Selective Glitch Reduction Technique for Minimizing Peak Dynamic IR Drop

Abstract This paper proposes a glitch co mpensation technique which involves reducing glitch power in selected combinational cells to reduce peak current which contributes to dynamic voltage or IR drop. The proposed methodology can be seamlessly integrated to existing physical design flo ws. A glitch is an undesired transition that occurs before intended value in dig ital circuits. A glitch occurs in CMOS circu its when d ifferential delay at the inputs of a gate is greater than inertial delay, which results into increased gate switching and hence notable amount of power consumption. When such large nu mber of logic gates switch close to the same t ime they will contribute to power integrity challenge called pe ak dynamic IR drop. The glitch power is becoming more pro minent in lower technology nodes. Introduction of buffers at the input of the Logic gate may reduce glitches, but it results into large area overhead and dynamic power. In the proposed methodology we are using transmission gate as a compensation circuit to reduce extra leakage and dynamic power. A flo w is proposed for charactering the pass transistor logic to cater different delay values. The proposed methodology has been validated on a plac e and routed Multiply Accumulate (MA C) layout imp lemented using Synopsys SAED 9 0n m Generic library. Experimental results show 12% to 50% reduction in top 10 peak transient IR drop numbers with just 12% g litch power reduction in selected combinational cell instances. When compared to traditional on-chip decoupling capacitor (Decap) cells insertion method the proposed technique could reduce the peak IR drop numbers by the same amount with just 5% increase in total core capacitance

Editorial

In recent years, we have observed spectacular advancements in the area of nano-circuits and systems at several levels, from the fabrication material and device levels to the system and application levels. New emerging materials provide us with a wealth of new devices such as (silicon) nanowires, graphene, and carbon nanotubes fabricated in various technologies. Applications of these devices are vast and include, but are not limited to, new computing and memory structures, super-capacitors, as well as nano-bio-sensors based on the molecular combination of molecular probes to electronic devices. This special issue of the Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS) has the purpose to collect some selected contributions to the workshop as well as other works in this domain, all subject to peer review. In particular, this issue focuses on two specific topics: biomedical circuits and systems, and 3-D integrated circuits and systems. This choice is motivated by a synergy of the spontaneous contributions in these areas as well as by the importance of these fields. We will review these two areas at large before briefly summarizing the contributions

Voltage controlled oscillator for mm-wave radio systems

Abstract. The advancement in silicon technology has accelerated the development of integrated millimeter-wave transceiver systems operating up to 100 GHz with sophisticated functionality at a reduced consumer cost. Due to the progress in the field of signal processing, frequency modulated continuous wave (FMCW) radar has become common in recent years. A high-performance local oscillator (LO) is required to generate reference signals utilized in these millimeter-wave radar transceivers. To accomplish this, novel design techniques in fundamental voltage controlled oscillators (VCO) are necessary to achieve low phase noise, wide frequency tuning range, and good power efficiency. Although integrated VCOs have been studied for decades, as we move higher in the radio frequency spectrum, there are new trade-offs in the performance parameters that require further characterization. The work described in this thesis aims to design a fully integrated fundamental VCO targeting to 150 GHz, i.e., D-Band. The purpose is to observe and analyze the design limitations at these high frequencies and their corresponding trade-offs during the design procedure. The topology selected for this study is the cross-coupled LC tank VCO. For the study, two design topologies were considered: a conventional cross-coupled LC tank VCO and an inductive divider cross-coupled LC tank VCO. The conventional LC tank VCO yields better performance in terms of phase noise and tuning range. It is observed that the VCO is highly sensitive to parasitic contributions by the transistors, and the layout interconnects, thus limiting the targeted frequency range. The dimensions of the LC tank and the transistors are selected carefully. Moreover, the VCO performance is limited by the low Q factor of the LC tank governed by the varactor that is degrading the phase noise performance and the tuning range, respectively. The output buffer loaded capacitance and the core power consumption of the VCO are optimized. The layout is drawn carefully with strategies to minimize the parasitic effects. Considering all the design challenges, a 126 GHz VCO with a tuning range of 3.9% is designed. It achieves FOMT (Figure-of-merit) of -172 dBc/Hz, and phase noise of -99.14 dBc/Hz at 10 MHz offset, Core power consumption is 8.9 mW from a 1.2 V supply. Just falling short of the targeted frequency, the design is suitable for FMCW radar applications for future technologies. The design was done using Silicon-on-Insulator (SOI) CMOS technology

