Novel dual-Vth independent-gate FinFET circuits

This paper describes gate work function and oxide thickness tuning to realize novel circuits using dual-Vth independent-gate FinFETs. Dual-Vth FinFETs with independent gates enable series and parallel merge transformations in logic gates, realizing compact low power alternatives. Furthermore, they also enable the design of a new class of compact logic gates with higher expressive power and flexibility than conventional forms, e.g., implementing 12 unique Boolean functions using only four transistors. The gates are designed and calibrated using the University of Florida double-gate model into a technology library. Synthesis results for 14 benchmark circuits from the ISCAS and OpenSPARC suites indicate that on average, the enhanced library reduces delay, power, and area by 9%, 21%, and 27%, respectively, over a conventional library designed using FinFETs in 32nm technology.NSF CAREER Award CCF-074685

Novel dual-threshold voltage FinFETs for circuit design and optimization

A great research effort has been invested on finding alternatives to CMOS that have better process variation and subthreshold leakage. From possible candidates, FinFET is the most compatible with respect to CMOS and it has shown promising leakage and speed performance. This thesis introduces basic characteristics of FinFETs and the effects of FinFET physical parameters on their performance are explained quantitatively. I show how dual- V th independent-gate FinFETs can be fabricated by optimizing their physical parameters. Optimum values for these physical parameters are derived using the physics-based University of Florida SPICE model for double-gate devices, and the optimized FinFETs are simulated and validated using Sentaurus TCAD simulations. Dual-14, FinFETs with independent gates enable series and parallel merge transformations in logic gates, realizing compact low power alternative gates with competitive performance and reduced input capacitance in comparison to conventional FinFET gates. Furthermore, they also enable the design of a new class of compact logic gates with higher expressive power and flexibility than CMOS gates. Synthesis results for 16 benchmark circuits from the ISCAS and OpenSPARC suites indicate that on average at 2GHz and 75°C, the library that contains the novel gates reduces total power and the number of fins by 36% and 37% respectively, over a conventional library that does not have novel gates in the 32nm technology

Dual-Vth Independent-Gate FinFETs for Low Power Logic Circuits

This paper describes the electrode work-function, oxide thickness, gate-source/drain underlap, and silicon thickness optimization required to realize dual-Vth independent-gate FinFETs. Optimum values for these FinFET design parameters are derived using the physics-based University of Florida SPICE model for double-gate devices, and the optimized FinFETs are simulated and validated using Sentaurus TCAD simulations. Dual-Vth FinFETs with independent gates enable series and parallel merge transformations in logic gates, realizing compact low power alternative gates with competitive performance and reduced input capacitance in comparison to conventional FinFET gates. Furthermore, they also enable the design of a new class of compact logic gates with higher expressive power and flexibility than conventional CMOS gates, e.g., implementing 12 unique Boolean functions using only four transistors. Circuit designs that balance and improve the performance of the novel gates are described. The gates are designed and calibrated using the University of Florida double-gate model into conventional and enhanced technology libraries. Synthesis results for 16 benchmark circuits from the ISCAS and OpenSPARC suites indicate that on average at 2GHz, the enhanced library reduces total power and the number of fins by 36% and 37%, respectively, over a conventional library designed using shorted-gate FinFETs in 32 nm technology

Benchmarking the screen-grid field effect transistor (SGrFET) for digital applications

Continuous scaling of CMOS technology has now reached a state of evolution, therefore, novel device structures and new materials have been proposed for this purpose. The Screen- Grid field Effect Transistor is introduced as a as a novel device structure that takes advantage of several innovative aspects of the FinFET while introducing new geometrical feature to improve a FET device performance. The idea is to design a FET which is as small as possible without down-scaling issues, at the same time satisfying optimum device performance for both analogue and digital applications. The analogue operation of the SGrFET shows some promising results which make it interesting to continue the investigation on SGrFET for digital applications. The SGrFET addresses some of the concerns of scaled CMOS such as Drain Induce Barrier Lowering and sub-threshold slope, by offering the superior short channel control. In this work in order to evaluate SGrFET performance, the proposed device compared to the classical MOSFET and provides comprehensive benchmarking with finFETs. Both AC and DC simulations are presented using TaurusTM and MediciTM simulators which are commercially available via Synopsis. Initial investigation on the novel device with the single gate structure is carried out. The multi-geometrical characteristic of the proposed device is used to reduce parasitic capacitance and increase ION/IOFF ratio to improve device performance in terms of switching characteristic in different circuit structures. Using TaurusTM AC simulation, a small signal circuit is introduced for SGrFET and evaluated using both extracted small signal elements from TaurusTM and Y-parameter extraction. The SGrFET allows for the unique behavioural characteristics of an independent-gate device. Different configurations of double-gate device are introduced and benchmark against the finFET serving as a double gate device. Five different logic circuits, the complementary and N-inverter, the NOR, NAND and XOR, and controllable Current Mirror circuits are simulated with finFET and SGrFET and their performance compared. Some digital key merits are extracted for both finFET and SGrFET such as power dissipation, noise margin and switching speed to compare the devices under the investigation performance against each other. It is shown that using multi-geometrical feature in SGrFET together with its multi-gate operation can greatly decrease the number of device needed for the logic function without speed degradation and it can be used as a potential candidate in mix-circuit configuration as a multi-gate device. The initial fabrication steps of the novel device explained together with some in-house fabrication process using E-Beam lithography. The fabricated SGrFET is characterised via electrical measurements and used in a circuit configuration

