. It is difficult to use conventional power-gated power delivery networks (PDNs) to fully meet the involved conflicting design constraints while maximizing power saving and minimizing supply noise. The DVFS controller and the DC-DC power converter are two highly intertwining enablers for DVFS-based systems. However, traditional DVFS techniques treat the design optimizations of the two as separate tasks, giving rise to sub-optimal designs. To address the above research challenges, we propose several circuit and system level design optimization techniques in this dissertation. For power-gated PDN designs, we propose systemic decoupling capacitor (decap) optimization strategies that optimally trade-off between power integrity and leakage saving. First, new global decap and re-routable decap design concepts are proposed to relax the tight interaction between power integrity and leakage power saving of power-gated PDN at a single supply voltage level. Furthermore, we propose to leverage re-routable decaps to provide flexible decap allocation structures to better suit multiple supply voltage levels. The proposed strategies are implemented in an automatic design flow for choosing optimal amount of local decaps, global decaps and re-routable decaps. The proposed techniques significantly increase leakage saving without jeopardizing power integrity. The flexible decap allocations enabled by re-routable decaps lead to optimal design trade-offs for PDNs operating with two supply voltage levels. To improve the effectiveness of DVFS, we analyze the drawbacks of circuit-level only and policy-level only optimizations and the promising opportunities resulted from the cross-layer co-optimization of the DC-DC converter and online learning based DVFS polices. We present a cross-layer approach that optimizes transition time, area, energy overhead of the DC-DC converter along with key parameters of an online learning DVFS controller. We systematically evaluate the benefits of the proposed co-optimization strategy based on several processor architectures, namely single and dual-core processors and processors with DVFS and power gating. Our results indicate that the co-optimization can introduce noticeable additional energy saving without significant performance degradation

Physical parameter-aware Networks-on-Chip design

PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable and power-efficient communication fabric for chip multiprocessors (CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine both the performance and the reliability of such systems, with a significant power demand that is expected to increase due to developments in both technology and architecture. In terms of architecture, an important trend in many-core systems architecture is to increase the number of cores on a chip while reducing their individual complexity. This trend increases communication power relative to computation power. Moreover, technology-wise, power-hungry wires are dominating logic as power consumers as technology scales down. For these reasons, the design of future very large scale integration (VLSI) systems is moving from being computation-centric to communication-centric. On the other hand, chip’s physical parameters integrity, especially power and thermal integrity, is crucial for reliable VLSI systems. However, guaranteeing this integrity is becoming increasingly difficult with the higher scale of integration due to increased power density and operating frequencies that result in continuously increasing temperature and voltage drops in the chip. This is a challenge that may prevent further shrinking of devices. Thus, tackling the challenge of power and thermal integrity of future many-core systems at only one level of abstraction, the chip and package design for example, is no longer sufficient to ensure the integrity of physical parameters. New designtime and run-time strategies may need to work together at different levels of abstraction, such as package, application, network, to provide the required physical parameter integrity for these large systems. This necessitates strategies that work at the level of the on-chip network with its rising power budget. This thesis proposes models, techniques and architectures to improve power and thermal integrity of Network-on-Chip (NoC)-based many-core systems. The thesis is composed of two major parts: i) minimization and modelling of power supply variations to improve power integrity; and ii) dynamic thermal adaptation to improve thermal integrity. This thesis makes four major contributions. The first is a computational model of on-chip power supply variations in NoCs. The proposed model embeds a power delivery model, an NoC activity simulator and a power model. The model is verified with SPICE simulation and employed to analyse power supply variations in synthetic and real NoC workloads. Novel observations regarding power supply noise correlation with different traffic patterns and routing algorithms are found. The second is a new application mapping strategy aiming vii to minimize power supply noise in NoCs. This is achieved by defining a new metric, switching activity density, and employing a force-based objective function that results in minimizing switching density. Significant reductions in power supply noise (PSN) are achieved with a low energy penalty. This reduction in PSN also results in a better link timing accuracy. The third contribution is a new dynamic thermal-adaptive routing strategy to effectively diffuse heat from the NoC-based threedimensional (3D) CMPs, using a dynamic programming (DP)-based distributed control architecture. Moreover, a new approach for efficient extension of two-dimensional (2D) partially-adaptive routing algorithms to 3D is presented. This approach improves three-dimensional networkon- chip (3D NoC) routing adaptivity while ensuring deadlock-freeness. Finally, the proposed thermal-adaptive routing is implemented in field-programmable gate array (FPGA), and implementation challenges, for both thermal sensing and the dynamic control architecture are addressed. The proposed routing implementation is evaluated in terms of both functionality and performance. The methodologies and architectures proposed in this thesis open a new direction for improving the power and thermal integrity of future NoC-based 2D and 3D many-core architectures

