Analyse und Erweiterung eines fehler-toleranten NoC für SRAM-basierte FPGAs in Weltraumapplikationen

Data Processing Units for scientific space mission need to process ever higher volumes of data and perform ever complex calculations. But the performance of available space-qualified general purpose processors is just in the lower three digit megahertz range, which is already insufficient for some applications. As an alternative, suitable processing steps can be implemented in hardware on a space-qualified SRAM-based FPGA. However, suitable devices are susceptible against space radiation. At the Institute for Communication and Network Engineering a fault-tolerant, network-based communication architecture was developed, which enables the construction of processing chains on the basis of different processing modules within suitable SRAM-based FPGAs and allows the exchange of single processing modules during runtime, too. The communication architecture and its protocol shall isolate non SEU mitigated or just partial SEU mitigated modules affected by radiation-induced faults to prohibit the propagation of errors within the remaining System-on-Chip. In the context of an ESA study, this communication architecture was extended with further components and implemented in a representative hardware platform. Based on the acquired experiences during the study, this work analyses the actual fault-tolerance characteristics as well as weak points of this initial implementation. At appropriate locations, the communication architecture was extended with mechanisms for fault-detection and fault-differentiation as well as with a hardware-based monitoring solution. Both, the former measures and the extension of the employed hardware-platform with selective fault-injection capabilities for the emulation of radiation-induced faults within critical areas of a non SEU mitigated processing module, are used to evaluate the effects of radiation-induced faults within the communication architecture. By means of the gathered results, further measures to increase fast detection and isolation of faulty nodes are developed, selectively implemented and verified. In particular, the ability of the communication architecture to isolate network nodes without SEU mitigation could be significantly improved.Instrumentenrechner für wissenschaftliche Weltraummissionen müssen ein immer höheres Datenvolumen verarbeiten und immer komplexere Berechnungen ausführen. Die Performanz von verfügbaren qualifizierten Universalprozessoren liegt aber lediglich im unteren dreistelligen Megahertz-Bereich, was für einige Anwendungen bereits nicht mehr ausreicht. Als Alternative bietet sich die Implementierung von entsprechend geeigneten Datenverarbeitungsschritten in Hardware auf einem qualifizierten SRAM-basierten FPGA an. Geeignete Bausteine sind jedoch empfindlich gegenüber der Strahlungsumgebung im Weltraum. Am Institut für Datentechnik und Kommunikationsnetze wurde eine fehlertolerante netzwerk-basierte Kommunikationsarchitektur entwickelt, die innerhalb eines geeigneten SRAM-basierten FPGAs Datenverarbeitungsmodule miteinander nach Bedarf zu Verarbeitungsketten verbindet, sowie den Austausch von einzelnen Modulen im Betrieb ermöglicht. Nicht oder nur partiell SEU mitigierte Module sollen bei strahlungsbedingten Fehlern im Modul durch das Protokoll und die Fehlererkennungsmechanismen der Kommunikationsarchitektur isoliert werden, um ein Ausbreiten des Fehlers im restlichen System-on-Chip zu verhindern. Im Kontext einer ESA Studie wurde diese Kommunikationsarchitektur um Komponenten erweitert und auf einer repräsentativen Hardwareplattform umgesetzt. Basierend auf den gesammelten Erfahrungen aus der Studie, wird in dieser Arbeit eine Analyse der tatsächlichen Fehlertoleranz-Eigenschaften sowie der Schwachstellen dieser ursprünglichen Implementierung durchgeführt. Die Kommunikationsarchitektur wurde an geeigneten Stellen um Fehlerdetektierungs- und Fehlerunterscheidungsmöglichkeiten erweitert, sowie um eine hardwarebasierte Überwachung ergänzt. Sowohl diese Maßnahmen, als auch die Erweiterung der Hardwareplattform um gezielte Fehlerinjektions-Möglichkeiten zum Emulieren von strahlungsinduzierten Fehlern in kritischen Komponenten eines nicht SEU mitigierten Prozessierungsmoduls werden genutzt, um die tatsächlichen auftretenden Effekte in der Kommunikationsarchitektur zu evaluieren. Anhand der Ergebnisse werden weitere Verbesserungsmaßnahmen speziell zur schnellen Detektierung und Isolation von fehlerhaften Knoten erarbeitet, selektiv implementiert und verifiziert. Insbesondere die Fähigkeit, fehlerhafte, nicht SEU mitigierte Netzwerkknoten innerhalb der Kommunikationsarchitektur zu isolieren, konnte dabei deutlich verbessert werden

