Contactless Test Access Mechanism for 3D IC

3D IC integration presents many advantages over the current 2D IC integration. It has the potential to reduce the power consumption and the physical size while supporting higher bandwidth and processing speed. Through Silicon Via’s (TSVs) are vertical interconnects between different layers of 3D ICs with a typical 5μm diameter and 50μm length. To test a 3D IC, an access mechanism is needed to apply test vectors to TSVs and observe their responses. However, TSVs are too small for access by current wafer probes and direct TSV probing may affect their physical integrity. In addition, the probe needles for direct TSV probing must be cleaned or replaced frequently. Contactless probing method resolves most of the TSV probing problems and can be employed for small-pitch TSVs. In this dissertation, contactless test access mechanisms for 3D IC have been explored using capacitive and inductive coupling techniques. Circuit models for capacitive and inductive communication links are extracted using 3D full-wave simulations and then circuit level simulations are carried out using Advanced Design System (ADS) design environment to verify the results. The effects of cross-talk and misalignment on the communication link have been investigated. A contactless TSV probing method using capacitive coupling is proposed and simulated. A prototype was fabricated using TSMC 65nm CMOS technology to verify the proposed method. The measurement results on the fabricated prototype show that this TSV probing scheme presents -55dB insertion loss at 1GHz frequency and maintains higher than 35dB signal-to-noise ratio within 5µm distance. A microscale contactless probe based on the principle of resonant inductive coupling has also been designed and simulated. Experimental measurements on a prototype fabricated in TSMC 65nm CMOS technology indicate that the data signal on the TSV can be reconstructed when the distance between the TSV and the probe remains less than 15µm

Rapid Wireless Capacitor Charging Using a Multi-Tapped Inductively-Coupled Secondary Coil

This paper presents an inductive coupling system designed to wirelessly charge ultra-capacitors used as energy storage elements. Although ultra-capacitors offer the native ability to rapidly charge, it is shown that standard inductive coupling circuits only deliver maximal power for a specific load impedance which depends on coil geometries and separation distances. Since a charging ultra-capacitor can be modeled as an increasing instantaneous impedance, maximum power is thus delivered to the ultra-capacitor at only a single point in the charging interval, resulting in a longer than optimal charging time. Analysis of inductive coupling theory reveals that the optimal load impedance can be modified by adjusting the secondary coil inductance and resonant tuning capacitance. A three-tap secondary coil is proposed to dynamically modify the optimal load impedance throughout the capacitor charging interval. Measurement results show that the proposed architecture can expand its operational range by up to 2.5 × and charge a 2.5 F ultra-capacitor to 5 V upwards of 3.7 × faster than a conventional architecture.Semiconductor Research Corporation. Interconnect Focus Cente

NASA Tech Briefs, July 2000

Topics covered include: Data Acquisition; Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Test and Measurement; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

Signaling in 3-D integrated circuits, benefits and challenges

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuits provide a potent approach to enhance the performance and integrate diverse functions within amulti-plane stack. Clock networks consume a great portion of the power dissipated in a circuit. Therefore, designing a low-power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Synchronization issues can be more challenging for 3-D circuits since a clock path can spread across several planes with different physical and electrical characteristics. Consequently, designing low power clock networks for 3-D circuits is an important issue. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. In this research, a design method to apply resonant clocking to synthesized clock trees is proposed. Manufacturing processes for 3-D circuits include some additional steps as compared to standard CMOS processes which makes 3-D circuits more susceptible to manufacturing defects and lowers the overall yield of the bonded 3-D stack. Testing is another complicated task for 3-D ICs, where pre-bond test is a prerequisite. Pre-bond testability, in turn, presents new challenges to 3-D clock network design primarily due to the incomplete clock distribution networks prior to the bonding of the planes. A design methodology of resonant 3-D clock networks that support wireless pre-bond testing is introduced. To efficiently address this issue, inductive links are exploited to wirelessly transmit the clock signal to the disjoint resonant clock networks. The inductors comprising the LC tanks are used as the receiver circuit for the links, essentially eliminating the need for additional circuits and/or interconnect resources during pre-bond test. Recent FPGAs are quite complex circuits which provide reconfigurablity at the cost of lower performance and higher power consumption as compared to ASIC circuits. Exploiting a large number of programmable switches, routing structures are mainly responsible for performance degradation in FPAGs. Employing 3-D technology can providemore efficient switches which drastically improve the performance and reduce the power consumption of the FPGA. RRAM switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. Along with the configurable switches, buffers are the other important element of the FPGAs routing structure. Different characteristics of RRAM switches change the properties of signal paths in RRAM-based FPGAs. The on resistance of RRAMswitches is considerably lower than CMOS pass gate switches which results in lower RC delay for RRAM-based routing paths. This different nature in critical path and signal delay in turn affect the need for intermediate buffers. Thus the buffer allocation should be reconsidered. In the last part of this research, the effect of intermediate buffers on signal propagation delay is studied and a modified buffer allocation scheme for RRAM-based FPGA routing path is proposed

NASA Tech Briefs, January 2001

The topics include: 1) A "Model" of Interactive Engineering; 2) Feature Section: Communications Technology; 3) lnReview; 4) Application Briefs; 5) Submillimeter-Wave Image Sensor; 6) Ultrasonic/Sonic Drill/Corers With Integrated Sensors; 7) Normally Closed, Piezoelectrically Actuated Microvalve; 8) Magnetostrictively Actuated Valves for Cryosurgical Probes; 9) Remote Sensing of Electric Fields in Clouds; 10) Wireless-Communication Headset Subsystem To Enhance Signaling; 11) Power Amplifier With 9 to 13 dB of Gain From 65 to 146 GHz; 12) Humidity Interlock for Protecting a Cooled Laser Crystal; 13) A Lightweight Ambulatory Physiological Monitoring System; 14) Improvements in a Lightning-Measuring Instrument; 15) Broad-Band, Noninvasive Radio-Frequency Current Probe; 16) Web-Based Technology Distributes Lean Models; 17) Software Guides Aeroelastic-Systems Design; and 18) Postprocessing Software for Micromechanics Analysis Code. A Photonics West 2001 Preview Tech Brief supplement to this January 2001 issue is also included

NASA Tech Briefs, July 1999

Topics: Test and Measurement; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Bio-Medical; Books and Reports; Semiconductors/ICs

NASA Tech Briefs, February 1997

Topics include: Test and Measurement; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Report