Phased Array Systems in Silicon

Phased array systems, a special case of MIMO systems, take advantage of spatial directivity and array gain to increase spectral efficiency. Implementing a phased array system at high frequency in a commercial silicon process technology presents several challenges. This article focuses on the architectural and circuit-level trade-offs involved in the design of the first silicon-based fully integrated phased array system operating at 24 GHz. The details of some of the important circuit building blocks are also discussed. The measured results demonstrate the feasibility of using integrated phased arrays for wireless communication and vehicular radar applications at 24 GHz

SiGe EAM-based transceivers for datacenter interconnects and radio over fiber

Silicon photonics is a key-enabling technology leveraging decades of effort and infrastructure of the microelectronics CMOS industry resulting in high yield, low cost and potential high volume manufacturing. Furthermore, due to the high index contrast of the platform, very compact, high-complexity photonic integrated circuits can be devised. To benefit from these advantages, high-speed modulators should also be compatible with silicon technology. In this respect, SiGe electro-absorption modulators (EAM) are considered as a promising candidate since they are CMOS-compatible and offer high-speed, compact, low-loss and low-power modulation. In this paper, we discuss SiGe EAM-based transceivers for next-generation datacenter interconnects (DCI) and radio-over-fiber (RoF) fronthaul in next-generation cellular networks

Digitally-Assisted RF IC Design Techniques for Reliable Performance

Semiconductor industries have competitively scaled down CMOS devices to attain benefits of low cost, high performance, and high integration density in digital integrated circuits. On the other hand, deep scaled technologies inextricably accompany a large process variation, supply voltage scaling, and reduction in breakdown voltages of transistors. When it comes to RF/analog IC design, CMOS scaling adversely affects its reliability due to large performance variation and limited linearity. For addressing the issues related to variations and linearity, this research proposes the following digitally-assisted RF circuit design techniques: self-calibration system for RF phase shifters and wide dynamic range LNAs. Due to PVT variations in scaled technologies, RF phase shifter design becomes more challenging with device scaling. In the proposed self-calibration topology, we devised a novel phase sensing method and a pulsewidth-to-digital converter. The feedback controller is also designed in digital domain, which is robust to PVT variations. These unique techniques enable a sensing/control loop tolerant to PVT variations. The self-calibration loop was applied to a 7 to 13GHz phase shifter. With the calibration, the estimated phase error is less than 2 degrees. To overcome the linearity issue in scaled technologies, a digitally-controlled dual-mode LNA design is presented. A narrowband (5.1GHz) and a wideband (0.8 to 6GHz) LNA can be toggled between high-gain and high-linearity modes by digital control bits according to the input signal power. A compact design, which provides negligible performance degradation by additional circuitry, is achieved by sharing most of the components between the two operation modes. The narrowband and the wideband LNA achieves an input-referred P1dB of -1.8dBm and +4.2dBm, respectively

Design of a tunable multi-band differential LC VCO using 0.35 mu m SiGe BiCMOS technology for multi-standard wireless communication systems

