2,377 research outputs found
DSA-aware multiple patterning for the manufacturing of vias: Connections to graph coloring problems, IP formulations, and numerical experiments
In this paper, we investigate the manufacturing of vias in integrated
circuits with a new technology combining lithography and Directed Self Assembly
(DSA). Optimizing the production time and costs in this new process entails
minimizing the number of lithography steps, which constitutes a generalization
of graph coloring. We develop integer programming formulations for several
variants of interest in the industry, and then study the computational
performance of our formulations on true industrial instances. We show that the
best integer programming formulation achieves good computational performance,
and indicate potential directions to further speed-up computational time and
develop exact approaches feasible for production
VLSI Revisited - Revival in Japan
This paper describes the abundance of semiconductor consortia that have come into existence in Japan since the mid-1990s. They clearly reflect the ambition of the government - through its reorganized ministry METI and company initiatives - to regain some of the industrial and technological leadership that Japan has lost. The consortia landscape is very different in Japan compared with EU and the US. Outside Japan the universities play a much bigger and very important role. In Europe there has emerged close collaboration, among national government agencies, companies and the EU Commission in supporting the IT sector with considerable attention to semiconductor technologies. Another major difference, and possibly the most important one, is the fact that US and EU consortia include and mix partners from different areas of the semiconductor landscape including wafer makers, material suppliers, equipment producers and integrated device makers.semiconductors, Hitachi, Sony, Toshiba, Elpida, Renesas, Sematech, VLSI, JESSI, MEDEA, ASPLA, MIRAI, innovation system
Nanomechanical single-photon routing
The merger between integrated photonics and quantum optics promises new
opportunities within photonic quantum technology with the very significant
progress on excellent photon-emitter interfaces and advanced optical circuits.
A key missing functionality is rapid circuitry reconfigurability that
ultimately does not introduce loss or emitter decoherence, and operating at a
speed matching the photon generation and quantum memory storage time of the
on-chip quantum emitter. This ambitious goal requires entirely new active
quantum-photonic devices by extending the traditional approaches to
reconfigurability. Here, by merging nano-optomechanics and deterministic
photon-emitter interfaces we demonstrate on-chip single-photon routing with low
loss, small device footprint, and an intrinsic time response approaching the
spin coherence time of solid-state quantum emitters. The device is an essential
building block for constructing advanced quantum photonic architectures
on-chip, towards, e.g., coherent multi-photon sources, deterministic
photon-photon quantum gates, quantum repeater nodes, or scalable quantum
networks.Comment: 7 pages, 3 figures, supplementary informatio
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