Self-adaptivity of applications on network on chip multiprocessors: the case of fault-tolerant Kahn process networks

Technology scaling accompanied with higher operating frequencies and the ability to integrate more functionality in the same chip has been the driving force behind delivering higher performance computing systems at lower costs. Embedded computing systems, which have been riding the same wave of success, have evolved into complex architectures encompassing a high number of cores interconnected by an on-chip network (usually identified as Multiprocessor System-on-Chip). However these trends are hindered by issues that arise as technology scaling continues towards deep submicron scales. Firstly, growing complexity of these systems and the variability introduced by process technologies make it ever harder to perform a thorough optimization of the system at design time. Secondly, designers are faced with a reliability wall that emerges as age-related degradation reduces the lifetime of transistors, and as the probability of defects escaping post-manufacturing testing is increased. In this thesis, we take on these challenges within the context of streaming applications running in network-on-chip based parallel (not necessarily homogeneous) systems-on-chip that adopt the no-remote memory access model. In particular, this thesis tackles two main problems: (1) fault-aware online task remapping, (2) application-level self-adaptation for quality management. For the former, by viewing fault tolerance as a self-adaptation aspect, we adopt a cross-layer approach that aims at graceful performance degradation by addressing permanent faults in processing elements mostly at system-level, in particular by exploiting redundancy available in multi-core platforms. We propose an optimal solution based on an integer linear programming formulation (suitable for design time adoption) as well as heuristic-based solutions to be used at run-time. We assess the impact of our approach on the lifetime reliability. We propose two recovery schemes based on a checkpoint-and-rollback and a rollforward technique. For the latter, we propose two variants of a monitor-controller- adapter loop that adapts application-level parameters to meet performance goals. We demonstrate not only that fault tolerance and self-adaptivity can be achieved in embedded platforms, but also that it can be done without incurring large overheads. In addressing these problems, we present techniques which have been realized (depending on their characteristics) in the form of a design tool, a run-time library or a hardware core to be added to the basic architecture

Delay Measurements and Self Characterisation on FPGAs

This thesis examines new timing measurement methods for self delay characterisation of Field-Programmable Gate Arrays (FPGAs) components and delay measurement of complex circuits on FPGAs. Two novel measurement techniques based on analysis of a circuit's output failure rate and transition probability is proposed for accurate, precise and efficient measurement of propagation delays. The transition probability based method is especially attractive, since it requires no modifications in the circuit-under-test and requires little hardware resources, making it an ideal method for physical delay analysis of FPGA circuits. The relentless advancements in process technology has led to smaller and denser transistors in integrated circuits. While FPGA users benefit from this in terms of increased hardware resources for more complex designs, the actual productivity with FPGA in terms of timing performance (operating frequency, latency and throughput) has lagged behind the potential improvements from the improved technology due to delay variability in FPGA components and the inaccuracy of timing models used in FPGA timing analysis. The ability to measure delay of any arbitrary circuit on FPGA offers many opportunities for on-chip characterisation and physical timing analysis, allowing delay variability to be accurately tracked and variation-aware optimisations to be developed, reducing the productivity gap observed in today's FPGA designs. The measurement techniques are developed into complete self measurement and characterisation platforms in this thesis, demonstrating their practical uses in actual FPGA hardware for cross-chip delay characterisation and accurate delay measurement of both complex combinatorial and sequential circuits, further reinforcing their positions in solving the delay variability problem in FPGAs

フィールドにおけるテスト印加と低電力論理BISTに関する研究

Advances in semiconductor process technology have resulted in various aging issues in field operation of Very Large Scale Integration (VLSI) circuits. For example, HCI (Hot carrier injection), BTI (Bias Temperature Instability), TDDB (Time Dependent Dielectric Breakdown) are well-known aging phenomena, and they can increase the circuit delay resulting in serious reliability problems. In order to avoid system failures caused by aging, recent design usually sets a certain timing margin in operational frequency of the circuit. However, it is difficult to determine the size of the proper timing margin because of the difficulty of prediction of its aging speed in actual use that is related to operational environment. Pessimistic prediction may result in performance sacrificing although it will improve the reliability of the system. BIST-based field test is a promising way to guarantee the reliability of the circuit through detecting the aging-induced faults during the circuit operation. However, the field test has a limitation on test application time, which makes it difficult to achieve high test quality. Therefore an effective test application method at field is required. In addition to the requirement of short test application time, the BIST-based field test requires performing at-speed testing in order to detect timing-related defects. However, it is well known that power dissipation during testing is much higher than that in normal circuit operation. Because excessive power dissipation causes higher IR-drop and higher temperature, it results in delay increase during testing, and in turn, causing false at-speed testing and yield loss. While many low power test methods have been proposed to tackle the test power issue, inadequate test power reduction and lower fault coverage still remain as important issues. Moreover, low power testing that just focuses on power reduction is insufficient. When the test power is reduced to a very low level, a timing-related defect may be missed by the test, and a defective circuit will appear to be a good part passing the test. Therefore, appropriate test power control is necessary though it was out of considering in the existing methods. In this dissertation, we first proposed a new test application to satisfy the limitation of short test application time for BIST-based field test, and then we proposed a new low power BIST scheme that focuses on controlling the test power to a specified value for improving the field test quality. In chapter 3, a new field test application method named “rotating test” is presented in which a set of generated test patterns to detect aging-induced faults is partitioned into several subsets, and apply each subset in one test session at field. In order to maximize the test quality for rotating test, we proposed test partitioning methods that refer to two items: First one aims at maximizing fault coverage of each subset obtained by partitioning. Second one aims at minimizing the detection time interval of all faults in rotating test to avoid system failures. Experimental results demonstrated the effectiveness of the proposed partitioning methods. In chapter 4, we proposed a new low power BIST scheme which can control the scan-in power, scan-out power and capture power while keeping test coverage at high level. In this scheme, a new circuit called pseudo low-pass filter (PLPF) is developed for scan-in power control, and a multi-cycle capture test technique is employed to reduce the capture power. In order to control scan-out power dissipated by test responses, we proposed a novel method that selects some flip-flops in scan chains at logic design phase, and fills the selected flip-flops with proper values before starting scan-shift operation so as to reduce the switching activity associated with scan-out. The experimental results for ISCAS-89 and ITC-99 benchmark circuits show that significant scan-in power reduction rate (the original rate of 50% is reduced to 7~8%) and capture power reduction rate (the original rate of 20% is reduced to 6~7%) were derived. With the scan-out controlling method, the scan-out power can be reduced from 17.2% to 8.4%, which could not be achieved by the conventional methods. Moreover, in order to control the test power to the specified rate to accommodate the various test power requirements. A scan-shift power controlling scheme was also discussed. It showed the capability of controlling any scan-shift toggle rate between 6.7% and 50%.九州工業大学博士学位論文 学位記番号:情工博甲第289号　学位授与年月日:平成26年3月25日1. INTRODUCTION|2. PRELIMINARY|3. BIST-BASED FIELD ROTATING TEST FOR AGING-INDUCED FAULT DETECTION|4. TEST POWER REDUCTION FOR LOGIC-BIST|5. SUMMARY九州工業大学平成25年

Enhancing Digital Controllability in Wideband RF Transceiver Front-Ends for FTTx Applications

Enhancing the digital controllability of wideband RF transceiver front-ends helps in widening the range of operating conditions and applications in which such systems can be employed. Technology limitations and design challenges often constrain the extensive adoption of digital controllability in RF front-ends. This work focuses on three major aspects associated with the design and implementation of a digitally controllable RF transceiver front-end for enhanced digital control. Firstly, the influence of the choice of semiconductor technology for a system-on-chip integration of digital gain control circuits are investigated. The digital control of gain is achieved by utilizing step attenuators that consist of cascaded switched attenuation stages. A design methodology is presented to evaluate the influence of the chosen technology on the performance of the three conventionally used switched attenuator topologies for desired attenuation levels, and the constraints that the technology suitable for high amplification places on the attenuator performance are examined. Secondly, a novel approach to the integrated implementation of gain slope equalization is presented, and the suitability of the proposed approach for integration within the RF front-end is verified. Thirdly, a sensitivity-aware implementation of a peak power detector is presented. The increased employment of digital gain control also increases the requirements on the sensitivity of the power detector employed for adaptive power and gain control. The design, implementation, and measurement results of a state-of-the-art wideband power detector with high sensitivity and large dynamic range are presented. The design is optimized to provide a large offset cancellation range, and the influence of offset cancellation circuits on the sensitivity of the power detector is studied. Moreover, design considerations for high sensitivity performance of the power detector are investigated, and the noise contributions from individual sub-circuits are evaluated. Finally, a wideband RF transceiver front-end is realized using a commercially available SiGe BiCMOS technology to demonstrate the enhancements in the digital controllability of the system. The RF front-end has a bandwidth of 500 MHz to 2.5 GHz, an input dynamic range of 20 dB, a digital gain control range larger than 30 dB, a digital gain slope equalization range from 1.49 dB/GHz to 3.78 dB/GHz, and employs a power detector with a sensitivity of -56 dBm and dynamic range of 64 dB. The digital control in the RF front-end is implemented using an on-chip serial-parallel-interface (SPI) that is controlled by an external micro-controller. A prototype implementation of the RF front-end system is presented as part of an RFIC intended for use in optical transceiver modules for fiber-to-the-x applications

Adaptive Distributed Architectures for Future Semiconductor Technologies.