Ultralow-Power and Secure S-Box Circuit Using FinFET Based ECRL Adiabatic Logic

Advanced Encryption Standard (AES) is the widely used technique in critical cyber security applications. In AES architecture S-box is the most important block. However, the power consumed by      S-box is 75% of the total AES design. The   S-box is also prone to Differential Power Analysis (DPA) attack which is one of the most threatening types of attacks in cryptographic systems. In this paper, a     three-stage positive polarity Reed-Muller (PPRM) S-box is implemented with 45nm FinFET using Efficient Charge Recovery Logic (ECRL) to reduce power consumption. The simulation results indicate up to 66% power savings for FinFET based S-box as compared to CMOS design. Further, the FinFET ECRL 8-bit     S-box circuit is evaluated for transitional energy fluctuations and peak current traces to compare its resistance against side-channel attacks. The lower energy variations and uniform current trace exhibit the improved security performance of the circuit to withstand DPA and Differential Electromagnetic Radiation Attacks (DEMA)

Advanced System on a Chip Design Based on Controllable-Polarity FETs (invited paper)

Field-Effect Transistors (FETs) with on-line controllable-polarity are promising candidates to support next generation System-on-Chip (SoC). Thanks to their enhanced functionality, controllable-polarity FETs enable a superior design of critical components in a SoC, such as processing units and memories, while also providing native solutions to control power consumption. In this paper, we present the efficient design of a SoC core with controllable-polarity FET. Processing units are speeded-up at the datapath level, as arithmetic operations require fewer physical resources than in standard CMOS. Power consumption is decreased via embedded power-gating techniques and tunable high-performance/low-power devices operation. Memory cells are made smaller by merging the access interface with the storage circuitry. We foresee the advantages deriving from these techniques, by evaluating their impact on the design of SoC for a contemporary telecommunication application. Using a 22-nm vertically-stacked silicon nanowire technology, a coarse-grain evaluation at the block level estimates a delay and power reduction of 20% and 19% respectively, at a cost of a moderate area overhead of 15%, with respect to a state-of-art FinFET technology

Silicon on ferroelectric insulator field effect transistor (SOF-FET) a new device for the next generation ultra low power circuits

Title from PDF of title page, viewed on March 12, 2014Thesis advisor: Masud H. ChowdhuryVitaIncludes bibliographical references (pages 116-131)Thesis (M. S.)--School of Computer and Engineering. University of Missouri--Kansas City, 2013Field effect transistors (FETs) are the foundation for all electronic circuits and processors. These devices have progressed massively to touch its final steps in subnanometer level. Left and right proposals are coming to rescue this progress. Emerging nano-electronic devices (resonant tunneling devices, single-atom transistors, spin devices, Heterojunction Transistors rapid flux quantum devices, carbon nanotubes, and nanowire devices) took a vast share of current scientific research. Non-Si electronic materials like III-V heterostructure, ferroelectric, carbon nanotubes (CNTs), and other nanowire based designs are in developing stage to become the core technology of non-classical CMOS structures. FinFET present the current feasible commercial nanotechnology. The scalability and low power dissipation of this device allowed for an extension of silicon based devices. High short channel effect (SCE) immunity presents its major advantage. Multi-gate structure comes to light to improve the gate electrostatic over the channel. The new structure shows a higher performance that made it the first candidate to substitute the conventional MOSFET. The device also shows a future scalability to continue Moor’s Law. Furthermore, the device is compatible with silicon fabrication process. Moreover, the ultra-low-power (ULP) design required a subthreshold slope lower than the thermionic-emission limit of 60mV/ decade (KT/q). This value was unbreakable by the new structure (SOI-FinFET). On the other hand most of the previews proposals show the ability to go beyond this limit. However, those pre-mentioned schemes have publicized a very complicated physics, design difficulties, and process non-compatibility. The objective of this research is to discuss various emerging nano-devices proposed for ultra-low-power designs and their possibilities to replace the silicon devices as the core technology in the future integrated circuit. This thesis proposes a novel design that exploits the concept of negative capacitance. The new field effect transistor (FET) based on ferroelectric insulator named Silicon-On-Ferroelectric Insulator Field Effect Transistor (SOF-FET). This proposal is a promising methodology for future ultra-lowpower applications, because it demonstrates the ability to replace the silicon-bulk based MOSFET, and offers subthreshold swing significantly lower than 60mV/decade and reduced threshold voltage to form a conducting channel. The SOF-FET can also solve the issue of junction leakage (due to the presence of unipolar junction between the top plate of the negative capacitance and the diffused areas that form the transistor source and drain). In this device the charge hungry ferroelectric film already limits the leakage.Abstract -- List of illustrations - List of tables -- Acknowledgements -- Dedication -- Introduction -- Carbon nanotube field effect transistor -- Multi-gate transistors -FinFET -- Subthreshold swing -- Tunneling field effect transistors -- I-mos and nanowire fets -- Ferroelectric based field effect transistors -- An analytical model to approximate the subthreshold swing for soi-finfet -- Silicon-on-ferroelectric insulator field effect transistor (SOF-FET) -- Current-voltage characteristics of sof-fet -- Advantages, manufacturing process and future work of the proposed device -- Appendix -- Reference

