Design and Architectural Assessment of 3-D Resistive Memory Technologies in FPGAs

Emerging Non-Volatile Memories (eNVMs) such as Phase-Change RAMs (PCRAMs) or Oxide-based Resistive RAMs (OxRRAMs) are promising candidates to replace Flash and Static Random Access Memories in many applications. This paper introduces a novel set of building blocks for Field-Programmable Gate Arrays (FPGAs) using eNVMs. We propose an eNVM-based configuration point, a look-up table structure with reduced programming complexity and a high-performance switchbox arrangement. We show that these blocks yield an improvement in area and write time of up to 3x and 33x respectively vs. a regular Flash implementation. By integrating the designed blocks in a FPGA, we demonstrate an area and delay reduction of up to 28% and 34% respectively on a set of benchmark circuits. These reductions are due to the eNVM 3-D integration and to their low on-resistance state value. Finally, we survey many flavors of the technologies and we show that the best results in terms of area and delay are obtained with Pt/TiO2/Pt stack, while the lowest leakage power is achieved by InGeTe stack

Digital Circuit Design Using Floating Gate Transistors

Floating gate (flash) transistors are used exclusively for memory applications today. These applications include SD cards of various form factors, USB flash drives and SSDs. In this thesis, we explore the use of flash transistors to implement digital logic circuits. Since the threshold voltage of flash transistors can be modified at a fine granularity during programming, several advantages are obtained by our flash-based digital circuit design approach. For one, speed binning at the factory can be controlled with precision. Secondly, an IC can be re-programmed in the field, to negate effects such as aging, which has been a significant problem in recent times, particularly for mission-critical applications. Thirdly, unlike a regular MOSFET, which has one threshold voltage level, a flash transistor can have multiple threshold voltage levels. The benefit of having multiple threshold voltage levels in a flash transistor is that it allows the ability to encode more symbols in each device, unlike a regular MOSFET. This allows us to implement multi-valued logic functions natively. In this thesis, we evaluate different flash-based digital circuit design approaches and compare their performance with a traditional CMOS standard cell-based design approach. We begin by evaluating our design approach at the cell level to optimize the design’s delay, power energy and physical area characteristics. The flash-based approach is demonstrated to be better than the CMOS standard cell approach, for these performance metrics. Afterwards, we present the performance of our design approach at the block level. We describe a synthesis flow to decompose a circuit block into a network of interconnected flash-based circuit cells. We also describe techniques to optimize the resulting network of flash-based circuit cells using don’t cares. Our optimization approach distinguishes itself from other optimization techniques that use don’t cares, since it a) targets a flash-based design flow, b) optimizes clusters of logic nodes at once instead of one node at a time, c) attempts to reduce the number of cubes instead of reducing the number of literals in each cube and d) performs optimization on the post-technology mapped netlist which results in a direct improvement in result quality, as compared to pre-technology mapping logic optimization that is typically done in the literature. The resulting network characteristics (delay, power, energy and physical area) are presented. These results are compared with a standard cell-based realization of the same block (obtained using commercial tools) and we demonstrate significant improvements in all the design metrics. We also study flash-based FPGA designs (both static and dynamic), and present the tradeoff of delay, power dissipation and energy consumption of the various designs. Our work differs from previously proposed flash-based FPGAs, since we embed the flash transistors (which store the configuration bits) directly within the logic and interconnect fabrics. We also present a detailed description of how the programming of the configuration bits is accomplished, for all the proposed designs

Digital Circuit Design Using Floating Gate Transistors

Floating gate (flash) transistors are used exclusively for memory applications today. These applications include SD cards of various form factors, USB flash drives and SSDs. In this thesis, we explore the use of flash transistors to implement digital logic circuits. Since the threshold voltage of flash transistors can be modified at a fine granularity during programming, several advantages are obtained by our flash-based digital circuit design approach. For one, speed binning at the factory can be controlled with precision. Secondly, an IC can be re-programmed in the field, to negate effects such as aging, which has been a significant problem in recent times, particularly for mission-critical applications. Thirdly, unlike a regular MOSFET, which has one threshold voltage level, a flash transistor can have multiple threshold voltage levels. The benefit of having multiple threshold voltage levels in a flash transistor is that it allows the ability to encode more symbols in each device, unlike a regular MOSFET. This allows us to implement multi-valued logic functions natively. In this thesis, we evaluate different flash-based digital circuit design approaches and compare their performance with a traditional CMOS standard cell-based design approach. We begin by evaluating our design approach at the cell level to optimize the design’s delay, power energy and physical area characteristics. The flash-based approach is demonstrated to be better than the CMOS standard cell approach, for these performance metrics. Afterwards, we present the performance of our design approach at the block level. We describe a synthesis flow to decompose a circuit block into a network of interconnected flash-based circuit cells. We also describe techniques to optimize the resulting network of flash-based circuit cells using don’t cares. Our optimization approach distinguishes itself from other optimization techniques that use don’t cares, since it a) targets a flash-based design flow, b) optimizes clusters of logic nodes at once instead of one node at a time, c) attempts to reduce the number of cubes instead of reducing the number of literals in each cube and d) performs optimization on the post-technology mapped netlist which results in a direct improvement in result quality, as compared to pre-technology mapping logic optimization that is typically done in the literature. The resulting network characteristics (delay, power, energy and physical area) are presented. These results are compared with a standard cell-based realization of the same block (obtained using commercial tools) and we demonstrate significant improvements in all the design metrics. We also study flash-based FPGA designs (both static and dynamic), and present the tradeoff of delay, power dissipation and energy consumption of the various designs. Our work differs from previously proposed flash-based FPGAs, since we embed the flash transistors (which store the configuration bits) directly within the logic and interconnect fabrics. We also present a detailed description of how the programming of the configuration bits is accomplished, for all the proposed designs

