Super-gain-boosted AB-AB fully differential Miller op-amp with 156dB open-loop gain and 174MV/V MHZ pF/uW figure of merit in 130nm CMOS technology

A fully differential Miller op-amp with a composite input stage using resistive local common-mode feedback and regulated cascode transistors is presented here. High gain pseudo-differential auxiliary amplifiers are used to implement the regulated cascode transistors in order to boost the output impedance of the composite input stage and the open-loop gain of the op-amp. Both input and output stages operate in class AB mode. The proposed op-amp has been simulated in a 130nm commercial CMOS process technology. It operates from a 1.2V supply and has a close to rail-to-rail differential output swing. It has 156dB DC open-loop gain and 63MHz gain-bandwidth product with a 30pF capacitive load. The op-amp has a DC open-loop gain figure of merit FOMAOLDC of 174 (MV/V) MHz pF/uW and large-signal figure of merit FOMLS of 3(V/us) pF/uW.This work was supported in part by the Spanish Government Agencia Estatal de Investigación (AEI) under Grant TEC2016-80396-C2, in part by the Consejería de Economía y Conocimiento of Junta de Andalucía under Grant P18-FR-4317 (both projects received support from the Fondo Europeo de Desarrollo Regional (FEDER)), and in part by the Consejo Nacional de Ciencia y Tecnologia (CONACyT) under Grant A1-S-43214

Super-Gain-Boosted AB-AB Fully Differential Miller Op-Amp With 156dB Open-Loop Gain and 174MV/V MHZ pF/µW Figure of Merit in 130nm CMOS Technology

Article number 9400400A fully differential Miller op-amp with a composite input stage using resistive local common-mode feedback and regulated cascode transistors is presented here. High gain pseudo-differential auxiliary amplifiers are used to implement the regulated cascode transistors in order to boost the output impedance of the composite input stage and the open-loop gain of the op-amp. Both input and output stages operate in class AB mode. The proposed op-amp has been simulated in a 130nm commercial CMOS process technology. It operates from a 1.2V supply and has a close to rail-to-rail differential output swing. It has 156dB DC open-loop gain and 63MHz gain-bandwidth product with a 30pF capacitive load. The op-amp has a DC open-loop gain figure of merit FOMAOLDC of 174 (MV/V) MHz pF/µW and large-signal figure of merit FOMLS of 3(V/µs) pF/µW.Consejería de Economía y Conocimiento of Junta de Andalucía P18-FR-4317Consejo Nacional de Ciencia y Tecnología (España) A1-S-43214Agencia Estatal de Investigación TEC2016-80396-C

Performance analysis and design optimization of parallel-type slew-rate enhancers for switched-capacitor applications

The design of single-stage OTAs for accurate switched-capacitor circuits involves challenging trade-offs between speed and power consumption. The addition of a Slew-Rate Enhancer (SRE) circuit placed in parallel to the main OTA (parallel-type SRE) constitutes a viable solution to reduce the settling time, at the cost of low-power overhead and no modifications of the main OTA. In this work, a practical analytical model has been developed to predict the settling time reduction achievable with OTA/SRE systems and to show the effect of the various design parameters. The model has been applied to a real case, consisting of the combination of a standard folded-cascode OTA with an existing parallel-type SRE solution. Simulations performed on a circuit designed with a commercial 180-nm CMOS technology revealed that the actual settling-time reduction was significantly smaller than predicted by the model. This discrepancy was explained by taking into account the internal delays of the SRE, which is exacerbated when a high output current gain is combined with high power efficiency. To overcome this problem, we propose a simple modification of the original SRE circuit, consisting in the addition of a single capacitor which temporarily boosts the OTA/SRE currents reducing the internal turn-on delay. With the proposed approach a settling-time reduction of 57% has been demonstrated with an SRE that introduces only a 10% power-overhead with respect of the single OTA solution. The robustness of the results have been validated by means of Monte-Carlo simulations

Power-Efficient and High-Performance Cicruit Techniques for On-Chip Voltage Regulation and Low-Voltage Filtering

