Power supply noise analysis for 3D ICs using through-silicon-vias

3D design is being recognized widely as the next BIG thing in system integration. However, design and analysis tools for 3D are still in infancy stage. Power supply noise analysis is one of the critical aspects of a design. Hence, the area of noise analysis for 3D designs is a key area for future development. The following research presents a new parasitic RLC modeling technique for 3D chips containing TSVs as well as a novel optimization algorithm for power-ground network of a 3D chip with the aim of minimizing noise in the network. The following work also looks into an existing commercial IR drop analysis tool and presents a way to modify it with the aim of handling 3D designs containing TSVs.M.S.Committee Chair: Lim, Sung-Kyu; Committee Member: Lee, Hsien-Hsin Sean; Committee Member: Loh, Gabrie

On-Chip Digital Decoupling Capacitance Methodology

Signal integrity has become a major problem in digital IC design. One cause of this problem is device scaling which results in a sharp reduction of supply voltage, creating stringent noise margin requirements to ensure functionality. Reductions in feature size also result in increased clock speeds leading to many different high frequency noise producing components. As on-chip area increases to allow for more computational capability, so does the amount of digital logic to be placed, magnifying the effects of noisy interconnect structures. Supply noise, modeled as AV = Ldi/dt , is caused by rapid current spikes during a rise or fall time. Decoupling capacitors often fill empty on-chip space for the purpose of limiting this noise. This work introduces a novel methodology that attempts to quantify and locate decoupling capacitors within a power distribution network. The bondwire attached on the periphery of the face of the die is taken to be the dominant source of inductance. It is shown that distributing capacitance closer to the switching elements is most effective at reducing supply noise. A chip has been designed using TSMC 90 nm technology that implements the ideas presented in this work. Simulation results show that noise fluctuations are high enough such that random placement of decoupling capacitance is not effective for large digital structures. The amount of interconnect generated on-chip noise increases with area, resulting in the need for an optimal decoupling scheme. As scaling continues, supply voltages and noise margins will decrease, creating the need for a robust decoupling capacitance methodology

Capacitor Optimization in Power Distribution Networks Using Numerical Computation Techniques

This paper presents a power distribution network (PDN) decoupling capacitor optimization application with three primary goals: reduction of solution times for large networks, development of flexible network scoring routines, and a concentration strictly on achieving the best network performance. Example optimizations are performed using broadband models of a printed circuit board (PCB), a chip-package, on-die networks, and candidate capacitors. A novel worst-case time-domain optimization technique is presented as an alternative to the traditional frequency-domain approach. The trade-offs and criteria for scoring the computed network are presented. The output is a recommended set of capacitors which can then be applied to the product design.Comment: 24 pages, 13 figures, DesignCon 202

Signal and power integrity co-simulation using the multi-layer finite difference method

Mixed signal system-on-package (SoP) technology is a key enabler for increasing functional integration, especially in mobile and wireless systems. Due to the presence of multiple dissimilar modules, each having unique power supply requirements, the design of the power distribution network (PDN) becomes critical. Typically, this PDN is designed as alternating layers of power and ground planes with signal interconnects routed in between or on top of the planes. The goal for the simulation of multi-layer power/ground planes, is the following: Given a stack-up and other geometrical information, it is required to find the network parameters (S/Y/Z) between port locations. Commercial packages have extremely complicated stack-ups, and the trend to increasing integration at the package level only points to increasing complexity. It is computationally intractable to solve these problems using these existing methods. The approach proposed in this thesis for obtaining the response of the PDN is the multi-layer finite difference method (M-FDM). A surface mesh / finite difference based approach is developed, which leads to a system matrix that is sparse and banded, and can be solved efficiently. The contributions of this research are the following: 1. The development of a PDN modeler for multi-layer packages and boards called the the multi-layer finite difference method. 2. The enhancement of M-FDM using multi-port connection networks to include the effect of fringe fields and gap coupling. 3. An adaptive triangular mesh based scheme called the multi-layer finite element method (MFEM) to address the limitations of M-FDM 4. The use of modal decomposition for the co-simulation of signal nets with the PDN. 5. The use of a robust GA-based optimizer for the selection and placement of decoupling capacitors in multi-layer geometries. 6. Implementation of these methods in a tool called MSDT 1.Ph.D.Committee Chair: Madhavan Swaminathan; Committee Member: Andrew F. Peterson; Committee Member: David C. Keezer; Committee Member: Saibal Mukhopadyay; Committee Member: Suresh Sitarama

System Level PDN Impedance Optimization Utilizing the Zeros of the Decoupling Capacitors

System-Level Power Distribution Network (PDN) Impedance Optimization Utilizing the Zeros of the Decoupling Capacitors (Decaps) is Discussed in This Paper. an Example of a Practical PDN Application is Proposed to Validate the Poles and Zeros Algorithm (P&Z) Presented. the System-Level PDN is with the Printed Circuit Board (PCB), Package (PKG), and Chip, as Well as the Low-Frequency Decaps on the PCB and the On-PKG Decoupling Capacitors. the PDN Optimization Results Are Compared with Those from the Genetic Algorithm (GA) to Show the Reasonableness and Validity of the P&Z Algorithm

GPU NTC Process Variation Compensation with Voltage Stacking

Near-threshold computing (NTC) has the potential to significantly improve efficiency in high throughput architectures, such as general-purpose computing on graphic processing unit (GPGPU). Nevertheless, NTC is more sensitive to process variation (PV) as it complicates power delivery. We propose GPU stacking, a novel method based on voltage stacking, to manage the effects of PV and improve the power delivery simultaneously. To evaluate our methodology, we first explore the design space of GPGPUs in the NTC to find a suitable baseline configuration and then apply GPU stacking to mitigate the effects of PV. When comparing with an equivalent NTC GPGPU without PV management, we achieve 37% more performance on average. When considering high production volume, our approach shifts all the chips closer to the nominal non-PV case, delivering on average (across chips) ˜80 % of the performance of nominal NTC GPGPU, whereas when not using our technique, chips would have ˜50 % of the nominal performance. We also show that our approach can be applied on top of multifrequency domain designs, improving the overall performance

System level power integrity transient analysis using a physics-based approach

With decreasing supply voltage level and massive demanding current on system chipset, power integrity design becomes more and more critical for system stability. The ultimate goal of well-designed power delivery network (PDN) is to deliver desired voltage level from the source to destination, in other words, to minimize voltage noise delivered to digital devices. The thesis is composed of three parts. The first part focuses on-die level power models including simplified chip power model (CPM) for system level analysis and the worst scenario current profile. The second part of this work introduces the physics-based equivalent circuit model to simplify the passive PDN model to RLC circuit netlist, to be compatible with any spice simulators and tremendously boost simulation speed. Then a novel system/chip level end-to-end transient model is proposed, including the die model and passive PDN model discussed in previous two chapters as well as a SIMPLIS based small signal VRM model. In the last part of the thesis, how to model voltage regulator module (VRM) is explicitly discussed. Different linear approximated VRM modeling approaches have been compared with the SIMPLIS small signal VRM model in both frequency domain and time domain. The comparison provides PI engineers a guideline to choose specific VRM model under specific circumstances. Finally yet importantly, a PDN optimization example was given. Other than previous PDN optimization approaches, a novel hybrid target impedance concept was proposed in this thesis, in order to improve system level PDN optimization process --Abstract, page iv

Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast