Low-temperature amorphous oxide semiconductors for thin-film transistors and memristors: physical insights and applications

While amorphous oxides semiconductors (AOS), namely InGaZnO (IGZO), have found market application in the display industry, their disruptive properties permit to envisage for more advanced concepts such as System-on-Panel (SoP) in which AOS devices could be used for addressing (and readout) of sensors and displays, for communication, and even for memory as oxide memristors are candidates for the next-generation memories. This work concerns the application of AOS for these applications considering the low thermal budgets (< 180 °C) required for flexible, low cost and alternative substrates. For maintaining low driving voltages, a sputtered multicomponent/multi-layered high-κ dielectric (Ta2O5+SiO2) was developed for low temperature IGZO TFTs which permitted high performance without sacrificing reliability and stability. Devices’ performance under temperature was investigated and the bias and temperature dependent mobility was modelled and included in TCAD simulation. Even for IGZO compositions yielding very high thermal activation, circuit topologies for counteracting both this and the bias stress effect were suggested. Channel length scaling of the devices was investigated, showing that operation for radio frequency identification (RFID) can be achieved without significant performance deterioration from short channel effects, which are attenuated by the high-κ dielectric, as is shown in TCAD simulation. The applicability of these devices in SoP is then exemplified by suggesting a large area flexible radiation sensing system with on-chip clock-generation, sensor matrix addressing and signal read-out, performed by the IGZO TFTs. Application for paper electronics was also shown, in which TCAD simulation was used to investigate on the unconventional floating gate structure. AOS memristors are also presented, with two distinct operation modes that could be envisaged for data storage or for synaptic applications. Employing typical TFT methodologies and materials, these are ease to integrate in oxide SoP architectures