Year after year semiconductor manufacturing has been able to integrate more components in a single computer chip. These improvements have been possible through systematic shrinking in the size of its basic computational element, the transistor. This trend has allowed computers to progressively become faster, more efficient and less expensive. As this trend continues, experts foresee that current computer designs will face new challenges, in utilizing the minuscule devices made available by future semiconductor technologies. Today's microprocessor designs are not fit to overcome these challenges, since they are constrained by their inability to handle component failures by their lack of adaptability to a wide range of custom modules optimized for specific applications and by their limited design modularity. The focus of this thesis is to develop original computer architectures, that can not only survive these new challenges, but also leverage the vast number of transistors available to unlock better performance and efficiency. The work explores and evaluates new software and hardware techniques to enable the development of novel adaptive and modular computer designs. The thesis first explores an infrastructure to quantitatively assess the fallacies of current systems and their inadequacy to operate on unreliable silicon. In light of these findings, specific solutions are then proposed to strengthen digital system architectures, both through hardware and software techniques. The thesis culminates with the proposal of a radically new architecture design that can fully adapt dynamically to operate on the hardware resources available on chip, however limited or abundant those may be.PHDComputer Science and EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/102405/1/apellegr_1.pd

A built-in self-test technique for high speed analog-to-digital converters

Fundação para a Ciência e a Tecnologia (FCT) - PhD grant (SFRH/BD/62568/2009

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

Design and Validation of Network-on-Chip Architectures for the Next Generation of Multi-synchronous, Reliable, and Reconfigurable Embedded Systems

NETWORK-ON-CHIP (NoC) design is today at a crossroad. On one hand, the design principles to efficiently implement interconnection networks in the resource-constrained on-chip setting have stabilized. On the other hand, the requirements on embedded system design are far from stabilizing. Embedded systems are composed by assembling together heterogeneous components featuring differentiated operating speeds and ad-hoc counter measures must be adopted to bridge frequency domains. Moreover, an unmistakable trend toward enhanced reconfigurability is clearly underway due to the increasing complexity of applications. At the same time, the technology effect is manyfold since it provides unprecedented levels of system integration but it also brings new severe constraints to the forefront: power budget restrictions, overheating concerns, circuit delay and power variability, permanent fault, increased probability of transient faults. Supporting different degrees of reconfigurability and flexibility in the parallel hardware platform cannot be however achieved with the incremental evolution of current design techniques, but requires a disruptive approach and a major increase in complexity. In addition, new reliability challenges cannot be solved by using traditional fault tolerance techniques alone but the reliability approach must be also part of the overall reconfiguration methodology. In this thesis we take on the challenge of engineering a NoC architectures for the next generation systems and we provide design methods able to overcome the conventional way of implementing multi-synchronous, reliable and reconfigurable NoC. Our analysis is not only limited to research novel approaches to the specific challenges of the NoC architecture but we also co-design the solutions in a single integrated framework. Interdependencies between different NoC features are detected ahead of time and we finally avoid the engineering of highly optimized solutions to specific problems that however coexist inefficiently together in the final NoC architecture. To conclude, a silicon implementation by means of a testchip tape-out and a prototype on a FPGA board validate the feasibility and effectivenes

Fault and Defect Tolerant Computer Architectures: Reliable Computing With Unreliable Devices

This research addresses design of a reliable computer from unreliable device technologies. A system architecture is developed for a fault and defect tolerant (FDT) computer. Trade-offs between different techniques are studied and yield and hardware cost models are developed. Fault and defect tolerant designs are created for the processor and the cache memory. Simulation results for the content-addressable memory (CAM)-based cache show 90% yield with device failure probabilities of 3 x 10(-6), three orders of magnitude better than non fault tolerant caches of the same size. The entire processor achieves 70% yield with device failure probabilities exceeding 10(-6). The required hardware redundancy is approximately 15 times that of a non-fault tolerant design. While larger than current FT designs, this architecture allows the use of devices much more likely to fail than silicon CMOS. As part of model development, an improved model is derived for NAND Multiplexing. The model is the first accurate model for small and medium amounts of redundancy. Previous models are extended to account for dependence between the inputs and produce more accurate results