Cutting Edge Nanotechnology

The main purpose of this book is to describe important issues in various types of devices ranging from conventional transistors (opening chapters of the book) to molecular electronic devices whose fabrication and operation is discussed in the last few chapters of the book. As such, this book can serve as a guide for identifications of important areas of research in micro, nano and molecular electronics. We deeply acknowledge valuable contributions that each of the authors made in writing these excellent chapters

Circuit and System Level Design Optimization for Power Delivery And Management

As the VLSI technology scales to the nanometer scale, power consumption has become a critical design concern of VLSI circuits. Power gating and dynamic voltage and frequency scaling (DVFS) are two effective power management techniques that are widely utilized in modern chip designs. Various design challenges merge with these power management techniques in nanometer VLSI circuits. For example, power gating introduces unique power integrity issues and trade-offs between switching noise and rush current noise. Assuring power integrity and achieving power efficiency are two highly intertwined design challenges. In addition, these trade-offs significantly vary with the supply voltage. It is difficult to use conventional power-gated power delivery networks (PDNs) to fully meet the involved conflicting design constraints while maximizing power saving and minimizing supply noise. The DVFS controller and the DC-DC power converter are two highly intertwining enablers for DVFS-based systems. However, traditional DVFS techniques treat the design optimizations of the two as separate tasks, giving rise to sub-optimal designs. To address the above research challenges, we propose several circuit and system level design optimization techniques in this dissertation. For power-gated PDN designs, we propose systemic decoupling capacitor (decap) optimization strategies that optimally trade-off between power integrity and leakage saving. First, new global decap and re-routable decap design concepts are proposed to relax the tight interaction between power integrity and leakage power saving of power-gated PDN at a single supply voltage level. Furthermore, we propose to leverage re-routable decaps to provide flexible decap allocation structures to better suit multiple supply voltage levels. The proposed strategies are implemented in an automatic design flow for choosing optimal amount of local decaps, global decaps and re-routable decaps. The proposed techniques significantly increase leakage saving without jeopardizing power integrity. The flexible decap allocations enabled by re-routable decaps lead to optimal design trade-offs for PDNs operating with two supply voltage levels. To improve the effectiveness of DVFS, we analyze the drawbacks of circuit-level only and policy-level only optimizations and the promising opportunities resulted from the cross-layer co-optimization of the DC-DC converter and online learning based DVFS polices. We present a cross-layer approach that optimizes transition time, area, energy overhead of the DC-DC converter along with key parameters of an online learning DVFS controller. We systematically evaluate the benefits of the proposed co-optimization strategy based on several processor architectures, namely single and dual-core processors and processors with DVFS and power gating. Our results indicate that the co-optimization can introduce noticeable additional energy saving without significant performance degradation

Embedding Logic and Non-volatile Devices in CMOS Digital Circuits for Improving Energy Efficiency