Solid State Circuits Technologies

The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book

신축성 있고 착용 가능한 탄소 나노튜브 기반 전자 기술

학위논문 (박사) -- 서울대학교 대학원 : 공과대학 협동과정 바이오엔지니어링전공, 2020. 8. 김대형.Networks of carbon nanotubes (CNTs) are a promising candidate for use as a basic building block for next-generation soft electronics, owing to their superior mechanical and electrical properties, chemical stability, and low production cost. In particular, the CNTs, which are produced as a mixture of metallic and semiconducting CNTs via chemical vapor deposition, can be sorted according to their electronic types, which makes them useful for specific purposes: semiconducting CNTs can be employed as channel materials in transistor-based applications and metallic CNTs as electrodes. However, the development of CNT-based electronics for soft applications is still at its infant stage, mainly limited by the lack of solid technologies for developing high-performance deformable devices whose electrical performances are comparable to those fabricated using conventional inorganic materials. In this regard, soft CNT electronics with high mechanical stability and electrical performances have been pursued. First, wearable nonvolatile memory modules and logic gates were fabricated by employing networks of semiconducting CNTs as the channel materials, with strain-tolerant device designs for high mechanical stability. The fabricated devices exhibited low operation voltages, high device-to-device uniformity, on/off ratios, and on-current density, while maintaining its performance during ~30% stretching after being mounted on the human skin. In addition, various functional logic gates verified the fidelity of the reported technology, and successful fabrication of non-volatile memory modules with wearable features has been reported for the first time at the time of publication. Second, the networks of semiconducting CNTs were used to fabricate signal amplifiers with a high gain of ~80, which were then used to amplify electrocardiogram (ECG) signals measured using a wearable sensor. At the same time, color-tunable organic light-emitting diodes (CTOLEDs) were developed based on ultra-thin charge blocking layer that controlled the flow of excitons during different voltage regimes. Together, they were integrated to construct a health monitoring platform whereby real-time ECG signals could be detected while simultaneously notifying its user of the ECG status via color changes of the wearable CTOLEDs. Third, intrinsically stretchable CNT transistors were developed, which was enabled by the developments of thickness controllable, vacuum-deposited stretchable dielectric layer and vacuum-deposited metal thin films. Previous works employed strain-tolerant device designs which are based on the use of filamentary serpentine-shaped interconnections, which severely sacrifice the device density. The developed stretchable dielectric, compatible with the current vacuum-based microfabrication technology, exhibited excellent insulating properties even for nanometer-range thicknesses, thereby enabling significant electrical performance improvements such as low operation voltage and high device uniformity/reproducibility, which has not been realized in the most advanced intrinsically stretchable transistors of today.탄소 나노튜브는 뛰어난 전기적, 화학적, 그리고 기계적 특성을 갖고 있어 차세대 유연 전자소자의 핵심 소재 중 하나로 각광을 받고 있으나, 아직까지 이를 이용한 실용적인 유연 전자소자의 개발은 실현되지 않고 있다. 이는 탄소 나노튜브의 전기적 특성대로 완벽히 분류해 낼 수 있는 기술, 탄소 나노튜브를 소자의 원하는 위치에 정확히 원하는 양만큼 네트워크 형태 혹은 정렬된 형태로 증착하는 기술, 그리고 유연 전자소자를 구성하는 다른 물질들의 개발 기술의 부재 때문이다. 지난 10여년간 해당 기술들은 광범위하게 연구되어지고 있으나, 탄소 나노튜브를 활용한 우수한 유연 전자소자 개발을 위한 핵심 기술들의 발전은 아직 초기 단계에 있다. 따라서 이 논문을 통해 탄소 나노튜브를 유연 전자소자에 적용시킬 수 있는 새로운 기술을 소개하고자 한다. 첫번째로 탄소 나노튜브와 유연 전자소자의 소자 디자인을 이용하여 피부위에 증착 가능한 비휘발성 메모리 소자를 제작하였고, 해당 기술을 이용하여 피부위에서 안전하게 동작할 수 있는 다양한 기초 회로들을 구현하였다. 탄소 나노튜브 기반 메모리 전자 소자 및 회로는 다양한 외부 응력이 가해져도 안정적으로 동작을 하였고, 개발된 기술을 통해 보다 실용적인 탄소 나노튜브 기반 유연 전자 소자의 제작 조건을 확립할 수 있었다. 두번째로 위에 개발된 기술을 바탕으로, 보다 복잡한 탄소 나노튜브 기반 유연 회로 및 구동전압에 따라 발광색이 변환하는 색변환 소자를 제작하여 해당 소자들이 피부위에 부착되어 잘 작동되도록 구현하였다. 그리고 이 두 가지 웨어러블 전자소자를 통합하여 실시간으로 심전도를 측정하여 탄소 나노튜브 기반 전자소자를 통해 해당 신호를 증폭시키고, 신호의 상태를 색변환 소자로 나타낼 수 있는 심전도 모니터 시스템을 구현하였다. 세번째로 진공 증착이 가능한 유연 절연체를 개발하여, 기존의 유연 전자소자들이 가지고 있던 극명한 한계를 극복하였다 (높은 구동 전압, 낮은 집적도, 대면적 소자 선능 균일도 등). 기존의 액상 기반 증착을 위주로 한 유연 전자 소자들은 무기물질 기반 전자소자 대비 극심한 성능 저하를 보여주었는데, 이를 해결하기 위해 새로운 절연물질을 개발하고 탄소 나노튜브 기반 유연 전자소자에 적용하여 그 가능성을 보여주었다.Chapter 1. Introduction 1 1.1 Discovery of CNTs and their benefits for soft electronic applications 1 1.2 Electrical sorting of CNTs 5 1.3 Deposition methods of solution-processed semiconducting CNTs 7 1.4 Conclusion 23 1.5 References 24 Chapter 2. Stretchable Carbon Nanotube Charge-Trap Floating-Gate Memory and Logic Devices for Wearable Electronics 32 2.1 Introduction 32 2.2 Experimental section 34 2.3 Results and discussion 36 2.4 Conclusion 62 2.5 References 63 Chapter 3. Wearable Electrocardiogram Monitor Using Carbon Nanotube Electronics and Color-Tunable Organic Light-Emitting Diodes 67 3.1 Introduction 67 3.2 Experimental section 70 3.3 Results and discussion 73 3.4 Conclusion 97 3.5 References 98 Chapter 4. Medium-Scale Electronic Skin Based on Carbon Nanotube Transistors with Vacuum-Deposited Stretchable Dielectric Film 102 4.1 Introduction 102 4.2 Experimental section 106 4.3 Result and discussion 111 4.4 Conclusion 135 4.5 References 136Docto

Variability-aware low-power techniques for nanoscale mixed-signal circuits.

