159 research outputs found
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Novel printing technologies for nanophotonic and nanoelectronic devices
textAs optical interconnects make their paces to replace traditional electrical interconnects, implementing low cost optical components and hybrid optic-electronic systems are of great interest. In the research work described in this dissertation, we are making our efforts to develop several practical optical components using novel printing technologies including imprinting, ink-jet printing and a combination of both. Imprinting process using low cost electroplating mold is investigated and applied to the waveguide molding process, and it greatly reduces the surface roughness and thus the optical propagation loss. The imprinting process can be applied to photonic components from multi-mode waveguides with 50[mu]m critical dimension down to photonic crystal structures with 500nm hole diameter. Compared to traditional lithography process, imprinting process is featured by its great repeatability and high yield to define patterns on existing layers. Furthermore we still need an approach to deposit layers and that is the reason we integrate the ink-jet printing technology, another low-cost, low material consumption, environmental friendly process. Ink-jet printing process is capable of depositing a wide range of materials, including conductive layer, dielectric layer or other functional layers with defined patterns. Together with molding technology, we demonstrate three applications: proximity coupler, thermo-optic (TO) switch and electro-optic (EO) polymer modulator. The proximity coupler uses imprinted 50[mu]m waveguide with embedded mirrors and ink-jet printed micro-lenses to improve the board-to-board optical interconnects quality. The TO switch and EO modulator both utilize imprinting technology to define a core pattern in the cladding layer. Ink-jet printing is used to deposit the core layer for TO switch and the electrode layers for EO modulator. The fabricated TO switch operates at 1 kHz with less than 0.5ms switching time and the EO modulator shows V[pi][middle dot]L=5.68V[middle dot]cm. To the best of our knowledge, these are the first demonstrations of functional optical switches and modulators using printing method. To further enable the high rate fabrication of ink-jet printed photonic and electronic devices with multiple layers on flexible substrate, we develop a roll-to-roll ink-jet printing system, from hardware integration to software implementation. Machine vision aided real time automatic registration is achieved when printing multiple layers.Electrical and Computer Engineerin
Focused ion beam technology : implementation in manufacturing platforms and process optimisation
Process chains are regarded as viable manufacturing platforms for the production of Microand Nano Technology (MNT) enabled products. In particular, by combining several manufacturing technologies, each utilised in its optimal process window, they could benefit from the unique advantages of high-profile research technologies such as the focused ion beam (FIB) machining. The present work concerns the development of process chains and the investigation of pilot cost-effective implementations of the FIB technology in manufacturing platforms forfabrication of serial replication masters.EThOS - Electronic Theses Online ServiceGBUnited Kingdo
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Materials and processes for advanced lithography applications
textStep and Flash Imprint Lithography (S-FIL) is a high resolution, next-generation lithography technique that uses an ambient temperature and low pressure process to replicate high resolution images in a UV-curable liquid material. Application of the S-FIL process in conjunction with multi-level imprint templates and new imprint materials enables one S-FIL step to reproduce the same structures that require two photolithography steps, thereby greatly reducing the number of patterning steps required for the copper, dual damascene process used to fabricate interconnect wirings in modern integrated circuits. Two approaches were explored for the implementation of S-FIL in the dual damascene process: sacrificial imprint materials and imprintable dielectric materials. Sacrificial imprint materials function as a pattern recording medium during S-FIL and a three-dimensional etch mask during the dielectric substrate etch, enabling the simultaneous patterning of both the via and metal structures in the dielectric substrate. Development of sacrificial imprint materials and the associated imprint and etch processes are described. Application of S-FIL and the sacrificial imprint material in a commercial copper dual damascene process successfully produced functional copper interconnect structures, demonstrating the feasibility of integrating multi-level S-FIL in the copper dual damascene process. Imprintable dielectric materials are designed to combine the multi-level patterning capability of S-FIL with novel dielectric precursor materials, enabling the simultaneous deposition and patterning of the interlayer dielectric material. Several candidate imprintable dielectric materials were evaluated: sol-gel, polyhedral oligomeric silsesquioxane (POSS) epoxide, POSS acrylate, POSS azide, and POSS thiol. POSS thiol shows the most promise as functional imprintable dielectric material, although additional work in the POSS thiol formulation and viscous dispense process are needed to produce functional interconnect structures. Integration of S-FIL with imprintable dielectric materials would enable further streamlining of the dual damascene fabrication process. The fabrication of electronic devices on flexible substrates represents an opportunity for the development of macroelectronics such as flexible displays and large area devices. Traditional optical lithography encounters alignment and overlay limitations when applied on flexible substrates. A thermally activated, dual-tone photoresist system and its associated etch process were developed to enable the simultaneous patterning of two device layers on a flexible substrate.Chemical Engineerin
Nano-electro-mechanical systems fabricated by tip-based nanofabrication
This dissertation explores the use of a heated AFM tip for fabrication of NEMS devices. Two critical challenges hindering TBN from NEMS fabrication are addressed in this thesis. First, we experimentally found out that polystyrene nanopatterns deposited by a heated AFM tip can serve directly as etch mask and transfer the nanopatterns to solid-state materials such as silicon and silicon oxide through one step of etching, solving the first challenge for NEMS device fabrication using TBN; second, we developed a process that makes this TBN method seamlessly compatible with conventional nanofabrication processes. Polystyrene nanopatterns deposited can serve together with optical lithography patterned mask and transfer both micropatterns defined by optical lithography and nanopatterns defined by the heated AFM tip to silicon.