abstract: Static CMOS logic has remained the dominant design style of digital systems for more than four decades due to its robustness and near zero standby current. Static CMOS logic circuits consist of a network of combinational logic cells and clocked sequential elements, such as latches and flip-flops that are used for sequencing computations over time. The majority of the digital design techniques to reduce power, area, and leakage over the past four decades have focused almost entirely on optimizing the combinational logic. This work explores alternate architectures for the flip-flops for improving the overall circuit performance, power and area. It consists of three main sections. First, is the design of a multi-input configurable flip-flop structure with embedded logic. A conventional D-type flip-flop may be viewed as realizing an identity function, in which the output is simply the value of the input sampled at the clock edge. In contrast, the proposed multi-input flip-flop, named PNAND, can be configured to realize one of a family of Boolean functions called threshold functions. In essence, the PNAND is a circuit implementation of the well-known binary perceptron. Unlike other reconfigurable circuits, a PNAND can be configured by simply changing the assignment of signals to its inputs. Using a standard cell library of such gates, a technology mapping algorithm can be applied to transform a given netlist into one with an optimal mixture of conventional logic gates and threshold gates. This approach was used to fabricate a 32-bit Wallace Tree multiplier and a 32-bit booth multiplier in 65nm LP technology. Simulation and chip measurements show more than 30% improvement in dynamic power and more than 20% reduction in core area. The functional yield of the PNAND reduces with geometry and voltage scaling. The second part of this research investigates the use of two mechanisms to improve the robustness of the PNAND circuit architecture. One is the use of forward and reverse body biases to change the device threshold and the other is the use of RRAM devices for low voltage operation. The third part of this research focused on the design of flip-flops with non-volatile storage. Spin-transfer torque magnetic tunnel junctions (STT-MTJ) are integrated with both conventional D-flipflop and the PNAND circuits to implement non-volatile logic (NVL). These non-volatile storage enhanced flip-flops are able to save the state of system locally when a power interruption occurs. However, manufacturing variations in the STT-MTJs and in the CMOS transistors significantly reduce the yield, leading to an overly pessimistic design and consequently, higher energy consumption. A detailed analysis of the design trade-offs in the driver circuitry for performing backup and restore, and a novel method to design the energy optimal driver for a given yield is presented. Efficient designs of two nonvolatile flip-flop (NVFF) circuits are presented, in which the backup time is determined on a per-chip basis, resulting in minimizing the energy wastage and satisfying the yield constraint. To achieve a yield of 98%, the conventional approach would have to expend nearly 5X more energy than the minimum required, whereas the proposed tunable approach expends only 26% more energy than the minimum. A non-volatile threshold gate architecture NV-TLFF are designed with the same backup and restore circuitry in 65nm technology. The embedded logic in NV-TLFF compensates performance overhead of NVL. This leads to the possibility of zero-overhead non-volatile datapath circuits. An 8-bit multiply-and- accumulate (MAC) unit is designed to demonstrate the performance benefits of the proposed architecture. Based on the results of HSPICE simulations, the MAC circuit with the proposed NV-TLFF cells is shown to consume at least 20% less power and area as compared to the circuit designed with conventional DFFs, without sacrificing any performance.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

Étude et conception des circuits de puissance CMOS RF et nouvelles fonctionnalités de modulation pour des applications de communication

This work presents the study, design and measurement of RF circuits aiming communication applications. The need for flexible and reconfigurable RF hardware leads to the need of alternative transmitter architectures. In the center of this innovative architecture, there is thepower oscillator. This circuit is composed of a power amplifier in a positive feedback loop soit oscillates. As the circuit under study is mainly composed of a power amplifier, a study on power amplifier is mandatory. Modern CMOS technologies impose difficulties in the efficient RF generation due to low breakdown voltages. In order to reduce the voltage stress on the transistors, wave form-engineering techniques are used leading to the use of class EF2. Thedesign and measurement of a class EF2 power amplifier and power oscillator are shown. Thecircuits were implemented in standard STMicroelectronics 0.13um CMOS. Correct behaviorfor the circuits was obtained in measurement, leading to a first implementation of class EF2 inRF frequencies. From a system perspective, the proposed architecture is shown to be flexible and able to generate different modulations without change in the hardware. Reconfigurability is shown not only in modulation but also in output power level. The limitations of this architecture are discussed and some mathematical modeling is presented.Dans l’ère des systèmes de communication multi-standards, le besoin des circuits en radio fréquence (RF) flexibles et reconfigurables pousse l´industrie et le monde académique vers la recherche d´architectures alternatives d’émetteurs et de récepteurs RF. Dans cette thèse, nous nous intéressons aux émetteurs RF flexibles. Nous présentons une architecture basée sur l’utilisation d’un oscillateur de puissance composé d´un amplificateur de puissance dans une boucle de rétroaction positive. Pour des raisons de compatibilité avec des circuit numériques et dans le but de minimiser les coûts de fabrication, nous avons choisi la technologie CMOS. Ce choix génère des difficultés de conception des circuits en RF à cause des faibles tensions de claquage. Cette contrainte de conception a motivé le choix de la classe EF2 pour l’amplificateur de puissance afin de réduire le stress en tension sur les transistors. Nous présentons la conception de cet amplificateur de puissance de classe EF2, ainsi que la conception de l’oscillateur de puissance. Nous validons cette architecture avec une implémentation en technologie CMOS 0.13um de STMicroelectronics. Nous démontrons le bon comportement par une campagne de mesures des circuits fabriqués. Ce circuit répond aux contraintes de flexibilité de modulation et de puissance de sortie. Il peut donc être utilisé pour différents standards de communications. Les limitations inhérentes de cette architecture sont discutées et une modélisation mathématique est présentée