New circuit design techniques that accommodate lower supply voltages necessary for portable systems need to be integrated into the semiconductor intellectual property (IP) core. Systems that once worked at 3.3 V or 2.5 V now need to work at 1.8 V or lower, without causing any performance degradation. Also, the fluctuation of device characteristics caused by process variation in nanometer technologies is seen as design yield loss. The numerous parasitic effects induced by layouts, especially for high-performance and high-speed circuits, pose a problem for IC design. Lack of exact layout information during circuit sizing leads to long design iterations involving time-consuming runs of complex tools. There is a strong need for low-power, high-performance, parasitic-aware and process-variation-tolerant circuit design. This dissertation proposes methodologies and techniques to achieve variability, power, performance, and parasitic-aware circuit designs. Three approaches are proposed: the single iteration automatic approach, the hybrid Monte Carlo and design of experiments (DOE) approach, and the corner-based approach. Widely used mixed-signal circuits such as analog-to-digital converter (ADC), voltage controlled oscillator (VCO), voltage level converter and active pixel sensor (APS) have been designed at nanoscale complementary metal oxide semiconductor (CMOS) and subjected to the proposed methodologies. The effectiveness of the proposed methodologies has been demonstrated through exhaustive simulations. Apart from these methodologies, the application of dual-oxide and dual-threshold techniques at circuit level in order to minimize power and leakage is also explored

Predicting power scalability in a reconfigurable platform

This thesis focuses on the evolution of digital hardware systems. A reconfigurable platform is proposed and analysed based on thin-body, fully-depleted silicon-on-insulator Schottky-barrier transistors with metal gates and silicide source/drain (TBFDSBSOI). These offer the potential for simplified processing that will allow them to reach ultimate nanoscale gate dimensions. Technology CAD was used to show that the threshold voltage in TBFDSBSOI devices will be controllable by gate potentials that scale down with the channel dimensions while remaining within appropriate gate reliability limits. SPICE simulations determined that the magnitude of the threshold shift predicted by TCAD software would be sufficient to control the logic configuration of a simple, regular array of these TBFDSBSOI transistors as well as to constrain its overall subthreshold power growth. Using these devices, a reconfigurable platform is proposed based on a regular 6-input, 6-output NOR LUT block in which the logic and configuration functions of the array are mapped onto separate gates of the double-gate device. A new analytic model of the relationship between power (P), area (A) and performance (T) has been developed based on a simple VLSI complexity metric of the form ATσ = constant. As σ defines the performance “return” gained as a result of an increase in area, it also represents a bound on the architectural options available in power-scalable digital systems. This analytic model was used to determine that simple computing functions mapped to the reconfigurable platform will exhibit continuous power-area-performance scaling behavior. A number of simple arithmetic circuits were mapped to the array and their delay and subthreshold leakage analysed over a representative range of supply and threshold voltages, thus determining a worse-case range for the device/circuit-level parameters of the model. Finally, an architectural simulation was built in VHDL-AMS. The frequency scaling described by σ, combined with the device/circuit-level parameters predicts the overall power and performance scaling of parallel architectures mapped to the array

Fault and Defect Tolerant Computer Architectures: Reliable Computing With Unreliable Devices

This research addresses design of a reliable computer from unreliable device technologies. A system architecture is developed for a fault and defect tolerant (FDT) computer. Trade-offs between different techniques are studied and yield and hardware cost models are developed. Fault and defect tolerant designs are created for the processor and the cache memory. Simulation results for the content-addressable memory (CAM)-based cache show 90% yield with device failure probabilities of 3 x 10(-6), three orders of magnitude better than non fault tolerant caches of the same size. The entire processor achieves 70% yield with device failure probabilities exceeding 10(-6). The required hardware redundancy is approximately 15 times that of a non-fault tolerant design. While larger than current FT designs, this architecture allows the use of devices much more likely to fail than silicon CMOS. As part of model development, an improved model is derived for NAND Multiplexing. The model is the first accurate model for small and medium amounts of redundancy. Previous models are extended to account for dependence between the inputs and produce more accurate results

