152 research outputs found

    Investigation into Detection of Hardware Trojans on Printed Circuit Boards

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    The modern semiconductor device manufacturing flow is becoming increasingly vulnerable to malicious implants called Hardware Trojans (HT). With HTs becoming stealthier, a need for more accurate and efficient detection methods is becoming increasingly crucial at both Integrated Circuit (IC) and Printed Circuit Board (PCB) levels. While HT detection at an IC level has been widely studied, there is still very limited research on detecting and preventing HTs implanted on PCBs. In recent years the rise of outsourcing design and fabrication of electronics, including PCBs, to third parties has dramatically increased the possibility of malicious alteration and consequently the security risk for systems incorporating PCBs. Providing mechanical support for the electrical interconnections between different components, PCBs are an important part of electronic systems. Modern, complex and highly integrated designs may contain up to thirty layers, with concealed micro-vias and embedded passive components. An adversary can aim to modify the PCB design by tampering the copper interconnections or inserting extra components in an internal layer of a multi-layer board. Similar to its IC counterpart, a PCB HT can, among other things, cause system failure or leakage of private information. The disruptive actions of a carefully designed HT attack can have catastrophic implications and should therefore be taken seriously by industry, academia and the government. This thesis gives an account of work carried out in three projects concerned with HT detection on a PCB. In the first contribution a power analysis method is proposed for detecting HT components, implanted on the surface or otherwise, consuming power from the power distribution network. The assumption is that any HT device actively tampering or eavesdropping on the signals in the PCB circuit will consume electrical power. Harvesting this side-channel effect and observing the fluctuations of power consumption on the PCB power distribution network enables evincing the HT. Using a purpose-built PCB prototype, an experimental setup is developed for verification of the methodology. The results confirm the ability to detect alien components on a PCB without interference with its main functionality. In the second contribution the monitoring methodology is further developed by applying machine learning (ML) techniques to detect stealthier HTs, consuming power from I/O ports of legitimate ICs on the PCB. Two algorithms, One-Class Support Vector Machine (SVM) and Local Outlier Factor (LOF), are implemented on the legitimate power consumption data harvested experimentally from the PCB prototype. Simulation results are validated through real-life measurements and experiments are carried out on the prototype PCB. For validation of the ML classification models, one hundred categories of HTs are modelled and inserted into the datasets. Simulation results show that using the proposed methodology an HT can be detected with high prediction accuracy (F1-score at 99% for a 15 mW HT). Further, the developed ML model is uploaded to the prototype PCB for experimental validation. The results show consistency between simulations and experiments, with an average discrepancy of ±5.9% observed between One-Class SVM simulations and real-life experiments. The machine learning models developed for HT detection are low-cost in terms of memory (around 27 KB). In the third contribution an automated visual inspection methodology is proposed for detecting HTs on the surface of a PCB. It is based on a combination of conventional computer vision techniques and a dual tower Siamese Neural Network (SNN), modelled in a three stage pipeline. In the interest of making the proposed methodology broadly applicable a particular emphasis is made on the imaging modality of choice, whereby a regular digital optical camera is chosen. The dataset of PCB images is developed in a controlled environment of a photographic tent. The novelty in this work is that, instead of a generic production fault detection, the algorithm is optimised and trained specifically for implanted HT component detection on a PCB, be it active or passive. The proposed HT detection methodology is trained and tested with three groups of HTs, categorised based on their surface area, ranging from 4 mm² to 280 mm² and above. The results show that it is possible to reach effective detection accuracy of 95.1% for HTs as small as 4 mm². In case of HTs with surface area larger than 280 mm² the detection accuracy is around 96.1%, while the average performance across all HT groups is 95.6%

    ToSHI - Towards Secure Heterogeneous Integration: Security Risks, Threat Assessment, and Assurance

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    The semiconductor industry is entering a new age in which device scaling and cost reduction will no longer follow the decades-long pattern. Packing more transistors on a monolithic IC at each node becomes more difficult and expensive. Companies in the semiconductor industry are increasingly seeking technological solutions to close the gap and enhance cost-performance while providing more functionality through integration. Putting all of the operations on a single chip (known as a system on a chip, or SoC) presents several issues, including increased prices and greater design complexity. Heterogeneous integration (HI), which uses advanced packaging technology to merge components that might be designed and manufactured independently using the best process technology, is an attractive alternative. However, although the industry is motivated to move towards HI, many design and security challenges must be addressed. This paper presents a three-tier security approach for secure heterogeneous integration by investigating supply chain security risks, threats, and vulnerabilities at the chiplet, interposer, and system-in-package levels. Furthermore, various possible trust validation methods and attack mitigation were proposed for every level of heterogeneous integration. Finally, we shared our vision as a roadmap toward developing security solutions for a secure heterogeneous integration

    The Huawei and Snowden Questions

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    This open access book answers two central questions: firstly, is it at all possible to verify electronic equipment procured from untrusted vendors? Secondly, can I build trust into my products in such a way that I support verification by untrusting customers? In separate chapters the book takes readers through the state of the art in fields of computer science that can shed light on these questions. In a concluding chapter it discusses realistic ways forward. In discussions on cyber security, there is a tacit assumption that the manufacturer of equipment will collaborate with the user of the equipment to stop third-party wrongdoers. The Snowden files and recent deliberations on the use of Chinese equipment in the critical infrastructures of western countries have changed this. The discourse in both cases revolves around what malevolent manufacturers can do to harm their own customers, and the importance of the matter is on par with questions of national security. This book is of great interest to ICT and security professionals who need a clear understanding of the two questions posed in the subtitle, and to decision-makers in industry, national bodies and nation states