High speed IC designs for low power short reach optical links

In this thesis, I have briefly introduced the background of my PhD research, current state-of-the-art design, and my PhD research objectives. Then, I demonstrate how to optimize the performance of PAM-4 transmitters based on lumped Silicon Photonic Mach-Zehnder Modulators (MZMs) for short-reach optical links. Firstly, we analyze the trade-off that occurs between extinction ratio and modulation loss when driving an MZM with a voltage swing less than the MZM’s Vπ. This is important when driver circuits are realized in deep submicron CMOS process nodes. Next, a driving scheme based upon a switched capacitor approach is proposed to maximize the achievable bandwidth of the combined lumped MZM and CMOS driver chip. This scheme allows the use of lumped MZM for high speed optical links with reduced RF driver power consumption compared to the conventional approach of driving MZMs (with transmission line based electrodes) with a power amplifier. This is critical for upcoming short-reach link standards such as 400Gb/s 802.3 Ethernet. The driver chip was fabricated using a 65nm CMOS technology and flip-chipped on top of the Silicon Photonic chip (fabricated using IMEC’s ISIPP25G technology) that contains the MZM. Open eyes with 4dB extinction ratio for a 36Gb/s (18Gbaud) PAM- 4 signal are experimentally demonstrated. The electronic driver chip has a core area of only 0.11mm 2 and consumes 236mW from 1.2V and 2.4V supply voltages. This corresponds to an energy efficiency of 6.55pJ/bit including Gray encoder and retiming, or 5.37pJ/bit for the driver circuit only. In the future, system level analysis should be carried out to investigate the critical pattern issue of the PAM4 optical transmitter. The potential solutions toward 1pJ/bit are given (lumped EAM and micro-ring modulator). In addition, the advanced modulation formats (16 QAM, discrete multitone modulation, and FFE) are presented based on the switched capacitor approach

Monolithic electronic-photonic integration in state-of-the-art CMOS processes

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2012.This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.Cataloged from student submitted PDF version of thesis.Includes bibliographical references (p. 388-407).As silicon CMOS transistors have scaled, increasing the density and energy efficiency of computation on a single chip, the off-chip communication link to memory has emerged as the major bottleneck within modern processors. Photonic devices promise to break this bottleneck with superior bandwidth-density and energy-efficiency. Initial work by many research groups to adapt photonic device designs to a silicon-based material platform demonstrated suitable independent performance for such links. However, electronic-photonic integration attempts to date have been limited by the high cost and complexity associated with modifying CMOS platforms suitable for modern high-performance computing applications. In this work, we instead utilize existing state-of-the-art electronic CMOS processes to fabricate integrated photonics by: modifying designs to match the existing process; preparing a design-rule compliant layout within industry-standard CAD tools; and locally-removing the handle silicon substrate in the photonic region through post-processing. This effort has resulted in the fabrication of seven test chips from two major foundries in 28, 45, 65 and 90 nm CMOS processes. Of these efforts, a single die fabricated through a widely available 45nm SOI-CMOS mask-share foundry with integrated waveguides with 3.7 dB/cm propagation loss alongside unmodified electronics with less than 5 ps inverter stage delay serves as a proof-of-concept for this approach. Demonstrated photonic devices include high-extinction carrier-injection modulators, 8-channel wavelength division multiplexing filter banks and low-efficiency silicon germanium photodetectors. Simultaneous electronic-photonic functionality is verified by recording a 600 Mb/s eye diagram from a resonant modulator driven by integrated digital circuits. Initial work towards photonic device integration within the peripheral CMOS flow of a memory process that has resulted in polysilicon waveguide propagation losses of 6.4 dB/cm will also be presented.by Jason S. Orcutt.Ph.D

Packages for Terahertz Electronics

In the last couple of decades, solid-state device technologies, particularly electronic semiconductor devices, have been greatly advanced and investigated for possible adoption in various terahertz (THz) applications, such as imaging, security, and wireless communications. In tandem with these investigations, researchers have been exploring ways to package those THz electronic devices and integrated circuits for practical use. Packages are fundamentally expected to provide a physical housing for devices and integrated circuits (ICs) and reliable signal interconnections from the inside to the outside or vice versa. However, as frequency increases, we face several challenges associated with signal loss, dimensions, and fabrication. This paper provides a broad overview of recent progress in interconnections and packaging technologies dealing with these issues for THz electronics. In particular, emerging concepts based on commercial ceramic technologies, micromachining, and 3-D printing technologies for compact and lightweight packaging in practical applications are highlighted, along with metallic split blocks with rectangular waveguides, which are still considered the most valid and reliable approach.119Ysciescopu