In this paper, an integrated 2.2-5.7GHz multi-band differential LC VCO for multi-standard wireless communication systems was designed utilizing 0.35 mu m SiGe BiCMOS technology. The topology, which combines the switching inductors and capacitors together in the same circuit, is a novel approach for wideband VCOs. Based on the post-layout simulation results, the VCO can be tuned using a DC voltage of 0 to 3.3 V for 5 different frequency bands (2.27-2.51 GHz, 2.48-2.78 GHz, 3.22-3.53 GHz, 3.48-3.91 GHz and 4.528-5.7 GHz) with a maximum bandwidth of 1.36 GHz and a minimum bandwidth of 300 MHz. The designed and simulated VCO can generate a differential output power between 0.992 and -6.087 dBm with an average power consumption of 44.21 mW including the buffers. The average second and third harmonics level were obtained as -37.21 and -47.6 dBm, respectively. The phase noise between -110.45 and -122.5 dBc/Hz, that was simulated at 1 MHz offset, can be obtained through the frequency of interest. Additionally, the figure of merit (FOM), that includes all important parameters such as the phase noise, the power consumption and the ratio of the operating frequency to the offset frequency, is between -176.48 and -181.16 and comparable or better than the ones with the other current VCOs. The main advantage of this study in comparison with the other VCOs, is covering 5 frequency bands starting from 2.27 up to 5.76 GHz without FOM and area abandonment. Output power of the fundamental frequency changes between -6.087 and 0.992 dBm, depending on the bias conditions (operating bands). Based on the post-layout simulation results, the core VCO circuit draws a current between 2.4-6.3 mA and between 11.4 and 15.3 mA with the buffer circuit from 3.3 V supply. The circuit occupies an area of 1.477 mm(2) on Si substrate, including DC, digital and RF pads

Design of Tunable Low-Noise Amplifier in 0.13um CMOS Technology for Multistandard RF Transceivers

The global market of mobile and wireless communications is witnessing explosive growth in size as well as radical changes. Third generation (3G) wireless systems have recently been deployed and some are still in the process. 3G wireless systems promise integration of voice and data communications with higher data rates and a superior quality of service compared to second generation systems. Unfortunately, more and more communication standards continue to be developed which ultimately requires specific RF/MW and baseband communication integrated circuits that are designed for functionality and compatibility with a specific type of network. Although communication devices such as cellular phones integrate different services such as voice, Bluetooth, GPS, and WLAN, each service requires its own dedicated radio transceiver which results in high power consumption and larger PCB area usage. With the rapid advances in silicon CMOS integrated circuit technology combined with extensive research, a global solutionswhich aims at introducing a global communication system that encompasses all communication standards appears to be emerging. State of the art CMOS technology not only has the capability of operation in the GHz range, but it also provides the advantage of low cost and high level of integration. These features propel CMOS technology as the ideal candidate for current trends, which currently aim to integrate more RF/MW circuits on the same chip. Armed with such technology ideas such as software radio look more attainable than they ever were in the past. Unfortunately, realizing true software radio for mobile applications still remains a tremendous challenge since it requires a high sampling rate and a wide-bandwidth Analog-to-Digital converter which is extremely power hungry and not suitable for battery operated mobile devices. Another approach to realize a flexible and reconfigurable RF/MW transceiver that could operate in a diverse mobile environment and provides a multiband and multistandard solution. The work presented in this thesis focuses on the design of an integrated and tunable low-noise amplifier as part of software defined radio (SDR)

Automatic Tuning of Silicon Photonics Millimeter-Wave Transceivers Building Blocks