This dissertation focuses on two projects. The first one is a power supply rejection (PSR) enhanced with fast settling time (TS) bulk-driven feedforward (BDFF) capacitor-less (CL) low-dropout (LDO) regulator. The second project is a high bandwidth (BW) power adjustable low-voltage (LV) active-RC 4th -order Butterworth low pass filter (LPF). As technology improves, faster and more accurate LDOs with high PSR are going to be required for future on-chip applications and systems.The proposed BDFF CL-LDO will accomplish an improved PSR without degrading TS. This would be achieved by injecting supply noise through the pass device’s bulk terminal in order to cancel the supply noise at the output. The supply injection will be achieved by creating a feedforward path, which compared to feedback paths, that doesn’t degrade stability and therefore allows for faster dynamic performance. A high gain control loop would be used to maintain a high accuracy and dc performance, such as line/load regulation. The proposed CL-LDO will target a PSR better than – 90 dB at low frequencies and – 60 dB at 1 MHz for 50 mA of load current (IvL). The CL-LDO will target a loop gain higher than 90 dB, leading to an improved line and load regulation, and unity-gain frequency (UGF) higher than 20 MHz, which will allow a TS faster than 500 ns. The CL-LDO is going to be fabricated in a CMOS 130 nm technology; consume a quiescent current (IQ) of less than 50 μA; for a dropout voltage of 200 mV and an IvL of 50 mA. As technology scales down, speed and performance requirements increase for on-chip communication systems that reflect the current demand for high speed data-oriented applications. However, in small technologies, it becomes harder to achieve high gain and high speed at the same time because the supply voltage (VvDvD) decreases leaving no room for conventional high gain CMOS structures. The proposed active-RC LPF will accomplish a LV high BW operation that would allow such disadvantages to be overcome. The LPF will be implemented using an active RC structure that allows for the high linearity such communication systems demand. In addition, built-in BW and power configurability would address the demands for increased flexibility usually required in such systems. The proposed LV LPF will target a configurable cut-off frequency (ƒо) of 20/40/80/160 MHz with tuning capabilities and power adjustability for each ƒо. The filter will be fabricated in a CMOS 130 nm technology. The filter characteristics are as following: 4th -order, active-RC, LPF, Butterworth response, VDD = 0.6 V, THD higher than 40 dB and a third-order input intercept point (IIP3) higher than 10 dBm

Active Noise Shaping Analog-to-Digital Data Converters

Successive-approximation-register (SAR) analog-to-digital converters are popular for medium accuracy, medium speed and low power applications, such as in biomedical applications. They have low latency and simple architecture compared with ΔΣ ADCs. This is because of SAR ADCs’ binary searching scheme. Furthermore, SAR ADCs can apply oversampling and noise shaping schemes which are used in ΔΣ ADCs. As a result, the noise-shaping SAR ADC architecture has received more and more attention as a high resolution and power efficient solution for many sensor applications. In this dissertation, novel configurations have been explored for noise-shaping SAR ADCs for power-efficient and high-accuracy data conversion. Frist, a first-order noise-shaping (NS) SAR ADC using a two-capacitor based DAC (2-C DAC) is described and discussed. There are only two equal valued capacitors used in the DAC, so the total number of capacitors is much less than in conventional binary weighted DAC. Therefore, the 2-C DAC is good for capacitor matching. Furthermore, this 2-C DAC architecture only samples the reference once, so that the proposed NS SAR ADC doesn’t need a reference buffer on or off chip. An active integrator is implemented and used to contribute an ideal first order noise shaping effect and can be extended to second order noise shaping by adding a few extra capacitors with only one integrator. The ADC was fabricated in 180nm CMOS technology. The prototype occupies 0.25mm2. For a 2kHz signal bandwidth, it achieved 78.9dB SNDR and 87.6dB SFDR with a 32 oversampling ratio (OSR). It consumes 74.2 uW power from 1.5V power supply. Next, a noise shaping SAR ADC with on-chip digital DAC calibration was proposed and implemented. Correlated double sampling (CDS) and correlated level shifting (CLS) are combined to implement the proposed architecture. With these two techniques, the design specifications for the op-amp used in integrator are relaxed. CDS minimized the effect of DC offset and flicker noise from the op-amp, and CLS boosted the effective DC gain of the op-amp. Therefore, the total power consumption of the op-amp can be decreased by about 50% compared with the same NS SAR ADC performance. Also, an incremental ADC (IADC) based on-chip DAC calibration scheme was proposed and implemented. The proposed calibration scheme will share all blocks in the proposed NS SAR ADC, so it will not increase the complexity of the circuitry. The calibration, it gives a more than 13dB improvement on the SNDR. The proposed ADC was fabricated in 130nm CMOS technology. It achieved 85.1 dB DR, 82.6dB SNDR and 90.9dB SFDR with 32 OSR. It consumes 40uW power from 1.6V power supply which gives a 163dB Schreier Figure of Merit

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process