Design space exploration of photonic interconnects

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2011.Cataloged from PDF version of thesis.Includes bibliographical references (p. 109-113).As processors scale deep into the multi-core and many-core regimes, bandwidth and energy-efficiency of the on-die interconnect network have become paramount design issues. Recognizing potential limits of electrical interconnects, emerging nanophotonic integration has been recently proposed as a potential technology option for both on-chip and chip-to-chip applications. As optical links avoid the capacitive, resistive and signal integrity limits imposed upon electrical interconnects, the introduction of integrated photonics allows for efficient realization of physical connectivity that are costly to accomplish electrically. While many recent works have since cited the potential benefits of optics, inherent design tradeoffs of photonic datapath and backend components remain relatively unknown at the system-level. This thesis develops insights regarding the behavior of electrical and hybrid optoelectrical networks and systems. We present power and area models that capture the behavior of electrical interface circuits and their interactions with optical devices. To animate these models in the context of a full system, we contribute DSENT, a novel physical modeling framework capable of estimating the costs of generalized digital electronics, mixed-signal interface circuitry, and optical links. With DSENT, we enable fast power and area evaluation of entire networks to connect the dynamics of an underlying photonics interconnect to that of an otherwise electrical system. Using our methodolody, we perform a technology-driven design space exploration of intra-chip networks and highlight the importance of thermal tuning and parasitic receiver capacitances in network power consumption. We show that the performance gains enabled by photonics-inspired architectures can enable savings in total system energy even if the network is more costly. Finally, we propose a photonically interconnected DRAM system as a solution to the core-to-DRAM bandwidth bottleneck. By attacking energy consumption at the DRAM channel, chip, and bank level with integrated photoncis, we cut the power consumption of the DRAM system by 10x while remaining area neutral when compared to a projected electrical baseline.by Chen Sun.S.M

Circuit Design, Architecture and CAD for RRAM-based FPGAs

Field Programmable Gate Arrays (FPGAs) have been indispensable components of embedded systems and datacenter infrastructures. However, energy efficiency of FPGAs has become a hard barrier preventing their expansion to more application contexts, due to two physical limitations: (1) The massive usage of routing multiplexers causes delay and power overheads as compared to ASICs. To reduce their power consumption, FPGAs have to operate at low supply voltage but sacrifice performance because the transistors drive degrade when working voltage decreases. (2) Using volatile memory technology forces FPGAs to lose configurations when powered off and to be reconfigured at each power on. Resistive Random Access Memories (RRAMs) have strong potentials in overcoming the physical limitations of conventional FPGAs. First of all, RRAMs grant FPGAs non-volatility, enabling FPGAs to be "Normally powered off, Instantly powered on". Second, by combining functionality of memory and pass-gate logic in one unique device, RRAMs can greatly reduce area and delay of routing elements. Third, when RRAMs are embedded into datpaths, the performance of circuits can be independent from their working voltage, beyond the limitations of CMOS circuits. However, researches and development of RRAM-based FPGAs are in their infancy. Most of area and performance predictions were achieved without solid circuit-level simulations and sophisticated Computer Aided Design (CAD) tools, causing the predicted improvements to be less convincing. In this thesis,we present high-performance and low-power RRAM-based FPGAs fromtransistorlevel circuit designs to architecture-level optimizations and CAD tools, using theoretical analysis, industrial electrical simulators and novel CAD tools. We believe that this is the first systematic study in the field, covering: From a circuit design perspective, we propose efficient RRAM-based programming circuits and routing multiplexers through both theoretical analysis and electrical simulations. The proposed 4T(ransitor)1R(RAM) programming structure demonstrates significant improvements in programming current, when compared to most popular 2T1R programming structure. 4T1R-based routingmultiplexer designs are proposed by considering various physical design parasitics, such as intrinsic capacitance of RRAMs and wells doping organization. The proposed 4T1R-based multiplexers outperformbest CMOS implementations significantly in area, delay and power at both nominal and near-Vt regime. From a CAD perspective, we develop a generic FPGA architecture exploration tool, FPGASPICE, modeling a full FPGA fabric with SPICE and Verilog netlists. FPGA-SPICE provides different levels of testbenches and techniques to split large SPICE netlists, in order to obtain better trade-off between simulation time and accuracy. FPGA-SPICE can capture area and power characteristics of SRAM-based and RRAM-based FPGAs more accurately than the currently best analyticalmodels. From an architecture perspective, we propose architecture-level optimizations for RRAMbased FPGAs and quantify their minimumrequirements for RRAM devices. Compared to the best SRAM-based FPGAs, an optimized RRAM-based FPGA architecture brings significant reduction in area, delay and power respectively. In particular, RRAM-based FPGAs operating in the near-Vt regime demonstrate a 5x power improvement without delay overhead as compared to optimized SRAM-based FPGA operating at nominal working voltage