Reliable Low-Power High Performance Spintronic Memories

Moores Gesetz folgend, ist es der Chipindustrie in den letzten fünf Jahrzehnten gelungen, ein explosionsartiges Wachstum zu erreichen. Dies hatte ebenso einen exponentiellen Anstieg der Nachfrage von Speicherkomponenten zur Folge, was wiederum zu speicherlastigen Chips in den heutigen Computersystemen führt. Allerdings stellen traditionelle on-Chip Speichertech- nologien wie Static Random Access Memories (SRAMs), Dynamic Random Access Memories (DRAMs) und Flip-Flops eine Herausforderung in Bezug auf Skalierbarkeit, Verlustleistung und Zuverlässigkeit dar. Eben jene Herausforderungen und die überwältigende Nachfrage nach höherer Performanz und Integrationsdichte des on-Chip Speichers motivieren Forscher, nach neuen nichtflüchtigen Speichertechnologien zu suchen. Aufkommende spintronische Spe- ichertechnologien wie Spin Orbit Torque (SOT) und Spin Transfer Torque (STT) erhielten in den letzten Jahren eine hohe Aufmerksamkeit, da sie eine Reihe an Vorteilen bieten. Dazu gehören Nichtflüchtigkeit, Skalierbarkeit, hohe Beständigkeit, CMOS Kompatibilität und Unan- fälligkeit gegenüber Soft-Errors. In der Spintronik repräsentiert der Spin eines Elektrons dessen Information. Das Datum wird durch die Höhe des Widerstandes gespeichert, welche sich durch das Anlegen eines polarisierten Stroms an das Speichermedium verändern lässt. Das Prob- lem der statischen Leistung gehen die Speichergeräte sowohl durch deren verlustleistungsfreie Eigenschaft, als auch durch ihr Standard- Aus/Sofort-Ein Verhalten an. Nichtsdestotrotz sind noch andere Probleme, wie die hohe Zugriffslatenz und die Energieaufnahme zu lösen, bevor sie eine verbreitete Anwendung finden können. Um diesen Problemen gerecht zu werden, sind neue Computerparadigmen, -architekturen und -entwurfsphilosophien notwendig. Die hohe Zugriffslatenz der Spintroniktechnologie ist auf eine vergleichsweise lange Schalt- dauer zurückzuführen, welche die von konventionellem SRAM übersteigt. Des Weiteren ist auf Grund des stochastischen Schaltvorgangs der Speicherzelle und des Einflusses der Prozessvari- ation ein nicht zu vernachlässigender Zeitraum dafür erforderlich. In diesem Zeitraum wird ein konstanter Schreibstrom durch die Bitzelle geleitet, um den Schaltvorgang zu gewährleisten. Dieser Vorgang verursacht eine hohe Energieaufnahme. Für die Leseoperation wird gleicher- maßen ein beachtliches Zeitfenster benötigt, ebenfalls bedingt durch den Einfluss der Prozess- variation. Dem gegenüber stehen diverse Zuverlässigkeitsprobleme. Dazu gehören unter An- derem die Leseintereferenz und andere Degenerationspobleme, wie das des Time Dependent Di- electric Breakdowns (TDDB). Diese Zuverlässigkeitsprobleme sind wiederum auf die benötigten längeren Schaltzeiten zurückzuführen, welche in der Folge auch einen über längere Zeit an- liegenden Lese- bzw. Schreibstrom implizieren. Es ist daher notwendig, sowohl die Energie, als auch die Latenz zur Steigerung der Zuverlässigkeit zu reduzieren, um daraus einen potenziellen Kandidaten für ein on-Chip Speichersystem zu machen. In dieser Dissertation werden wir Entwurfsstrategien vorstellen, welche das Ziel verfolgen, die Herausforderungen des Cache-, Register- und Flip-Flop-Entwurfs anzugehen. Dies erre- ichen wir unter Zuhilfenahme eines Cross-Layer Ansatzes. Für Caches entwickelten wir ver- schiedene Ansätze auf Schaltkreisebene, welche sowohl auf der Speicherarchitekturebene, als auch auf der Systemebene in Bezug auf Energieaufnahme, Performanzsteigerung und Zuver- lässigkeitverbesserung evaluiert werden. Wir entwickeln eine Selbstabschalttechnik, sowohl für die Lese-, als auch die Schreiboperation von Caches. Diese ist in der Lage, den Abschluss der entsprechenden Operation dynamisch zu ermitteln. Nachdem der Abschluss erkannt wurde, wird die Lese- bzw. Schreiboperation sofort gestoppt, um Energie zu sparen. Zusätzlich limitiert die Selbstabschalttechnik die Dauer des Stromflusses durch die Speicherzelle, was wiederum das Auftreten von TDDB und Leseinterferenz bei Schreib- bzw. Leseoperationen re- duziert. Zur Verbesserung der Schreiblatenz heben wir den Schreibstrom an der Bitzelle an, um den magnetischen Schaltprozess zu beschleunigen. Um registerbankspezifische Anforderungen zu berücksichtigen, haben wir zusätzlich eine Multiport-Speicherarchitektur entworfen, welche eine einzigartige Eigenschaft der SOT-Zelle ausnutzt, um simultan Lese- und Schreiboperatio- nen auszuführen. Es ist daher möglich Lese/Schreib- Konfilkte auf Bitzellen-Ebene zu lösen, was sich wiederum in einer sehr viel einfacheren Multiport- Registerbankarchitektur nieder- schlägt. Zusätzlich zu den Speicheransätzen haben wir ebenfalls zwei Flip-Flop-Architekturen vorgestellt. Die erste ist eine nichtflüchtige non-Shadow Flip-Flop-Architektur, welche die Speicherzelle als aktive Komponente nutzt. Dies ermöglicht das sofortige An- und Ausschalten der Versorgungss- pannung und ist daher besonders gut für aggressives Powergating geeignet. Alles in Allem zeigt der vorgestellte Flip-Flop-Entwurf eine ähnliche Timing-Charakteristik wie die konventioneller CMOS Flip-Flops auf. Jedoch erlaubt er zur selben Zeit eine signifikante Reduktion der statis- chen Leistungsaufnahme im Vergleich zu nichtflüchtigen Shadow- Flip-Flops. Die zweite ist eine fehlertolerante Flip-Flop-Architektur, welche sich unanfällig gegenüber diversen Defekten und Fehlern verhält. Die Leistungsfähigkeit aller vorgestellten Techniken wird durch ausführliche Simulationen auf Schaltkreisebene verdeutlicht, welche weiter durch detaillierte Evaluationen auf Systemebene untermauert werden. Im Allgemeinen konnten wir verschiedene Techniken en- twickeln, die erhebliche Verbesserungen in Bezug auf Performanz, Energie und Zuverlässigkeit von spintronischen on-Chip Speichern, wie Caches, Register und Flip-Flops erreichen

Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

Energy and Area Efficient Machine Learning Architectures using Spin-Based Neurons

Recently, spintronic devices with low energy barrier nanomagnets such as spin orbit torque-Magnetic Tunnel Junctions (SOT-MTJs) and embedded magnetoresistive random access memory (MRAM) devices are being leveraged as a natural building block to provide probabilistic sigmoidal activation functions for RBMs. In this dissertation research, we use the Probabilistic Inference Network Simulator (PIN-Sim) to realize a circuit-level implementation of deep belief networks (DBNs) using memristive crossbars as weighted connections and embedded MRAM-based neurons as activation functions. Herein, a probabilistic interpolation recoder (PIR) circuit is developed for DBNs with probabilistic spin logic (p-bit)-based neurons to interpolate the probabilistic output of the neurons in the last hidden layer which are representing different output classes. Moreover, the impact of reducing the Magnetic Tunnel Junction\u27s (MTJ\u27s) energy barrier is assessed and optimized for the resulting stochasticity present in the learning system. In p-bit based DBNs, different defects such as variation of the nanomagnet thickness can undermine functionality by decreasing the fluctuation speed of the p-bit realized using a nanomagnet. A method is developed and refined to control the fluctuation frequency of the output of a p-bit device by employing a feedback mechanism. The feedback can alleviate this process variation sensitivity of p-bit based DBNs. This compact and low complexity method which is presented by introducing the self-compensating circuit can alleviate the influences of process variation in fabrication and practical implementation. Furthermore, this research presents an innovative image recognition technique for MNIST dataset on the basis of p-bit-based DBNs and TSK rule-based fuzzy systems. The proposed DBN-fuzzy system is introduced to benefit from low energy and area consumption of p-bit-based DBNs and high accuracy of TSK rule-based fuzzy systems. This system initially recognizes the top results through the p-bit-based DBN and then, the fuzzy system is employed to attain the top-1 recognition results from the obtained top outputs. Simulation results exhibit that a DBN-Fuzzy neural network not only has lower energy and area consumption than bigger DBN topologies while also achieving higher accuracy

Heterogeneous Reconfigurable Fabrics for In-circuit Training and Evaluation of Neuromorphic Architectures