CAD methodologies for low power and reliable 3D ICs

The main objective of this dissertation is to explore and develop computer-aided-design (CAD) methodologies and optimization techniques for reliability, timing performance, and power consumption of through-silicon-via(TSV)-based and monolithic 3D IC designs. The 3D IC technology is a promising answer to the device scaling and interconnect problems that industry faces today. Yet, since multiple dies are stacked vertically in 3D ICs, new problems arise such as thermal, power delivery, and so on. New physical design methodologies and optimization techniques should be developed to address the problems and exploit the design freedom in 3D ICs. Towards the objective, this dissertation includes four research projects. The first project is on the co-optimization of traditional design metrics and reliability metrics for 3D ICs. It is well known that heat removal and power delivery are two major reliability concerns in 3D ICs. To alleviate thermal problem, two possible solutions have been proposed: thermal-through-silicon-vias (T-TSVs) and micro-fluidic-channel (MFC) based cooling. For power delivery, a complex power distribution network is required to deliver currents reliably to all parts of the 3D IC while suppressing the power supply noise to an acceptable level. However, these thermal and power networks pose major challenges in signal routability and congestion. In this project, a co-optimization methodology for signal, power, and thermal interconnects in 3D ICs is presented. The goal of the proposed approach is to improve signal, thermal, and power noise metrics and to provide fast and accurate design space explorations for early design stages. The second project is a study on 3D IC partition. For a 3D IC, the target circuit needs to be partitioned into multiple parts then mapped onto the dies. The partition style impacts design quality such as footprint, wirelength, timing, and so on. In this project, the design methodologies of 3D ICs with different partition styles are demonstrated. For the LEON3 multi-core microprocessor, three partitioning styles are compared: core-level, block-level, and gate-level. The design methodologies for such partitioning styles and their implications on the physical layout are discussed. Then, to perform timing optimizations for 3D ICs, two timing constraint generation methods are demonstrated that lead to different design quality. The third project is on the buffer insertion for timing optimization of 3D ICs. For high performance 3D ICs, it is crucial to perform thorough timing optimizations. Among timing optimization techniques, buffer insertion is known to be the most effective way. The TSVs have a large parasitic capacitance that increases the signal slew and the delay on the downstream. In this project, a slew-aware buffer insertion algorithm is developed that handles full 3D nets and considers TSV parasitics and slew effects on delay. Compared with the well-known van Ginneken algorithm and a commercial tool, the proposed algorithm finds buffering solutions with lower delay values and acceptable runtime overhead. The last project is on the ultra-high-density logic designs for monolithic 3D ICs. The nano-scale 3D interconnects available in monolithic 3D IC technology enable ultra-high-density device integration at the individual transistor-level. The benefits and challenges of monolithic 3D integration technology for logic designs are investigated. First, a 3D standard cell library for transistor-level monolithic 3D ICs is built and their timing and power behavior are characterized. Then, various interconnect options for monolithic 3D ICs that improve design quality are explored. Next, timing-closed, full-chip GDSII layouts are built and iso-performance power comparisons with 2D IC designs are performed. Important design metrics such as area, wirelength, timing, and power consumption are compared among transistor-level monolithic 3D, gate-level monolithic 3D, TSV-based 3D, and traditional 2D designs.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Lee, Hsien-Hsin; Committee Member: Mukhopadhyay, Saiba

Near-Threshold Computing: Past, Present, and Future.

Transistor threshold voltages have stagnated in recent years, deviating from constant-voltage scaling theory and directly limiting supply voltage scaling. To overcome the resulting energy and power dissipation barriers, energy efficiency can be improved through aggressive voltage scaling, and there has been increased interest in operating at near-threshold computing (NTC) supply voltages. In this region sizable energy gains are achieved with moderate performance loss, some of which can be regained through parallelism. This thesis first provides a methodical definition of how near to threshold is "near threshold" and continues with an in-depth examination of NTC across past, present, and future CMOS technologies. By systematically defining near-threshold, the trends and tradeoffs are analyzed, lending insight in how best to design and optimize near-threshold systems. NTC works best for technologies that feature good circuit delay scalability, therefore technologies without strong short-channel effects. Early planar technologies (prior to 90nm or so) featured good circuit scalability (8x energy gains), but lacked area in which to add cores for parallelization. Recent planar nodes (32nm – 20nm) feature more area for cores but suffer from poor delay scalability, and so are not well-suited for NTC (4x energy gains). The switch to FinFET CMOS technology allows for a return to strong voltage scalability (8x gain), reversing trends seen in planar technologies, while dark silicon has created an opportunity to add cores for parallelization. Improved FinFET voltage scalability even allows for latency reduction of a single task, as long as the task is sufficiently parallelizable (< 10% serial code). Finally, we will look at a technique for fast voltage boosting, called Shortstop, in which a core's operating voltage is raised in 10s of cycles. Shortstop can be used to quickly respond to single-threaded performance demands of a near-threshold system by leveraging the innate parasitic inductance of a dedicated dirty supply rail, further improving energy efficiency. The technique is demonstrated in a wirebond implementation and is able to boost a core up to 1.8x faster than a header-based approach, while reducing supply droop by 2-7x. An improved flip-chip architecture is also proposed.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/113600/1/npfet_1.pd

Energy efficient control for power management circuits operating from nano-watts to watts