Circuit-level modelling and simulation of carbon nanotube devices

The growing academic interest in carbon nanotubes (CNTs) as a promising novel class of electronic materials has led to significant progress in the understanding of CNT physics including ballistic and non-ballistic electron transport characteristics. Together with the increasing amount of theoretical analysis and experimental studies into the properties of CNT transistors, the need for corresponding modelling techniques has also grown rapidly. This research is focused on the electron transport characteristics of CNT transistors, with the aim to develop efficient techniquesto model and simulate CNT devices for logic circuit analysis.The contributions of this research can be summarised as follows. Firstly, to accelerate the evaluation of the equations that model a CNT transistor, while maintaining high modelling accuracy, three efficient numerical techniques based on piece-wise linear, quadratic polynomial and cubic spline approximation have been developed. The numerical approximation simplifies the solution of the CNT transistor’s self-consistent voltage such that the calculation of the drain-source current is accelerated by at least two orders of magnitude. The numerical approach eliminates complicated calculations in the modelling process and facilitates the development of fast and efficient CNT transistor models for circuit simulation.Secondly, non-ballistic CNT transistors have been considered, and extended circuit-level models which can capture both ballistic and non-ballistic electron transport phenomena, including elastic scattering, phonon scattering, strain and tunnelling effects, have been developed. A salient feature of the developed models is their ability to incorporate both ballistic and non-ballistic transport mechanisms without a significant computational cost. The developed models have been extensively validated against reported transport theories of CNT transistors and experimental results.Thirdly, the proposed carbon nanotube transistor models have been implemented on several platforms. The underlying algorithms have been developed and tested in MATLAB, behaviourallevel models in VHDL-AMS, and improved circuit-level models have been implemented in two versions of the SPICE simulator. As the final contribution of this work, parameter variation analysis has been carried out in SPICE3 to study the performance of the proposed circuit-level CNT transistor models in logic circuit analysis. Typical circuits, including inverters and adders, have been analysed to determine the dependence of the circuit’s correct operation on CNT parameter variation

Physics of thin-film ferroelectric oxides

This review covers the important advances in recent years in the physics of thin film ferroelectric oxides, the strongest emphasis being on those aspects particular to ferroelectrics in thin film form. We introduce the current state of development in the application of ferroelectric thin films for electronic devices and discuss the physics relevant for the performance and failure of these devices. Following this we cover the enormous progress that has been made in the first principles computational approach to understanding ferroelectrics. We then discuss in detail the important role that strain plays in determining the properties of epitaxial thin ferroelectric films. Finally, we look at the emerging possibilities for nanoscale ferroelectrics, with particular emphasis on ferroelectrics in non conventional nanoscale geometries.Comment: This is an invited review for Reviews of Modern Physics. We welcome feedback and will endeavour to incorporate comments received promptly into the final versio

Miniaturized Transistors

What is the future of CMOS? Sustaining increased transistor densities along the path of Moore's Law has become increasingly challenging with limited power budgets, interconnect bandwidths, and fabrication capabilities. In the last decade alone, transistors have undergone significant design makeovers; from planar transistors of ten years ago, technological advancements have accelerated to today's FinFETs, which hardly resemble their bulky ancestors. FinFETs could potentially take us to the 5-nm node, but what comes after it? From gate-all-around devices to single electron transistors and two-dimensional semiconductors, a torrent of research is being carried out in order to design the next transistor generation, engineer the optimal materials, improve the fabrication technology, and properly model future devices. We invite insight from investigators and scientists in the field to showcase their work in this Special Issue with research papers, short communications, and review articles that focus on trends in micro- and nanotechnology from fundamental research to applications