    A Survey of Cybersecurity of Digital Manufacturing

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    The Industry 4.0 concept promotes a digital manufacturing (DM) paradigm that can enhance quality and productivity, which reduces inventory and the lead time for delivering custom, batch-of-one products based on achieving convergence of additive, subtractive, and hybrid manufacturing machines, automation and robotic systems, sensors, computing, and communication networks, artificial intelligence, and big data. A DM system consists of embedded electronics, sensors, actuators, control software, and interconnectivity to enable the machines and the components within them to exchange data with other machines, components therein, the plant operators, the inventory managers, and customers. This article presents the cybersecurity risks in the emerging DM context, assesses the impact on manufacturing, and identifies approaches to secure DM

    SCAN CHAIN BASED HARDWARE SECURITY

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    Hardware has become a popular target for attackers to hack into any computing and communication system. Starting from the legendary power analysis attacks discovered 20 years ago to the recent Intel Spectre and Meltdown attacks, security vulnerabilities in hardware design have been exploited for malicious purposes. With the emerging Internet of Things (IoT) applications, where the IoT devices are extremely resource constrained, many proven secure but computational expensive cryptography protocols cannot be applied on such devices. Thus there is an urgent need to understand the hardware vulnerabilities and develop cost effective mitigation methods. One established field in the semiconductor and integrated circuit (IC) industry, known as IC test, has the goal of ensuring that fabricated ICs are free of manufacturing defects and perform the required functionalities. Testing is essential to isolate faulty chips from good ones. The concept of design for test (DFT) has been integrated in the commercial IC design and fabrication process for several decades. Scan chain, which provides test engineer access to all the flip flops in the chip through the scan in (SI) and scan out (SO) ports, is the backbone of industrial testing methods and can be found in almost all the modern designs. In addition to IC testing, scan chain has found applications in intellectual property (IP) protection and IC identification. However, attackers can also leverage the controllability and observability of scan chain as a side channel to break systems such as cryptographic chips. This dissertation addresses these two important security problems by proposing (1) a practical scan chain based security primitive for IP protection and (2) a partial scan chain framework that can mitigate all the existing scan based attacks. First, we observe the fact that each D-flip-flop has two output ports, Q and Q’, designed to simplify the logic and has been used to reduce the power consumption for IC test. The availability of both Q and Q’ ports provide the opportunity for IP protection. More specifically, we can generate a digital fingerprint by selecting different connection styles between adjacent scan cells during the design of scan chain. This method has two major advantages: fingerprints are created as a post-silicon procedure and therefore there will be little fabrication overhead; altering the connection style requires the modification of test vectors for each fingerprinted IP and thus enables a non-intrusive fingerprint verification method. This addresses the overhead and detectability problems, two of the most challenging problems of designing practical IP fingerprinting techniques in the past two decades. Combined with the recently developed reconfigurable scan networks (RSNs) that are popular for embedded and IoT devices, we design an IC identification (ID) scheme utilizing the different connection styles. We perform experiments on standard benchmarks to demonstrate that our approach has low design overhead. We also conduct security analysis to show that such fingerprints and IC IDs are robust against various attacks. In the second part of this dissertation, we consider the scan chain side channel attack, which has been reported as one of the most severe side channel attacks to modern secure systems. We argue that the current countermeasures are restricted to the requirement of providing direct SI and SO for testing and thus suffers the vulnerability of leaving this side channel open to the attackers as well. Therefore, we propose a novel public-private partial scan chain based approach with the basic idea of removing the flip flops that store sensitive information from the scan chain. This will eliminate the scan chain side channel, but it also limits IC test. The key contribution in our proposed public-private partial scan chain design is that it can keep the full test coverage while providing security to the scan chain. This is achieved by chaining the removed flip flops into one or more private partial scan chains and adding protections to the SI and SO ports of such chains. Unlike the traditional partial scan design which not only fails to provide full fault coverage, but also incur huge overhead in test time and test vector generation time, we propose a set of techniques to ensure that the desired test vectors can be entered into the system efficiently. These techniques include test vector reordering, test vector reusing, and test vector generation based on a novel finite state machine (FSM) structure we have invented. On the other hand, to enable the test engineers the ability to observe the test output to diagnose the chip while not leaking information to the attackers, we propose two lightweight mechanisms, one based on linear feedback shift register (LFSR) and the other one based on configurable physical unclonable function (PUF). Finally, we discuss a protocol on how in-field test can be realized using our public-private partial scan chain. We conduct experiments with industrial scan design tools to demonstrate that the required hardware in our approach has negligible area overhead and gives full test coverage with reduced test time and does not need to re-generate test vectors. In sum, this dissertation focuses on the role of scan chain, a conventional design for test facility, in hardware security. We show that scan chain features can be leveraged to create practical IP protection techniques including IP watermarking and fingerprinting as well as IC identification and authentication. We also propose a novel public-private partial scan design principle to close the scan chain side channel to the attackers. Through this dissertation work, we demonstrate that it is possible to develop highly practical scan chain based techniques that can benefit both the community of IC test and hardware security
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