After solving the two critical challenges, we demonstrated various types of silicon NEMS mechanical resonators such as single-clamped, double-clamped, wavy-shaped, spider-like and spiral-shaped using this TBN method with a heated AFM tip. Laser interferometer measurement on two NEMS resonators showed resonance frequencies of 1.2MHz and 2.2 MHz, close to the simulated resonance frequencies.
Moreover, we demonstrated PDMS nanofluidic channels with arbitrary shapes using this TBN method with a heated AFM tip. Both ion conductance measurement and fluorescence measurement confirmed the functionality of the TBN-fabrication nanofluidic channels.
Finally, we demonstrated a MESFET transistor using this TBN method with a heated AFM tip. MESFET devices with one, two, four and eight fins were fabricated, demonstrating the capability of this TBN method. I-V measurements proved the functionality of the transistor.
This thesis work demonstrated that TBN with a heated AFM tip held great potential in nanodevice fabrication due to its simplicity, robustness, flexibility and compatibility with existing device nanofabrication process. For example, the whole TBN process takes place in ambient conditions and is very simple. And this TBN method is additive so that the heated AFM tip only deposits polymer where needed, thus only resulting in minimal contamination.
Future work should improve the throughput and scalability to make this TBN method commercially available for NEMS fabrication
Focused ion beam technology: implementation in manufacturing platforms and process optimisation
Process chains are regarded as viable manufacturing platforms for the production of Microand Nano Technology (MNT) enabled products. In particular, by combining several manufacturing technologies, each utilised in its optimal process window, they could benefit from the unique advantages of high-profile research technologies such as the focused ion beam (FIB) machining.
The present work concerns the development of process chains and the investigation of pilot cost-effective implementations of the FIB technology in manufacturing platforms forfabrication of serial replication masters
TOPICAL REVIEW: Recent progress in nanoimprint technology and its applications
Nanoimprint is an emerging lithographic technology that promises high-throughput patterning of nanostructures. Based on the mechanical embossing principle, nanoimprint technique can achieve pattern resolutions beyond the limitations set by the light diffractions or beam scatterings in other conventional techniques. This article reviews the basic principles of nanoimprint technology and some of the recent progress in this field. It also explores a few alternative approaches that are related to nanoimprint as well as additive approaches for patterning polymer structures. Nanoimprint technology can not only create resist patterns as in lithography but can also imprint functional device structures in polymers. This property is exploited in several non-traditional microelectronic applications in the areas of photonics and biotechnology.Peer Reviewedhttp://deepblue.lib.umich.edu/bitstream/2027.42/48920/2/d4_11_r01.pd
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Mechanical Design and Analysis: High-Precision Microcontact Printhead for Roll-to-Roll Printing of Flexible Electronics
Flexible electronics have demonstrated potential in a wide range of applications including wearable sensors, photovoltaics, medical devices and more, due to their properties of extreme adaptability while also being lightweight and highly robust. The main challenge standing in the way of progress in this field is the difficulty of large-scale manufacturing of these flexible electronics compared to their rigid counterparts. Microcontact printing is a form of soft lithography in which an elastomeric stamp is used to transfer sub-micron scale surface patterns onto a flexible substrate via ink monolayers. The integration of microcontact printing into a roll-to-roll (R2R) system will enable continuous printing of flexible electronics and scale it up for massive manufacturing. The proposed thesis outlines a novel mechanical design for a microcontact printer which utilizes flexural motion stages with integrated position and force sensors to control the print process on a R2R system. The printhead is designed to fit the available space on the pre-installed UMass Amherst Intelligent Sensing Laboratory test table and breadboard. The R2R system includes motorized rollers for winding/unwinding the PET (polyethylene terephthalate) web substrate, and idler rollers for guiding a web through the print system. As the central element to this design, two matching plate flexures are designed on the two ends of the printer roller to control the tilting and positioning of the print roller. Flexure mechanisms rely on bending and torsion of flexible elements: this allows them to achieve much higher precision in positioning compared to conventional mechanisms which rely on surface interaction between multiple moving parts. The print resolution target for this design is 500 nm (linewidth), based on current state-of-the-art designs [1, 2]. In the initial version of the printhead design, a total of 33 parts are custom fabricated for assembly and installation in the R2R system lab setup. These include everything from the components of the print roller, specially adapted air-bearing mounts, support structures, and connectors. The design and 4 fabrication process for every component is outlined here along with the functionality, as every component was designed with the system objectives and constraints in mind. Using SolidWorks simulation, FEA (finite element analysis) is performed for every part of the assembly that is subjected to stress in the real system, so that predictions can be made about the displacement of the motion stages and the frequency of vibration. These predictions are evaluated by comparation with the experimental results from tests conducted on the real system hardware and used to assess the quality of the fabricated assembly. The work performed in this thesis enables advancements in the assembly of an updated, optimized R2R system and has led to an experimentally functioning lab setup that is ripe for further improvements. Completion and calibration of this augmented R2R system will, in future, enable UMass Amherst in-house production of large-area flexible electronics which may be used in a wide range of applications, including medical sensors, solar cells, displays, and more. In addition to microcontact printing, this R2R system may also be applied to nanoimprint lithography, another contact-based print method, or integrated with inkjet printing, a non-contact method
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