Performance Analysis of CMOS and FinFET based 16-Bit Barrel Shifter

A barrel shifter shifts ‘n’ number of bits in one cycle. Barrel shifter can perform the following functions: shift left logical, shift left arithmetic, rotate left, shift right logical, shift right arithmetic and rotate right. The design of the barrel shifter is purely MUX based will improve its efficiency if Mux consumes less power. The MUX based SLC barrel shifter circuits are designed using Tanner EDA tools. Fin-type field-effect transistors ( FinFETs) are promising substitutes for bulk CMOS in nano - scale circuits. This paper compares the performance of barrel shifter using two different technologies on the basis of power consumption, time delay and power delay product DOI: 10.17762/ijritcc2321-8169.15067

Study of subthreshold behavior of FinFet

The study of subthreshold behavior of Metal Oxide Semiconductor Field Effect Transistor (MOSFET) is critically important in the case of submicron devices for the successful design and implementation of digital circuits. Fin Field Effect Transistor (FinFET) is considered to be an alternate MOSFET structure in the deep sub-micron regime. A 3D Poisson equation solver is employed to study the subthreshold behavior of FinFET. Based on potential distribution inside the fin, the appropriate band bending and the subthreshold value called the S-factor is calculated. It is observed that the S-factor of the device increases as the channel width, Tfin increases. This is attributed to the fact that the change in the band bending is less than the change in the applied gate voltage. This is only a first order analysis; hence the device is simulated in a device simulator Taurus. It is observed that the S-factor increases exponentially for channel lengths Lg \u3c 1.5Tfin. Further, for a constant Lg, the S factor is observed to increase as Tfin increases. An empirical relationship between S, Lg and Tfin is developed based on the simulation results, which can be used as a rule of thumb for determining the S-factor of devices

Multi-port Memory Design for Advanced Computer Architectures

In this thesis, we describe and evaluate novel memory designs for multi-port on-chip and off-chip use in advanced computer architectures. We focus on combining multi-porting and evaluating the performance over a range of design parameters. Multi-porting is essential for caches and shared-data systems, especially multi-core System-on-chips (SOC). It can significantly increase the memory access throughput. We evaluate FinFET voltage-mode multi-port SRAM cells using different metrics including leakage current, static noise margin and read/write performance. Simulation results show that single-ended multi-port FinFET SRAMs with isolated read ports offer improved read stability and flexibility over classical double-ended structures at the expense of write performance. By increasing the size of the access transistors, we show that the single-ended multi-port structures can achieve equivalent write performance to the classical double-ended multi-port structure for 9% area overhead. Moreover, compared with CMOS SRAM, FinFET SRAM has better stability and standby power. We also describe new methods for the design of FinFET current-mode multi-port SRAM cells. Current-mode SRAMs avoid the full-swing of the bitline, reducing dynamic power and access time. However, that comes at the cost of voltage drop, which compromises stability. The design proposed in this thesis utilizes the feature of Independent Gate (IG) mode FinFET, which can leverage threshold voltage by controlling the back gate voltage, to merge two transistors into one through high-Vt and low-Vt transistors. This design not only reduces the voltage drop, but it also reduces the area in multi-port current-mode SRAM design. For off-chip memory, we propose a novel two-port 1-read, 1-write (1R1W) phasechange memory (PCM) cell, which significantly reduces the probability of blocking at the bank levels. Different from the traditional PCM cell, the access transistors are at the top and connected to the bitline. We use Verilog-A to model the behavior of Ge2Sb2Te5 (GST: the storage component). We evaluate the performance of the two-port cell by transistor sizing and voltage pumping. Simulation results show that pMOS transistor is more practical than nMOS transistor as the access device when both area and power are considered. The estimated area overhead is 1.7�, compared to single-port PCM cell. In brief, the contribution we make in this thesis is that we propose and evaluate three different kinds of multi-port memories that are favorable for advanced computer architectures