Today, continuously growing wireless traffic have guided the progress in the wireless communication systems. Now, evolution towards next generation (5G) wireless communication systems are actively researched to accommodate expanding future data traffic. As one of the most promising candidates, integrating photonic devices in to the existing wireless system is considered to improve the performance of the systems. Emerging silicon photonic integrated circuits lead this integration more practically, and open new possibilities to the future communication systems. In this dissertation, the development of the electrical wireless communication systems are briefly explained. Also, development of the microwave photonics and silicon photonics are described to understand the possibility of the hybrid SiP integrated wireless communication systems. A limitation of the current electrical wireless systems are addressed, and hybrid integrated mm-wave silicon photonic receiver, and silicon photonic beamforming transmitter are proposed and analyzed in system level. In the proposed mm-wave silicon photonic receiver has 4th order pole-zero silicon photonic filter in the system. Photonic devices are vulnerable to the process and temperature variations. It requires manual calibration, which is expensive, time consuming, and prone to human errors. Therefore, precise automatic calibration solution with modified silicon photonic filter structure is proposed and demonstrated. This dissertation demonstrates fully automatic tuning of silicon photonic all-pass filter (APF)-based pole/zero filters using a monitor-based tuning method that calibrates the initial response by controlling each pole and zero individually via micro-heaters. The proposed tuning approach calibrates severely degraded initial responses to the designed elliptic filter shapes and allows for automatic bandwidth and center frequency reconfiguration of these filters. This algorithm is demonstrated on 2nd- and 4th-order filters fabricated in a standard silicon photonics foundry process. After the initial calibration, only 300ms is required to reconfigure a filter to a different center frequency. Thermal crosstalk between the micro-heaters is investigated, with substrate thinning demonstrated to suppress this effect and reduce filter calibration to less than half of the original thick substrate times. This fully automatic tuning approach opens the possibility of employing silicon photonic filters in real communication systems. Also, in the proposed beamforming transmitter, true-time delay ring resonator based 1x4 beamforming network is imbedded. A proposed monitor-based tuning method compensates fabrication variations and thermal crosstalk by controlling micro-heaters individually using electrical monitors. The proposed tuning approach successfully demonstrated calibration of OBFN from severely degraded initial responses to well-defined group delay response required for the targeted radiating angle with a range of 60◦ (-30◦ to 30◦ ) in a linear beamforming antenna array. This algorithm is demonstrated on OBFN fabricated in a standard silicon photonics foundry process. The calibrated OBFN operates at 30GHz and provide 2GHz bandwidth. This fully automatic tuning approach opens the possibility of employing silicon OBFN in real wideband mm-wave wireless communication systems by providing robust operating solutions. All the proposed photonic circuits are implemented using the standard silicon photonic technologies, and resulted in several publications in IEEE/OSA Journals and Conferences

Efficient and Linear CMOS Power Amplifier and Front-end Design for Broadband Fully-Integrated 28-GHz 5G Phased Arrays

Demand for data traffic on mobile networks is growing exponentially with time and on a global scale. The emerging fifth-generation (5G) wireless standard is being developed with millimeter-wave (mm-Wave) links as a key technological enabler to address this growth by a 2020 time frame. The wireless industry is currently racing to deploy mm-Wave mobile services, especially in the 28-GHz band. Previous widely-held perceptions of fundamental propagation limitations were overcome using phased arrays. Equally important for success of 5G is the development of low-power, broadband user equipment (UE) radios in commercial-grade technologies. This dissertation demonstrates design methodologies and circuit techniques to tackle the critical challenge of key phased array front-end circuits in low-cost complementary metal oxide semiconductor (CMOS) technology. Two power amplifier (PA) proof-of-concept prototypes are implemented in deeply scaled 28- nm and 40-nm CMOS processes, demonstrating state-of-the-art linearity and efficiency for extremely broadband communication signals. Subsequently, the 40 nm PA design is successfully embedded into a low-power fully-integrated transmit-receive front-end module. The 28 nm PA prototype in this dissertation is the first reported linear, bulk CMOS PA targeting low-power 5G mobile UE integrated phased array transceivers. An optimization methodology is presented to maximizing power added efficiency (PAE) in the PA output stage at a desired error vector magnitude (EVM) and range to address challenging 5G uplink requirements. Then, a source degeneration inductor in the optimized output stage is shown to further enable its embedding into a two-stage transformer-coupled PA. The inductor helps by broadening inter-stage impedance matching bandwidth, and helping to reduce distortion. Designed and fabricated in 1P7M 28 nm bulk CMOS and using a 1 V supply, the PA achieves +4.2 dBm/9% measured Pout/PAE at −25 dBc EVM for a 250 MHz-wide, 64-QAM orthogonal frequency division multiplexing (OFDM) signal with 9.6 dB peak-to-average power ratio (PAPR). The PA also achieves 35.5%/10% PAE for continuous wave signals at saturation/9.6dB back-off from saturation. To the best of the author’s knowledge, these are the highest measured PAE values among published K- and K a-band CMOS PAs to date. To drastically extend the communication bandwidth in 28 GHz-band UE devices, and to explore the potential of CMOS technology for more demanding access point (AP) devices, the second PA is demonstrated in a 40 nm process. This design supports a signal radio frequency bandwidth (RFBW) >3× the state-of-the-art without degrading output power (i.e. range), PAE (i.e. battery life), or EVM (i.e. amplifier fidelity). The three-stage PA uses higher-order, dual-resonance transformer matching networks with bandwidths optimized for wideband linearity. Digital gain control of 9 dB range is integrated for phased array operation. The gain control is a needed functionality, but it is largely absent from reported high-performance mm-Wave PAs in the literature. The PA is fabricated in a 1P6M 40 nm CMOS LP technology with 1.1 V supply, and achieves Pout/PAE of +6.7 dBm/11% for an 8×100 MHz carrier aggregation 64-QAM OFDM signal with 9.7 dB PAPR. This PA therefore is the first to demonstrate the viability of CMOS technology to address even the very challenging 5G AP/downlink signal bandwidth requirement. Finally, leveraging the developed PA design methodologies and circuits, a low power transmit-receive phased array front-end module is fully integrated in 40 nm technology. In transmit-mode, the front-end maintains the excellent performance of the 40 nm PA: achieving +5.5 dBm/9% for the same 8×100 MHz carrier aggregation signal above. In receive-mode, a 5.5 dB noise figure (NF) and a minimum third-order input intercept point (IIP₃) of −13 dBm are achieved. The performance of the implemented CMOS frontend is comparable to state-of-the-art publications and commercial products that were very recently developed in silicon germanium (SiGe) technologies for 5G communication