Low power low noise analog front-end IC design for biomedical sensor interface

Ph.DDOCTOR OF PHILOSOPH

21st Century Nanostructured Materials

Nanostructured materials (NMs) are attracting interest as low-dimensional materials in the high-tech era of the 21st century. Recently, nanomaterials have experienced breakthroughs in synthesis and industrial and biomedical applications. This book presents recent achievements related to NMs such as graphene, carbon nanotubes, plasmonic materials, metal nanowires, metal oxides, nanoparticles, metamaterials, nanofibers, and nanocomposites, along with their physical and chemical aspects. Additionally, the book discusses the potential uses of these nanomaterials in photodetectors, transistors, quantum technology, chemical sensors, energy storage, silk fibroin, composites, drug delivery, tissue engineering, and sustainable agriculture and environmental applications

Etude de de l'intégration 3D et des propriétés physiques de nanofils de silicium obtenus par croissance. Réalisation de capacités ultra-denses

The main focus of microelectronic industry has been to increase the number of integrated transistors in each circuit thanks to the device miniaturization. However, due to the increasing manufacturing and development costs combined with the increase of parasitic phenomena in transistors when the dimensions decrease, the microelectronic industry is now focusing on the three-dimensional integration in which strategy, the circuits are stacked. The next step of this tendency will be able to consist in a component stacking inside the same three-dimensional circuit. In this context, the catalyzed CVD grown silicon nanowires are a very promising material since they can be grown with a crystalline structure without any epitaxial relationship. They can also have nanoscale dimensions without any aggressive photolithography step. We report in this thesis, the nanowire integration in high density MOS and MIM capacitors using the high developed surface of a nanowire assembly. This way, we have obtained capacitance densities of 22 µF/cm² and of 9 µF/cm² for MOS and MIM capacitors respectively. In this work, we present how the devices have been designed, fabricated and characterized from the nanowire growth to the complete devices. We have also studied the main steps of the nanowire integration MOS transistors for the interconnects. A guided nanowire growth process has been developed and the interface quality of a low temperature deposited gate stack has been investigated. This study is based on a comparison of MOS capacitor electrical performances between catalyzed and unanalyzed silicon nanowires obtained by selective epitaxial growth. The catalyzed nanowires show a very good interface quality with a gate stack composed of alumina and titanium nitride. The technologies developed in this thesis open new opportunities for the 3D integration of devices on the same chip.STARL'évolution de la microélectronique est rythmée par l'augmentation constante du nombre de transistors intégrés dans chaque circuit grâce à la miniaturisation des dispositifs. Face à des coûts de fabrication et de développement de plus en plus élevés d'une part et à l'apparition de phénomènes parasites de plus en plus importants dans les dispositifs miniaturisés d'autre part, l'industrie se tourne progressivement vers l'intégration tridimensionnelle où les circuits sont empilés. La phase suivante de cette évolution pourra consister en la fabrication de circuits eux-mêmes tridimensionnels avec des composants répartis sur plusieurs niveaux. Dans ce contexte, la croissance catalysée de nanofils par CVD permet d'obtenir des structures cristallines en silicium sans relation d'épitaxie et de dimensions nanométriques sans photolithographie agressive. Nous avons utilisé ces propriétés pour la réalisation de démonstrateurs de capacités MOS et MIM ultra-denses de respectivement 22 µF/cm² et de 9 µF/cm² grâce à l'importante surface déployée par une assemblée de nanofils. Ces valeurs correspondent à des gains en surface appotée par les nanofils de 27,5 et de 16 pour les capacités MOS et MIM. Nous présentons dans ce travail de thèse, le dimensionnement, la fabrication et la caractérisation de ces dispositifs, depuis la croissance des nanofils jusqu'à l'obtention du démonstrateur complet. Nous nous sommes également intéressés aux principales briques technologiques de la fabrication de transistors verticaux à base de nanofils pour les niveaux d'interconnexion. Nous avons pour cela mis au point une technologie de croissance guidée de nanofils et étudié les qualités d'interface de l'empilement d'une grille déposé à basse température sur les nanofils. Cette étude s'appuie sur la comparaison des propriétés électriques de capacités MOS à base de nanofils obtenus par croissance catalysée avec les mêmes nanostructures obtenues par épitaxie sélective. Les nanofils catalysés présentent une très bonne qualité d'interface avec un empilement à base d'alumine et de nitrure de titane. Les technologies mises au point dans cette thèse ouvrent de nouvelles opportunités pour l'intégration tridimensionnelle au sein d'une même puce