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2013.Cataloged from PDF version of thesis.Includes bibliographical references (p. 163-172).Energy efficiency and form factor are the key driving forces in today's power electronics. All power delivery circuits, irrespective of the magnitude of power, basically consists of power trains, gate drivers and control circuits. Although the control circuits are primarily required for regulation, these circuits can play a crucial role in achieving high efficiency and/or minimizing overall system form-factor. In this thesis, power converter circuits, spanning a wide operating range- from nano-watts to watts, are presented while highlighting techniques for using digital control circuits not just for regulation but also to achieve high system efficiency and smaller system form-factor. The first part of the thesis presents a power management unit of an autonomous wireless sensor that sustains itself by harvesting energy from the endo-cochlear potential (EP), the 70-100mV electrochemical potential inside the mammalian inner ear. Due to the anatomical constraints, the total extractable power from the EP is limited to 1.1-6.3nW. A low switching frequency boost converter is employed to increase the input voltage to a higher voltage usable by CMOS circuits in the sensor. Ultra-low power digital control circuits with timers help keep the quiescent power of the power management unit down to 544pW. Further, a charge-pump is used to implement leakage reduction techniques in the sensor. This work demonstrates how digital low power control circuit design can help improve converter efficiency and ensure system sustainability. All circuits have been implemented on a 0.18[mu]m CMOS process. The second part of the thesis discusses an energy harvesting architecture that combines energy from multiple energy harvesting sources- photovoltaic, thermoelectric and piezoelectric sources. Digital control circuits that configure the power trains to new efficient system architectures with maximum power point tracking are presented, while using a single inductor to combine energy from the aforementioned energy sources all at the same time. A dual-path architecture for energy harvesting systems is proposed. This provides a peak efficiency improvement of 11-13% over the traditional two stage approach. The system can handle input voltages from 20mV to 5V and is also capable of extracting maximum power from individual harvesters all at the same time utilizing a single inductor. A proposed completely digital timebased power monitor is used for achieving maximum power point tracking for the photovoltaic harvester. This has a peak tracking efficiency of 96%. The peak efficiencies achieved with inductor sharing are 83%, 58% and 79% for photovoltaic boost, thermoelectric boost and piezoelectric buck-boost converters respectively. The switch matrix and the control circuits are implemented on a 0.35pm CMOS process. This part of the thesis highlights how digital control circuits can help reconfigure power converter architectures for improving efficiency and reducing form-factors. The last part of the thesis deals with a power management system for an offline 22W LED driver. In order to reduce the system form factor, Gallium Nitride (GaN) transistors capable of high frequency switching have been utilized with a Quasi-Resonant Inverted Buck architecture. A burst mode digital controller has been used to perform dimming control and power factor correction (PFC) for the LED driver. The custom controller and driver IC was implemented in a 0.35[mu]m CMOS process. The LED driver achieves a peak efficiency of 90.6% and a 0.96 power factor. Due to the high power level of the driver, the digital controller is primarily used for regulation purposes in this system, although the digital nature of the controller helps remove the passives that would be normally present in analog controllers. In this thesis, apart from regulation, control circuit enabled techniques have been used to improve efficiency and reduce system form factor. Low power design and control for reconfigurable power train architectures help improve the overall power converter efficiency. Digital control circuits have been used to reduce the form factor by enabling inductor sharing in a system with multiple power converters or by removing the compensator passives.by Saurav Bandyopadhyay.Ph.D

Communication and energy delivery architectures for personal medical devices

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2012.Cataloged from PDF version of thesis.Includes bibliographical references (p. 219-232).Advances in sensor technologies and integrated electronics are revolutionizing how humans access and receive healthcare. However, many envisioned wearable or implantable systems are not deployable in practice due to high energy consumption and anatomically-limited size constraints, necessitating large form-factors for external devices, or eventual surgical re-implantation procedures for in-vivo applications. Since communication and energy-management sub-systems often dominate the power budgets of personal biomedical devices, this thesis explores alternative usecases, system architectures, and circuit solutions to reduce their energy burden. For wearable applications, a system-on-chip is designed that both communicates and delivers power over an eTextiles network. The transmitter and receiver front-ends are at least an order of magnitude more efficient than conventional body-area networks. For implantable applications, two separate systems are proposed that avoid reimplantation requirements. The first system extracts energy from the endocochlear potential, an electrochemical gradient found naturally within the inner-ear of mammals, in order to power a wireless sensor. Since extractable energy levels are limited, novel sensing, communication, and energy management solutions are proposed that leverage duty-cycling to achieve enabling power consumptions that are at least an order of magnitude lower than previous work. Clinical measurements show the first system demonstrated to sustain itself with a mammalian-generated electrochemical potential operating as the only source of energy into the system. The second system leverages the essentially unlimited number of re-charge cycles offered by ultracapacitors. To ease patient usability, a rapid wireless capacitor charging architecture is proposed that employs a multi-tapped secondary inductive coil to provide charging times that are significantly faster than conventional approaches.by Patrick Philip Mercier.Ph.D