A robust 2.4 GHz time-of-arrival based ranging system with sub-meter accuracy: feasibility study and realization of low power CMOS receiver

Draadloze sensornetwerken worden meer en meer aangewend om verschillende soorten informatie te verzamelen. De locatie, waar deze informatie verzameld is, is een belangerijke eigenschap en voor sommige toepassingen, zoals het volgen van personen of goederen, zelfs de meest belangrijke en mogelijkmakende factor. Om de positie van een sensor te bepalen, is een technologie nodig die de afstand tot een gekend referentiepunt schat. Door verschillende afstandsmetingen te combineren, is het mogelijk de absolute locatie van de node te berekenen

A dual-mode Q-enhanced RF front-end filter for 5 GHz WLAN and UWB with NB interference rejection

The 5 GHz Wireless LAN (802.11a) is a popular standard for wireless indoor communications providing moderate range and speed. Combined with the emerging ultra Wideband standard (UWB) for short range and high speed communications, the two standards promise to fulfil all areas of wireless application needs. However, due to the overlapping of the two spectrums, the stronger 802.11a signals tend to interfere causing degradation to the UWB receiver. This presents one of the main technical challenges preventing the wide acceptance of UWB. The research work presented in this thesis is to propose a low cost RF receiver front-end filter topology that would resolve the narrowband (NB) interference to UWB receiver while being operable in both 802.11a mode and UWB mode. The goal of the dual mode filter design is to reduce cost and complexity by developing a fully integrated front-end filter. The filter design utilizes high Q passive devices and Q-enhancement technique to provide front-end channel-selection in NB mode and NB interference rejection in UWB mode. In the 802.11a NB mode, the filter has a tunable gain of 4 dB to 25 dB, NF of 8 dB and an IIP3 between -47 dBm and -18 dBm. The input impedance is matched at -16 dB. The frequency of operation can be tuned from 5.15 GHz to 5.35 GHz. In the UWB mode, the filter has a gain of 0 dB to 8 dB across 3.1 GHz to 9 GHz. The filter can reject the NB interference between 5.15 GHz to 5.35 GHz at up to 60 dB. The Q of the filter is tunable up to a 250 while consuming a maximum of 23.4 mW of power. The fully integrated dual mode filter occupies a die area of 1.1 mm2