A heterogeneous device technology reconfigurable logic fabric is proposed which leverages the cooperating advantages of distinct magnetic random access memory (MRAM)-based look-up tables (LUTs) to realize sequential logic circuits, along with conventional SRAM-based LUTs to realize combinational logic paths. The resulting Hybrid Spin/Charge FPGA (HSC-FPGA) using magnetic tunnel junction (MTJ) devices within this topology demonstrates commensurate reductions in area and power consumption over fabrics having LUTs constructed with either individual technology alone. Herein, a hierarchical top-down design approach is used to develop the HSCFPGA starting from the configurable logic block (CLB) and slice structures down to LUT circuits and the corresponding device fabrication paradigms. This facilitates a novel architectural approach to reduce leakage energy, minimize communication occurrence and energy cost by eliminating unnecessary data transfer, and support auto-tuning for resilience. Furthermore, HSC-FPGA enables new advantages of technology co-design which trades off alternative mappings between emerging devices and transistors at runtime by allowing dynamic remapping to adaptively leverage the intrinsic computing features of each device technology. HSC-FPGA offers a platform for fine-grained Logic-In-Memory architectures and runtime adaptive hardware. An orthogonal dimension of fabric heterogeneity is also non-determinism enabled by either low-voltage CMOS or probabilistic emerging devices. It can be realized using probabilistic devices within a reconfigurable network to blend deterministic and probabilistic computational models. Herein, consider the probabilistic spin logic p-bit device as a fabric element comprising a crossbar-structured weighted array. The Programmability of the resistive network interconnecting p-bit devices can be achieved by modifying the resistive states of the array\u27s weighted connections. Thus, the programmable weighted array forms a CLB-scale macro co-processing element with bitstream programmability. This allows field programmability for a wide range of classification problems and recognition tasks to allow fluid mappings of probabilistic and deterministic computing approaches. In particular, a Deep Belief Network (DBN) is implemented in the field using recurrent layers of co-processing elements to form an n x m1 x m2 x ::: x mi weighted array as a configurable hardware circuit with an n-input layer followed by i ≥ 1 hidden layers. As neuromorphic architectures using post-CMOS devices increase in capability and network size, the utility and benefits of reconfigurable fabrics of neuromorphic modules can be anticipated to continue to accelerate

Normally-Off Computing Design Methodology Using Spintronics: From Devices to Architectures

Energy-harvesting-powered computing offers intriguing and vast opportunities to dramatically transform the landscape of Internet of Things (IoT) devices and wireless sensor networks by utilizing ambient sources of light, thermal, kinetic, and electromagnetic energy to achieve battery-free computing. In order to operate within the restricted energy capacity and intermittency profile of battery-free operation, it is proposed to innovate Elastic Intermittent Computation (EIC) as a new duty-cycle-variable computing approach leveraging the non-volatility inherent in post-CMOS switching devices. The foundations of EIC will be advanced from the ground up by extending Spin Hall Effect Magnetic Tunnel Junction (SHE-MTJ) device models to realize SHE-MTJ-based Majority Gate (MG) and Polymorphic Gate (PG) logic approaches and libraries, that leverage intrinsic-non-volatility to realize middleware-coherent, intermittent computation without checkpointing, micro-tasking, or software bloat and energy overheads vital to IoT. Device-level EIC research concentrates on encapsulating SHE-MTJ behavior with a compact model to leverage the non-volatility of the device for intrinsic provision of intermittent computation and lifetime energy reduction. Based on this model, the circuit-level EIC contributions will entail the design, simulation, and analysis of PG-based spintronic logic which is adaptable at the gate-level to support variable duty cycle execution that is robust to brief and extended supply outages or unscheduled dropouts, and development of spin-based research synthesis and optimization routines compatible with existing commercial toolchains. These tools will be employed to design a hybrid post-CMOS processing unit utilizing pipelining and power-gating through state-holding properties within the datapath itself, thus eliminating checkpointing and data transfer operations

Modélisation compacte et conception de circuit à base de jonction tunnel ferroélectrique et de jonction tunnel magnétique exploitant le transfert de spin assisté par effet Hall de spin

Non-volatile memory (NVM) devices have been attracting intensive research interest since they promise to solve the increasing static power issue caused by CMOS technology scaling. This thesis focuses on two fields related to NVM: the one is the ferroelectric tunnel junction (FTJ), which is a recent emerging NVM device. The other is the spin-Hall-assisted spin-transfer torque (STT), which is a recent proposed write approach for the magnetic tunnel junction (MTJ). Our objective is to develop the compact models for these two technologies and to explore their application in the non-volatile circuits through simulation.First, we investigated physical models describing the electrical behaviors of the FTJ such as tunneling resistance, dynamic ferroelectric switching and memristive response. The accuracy of these physical models is validated by a good agreement with experimental results. In order to develop an electrical model available for the circuit simulation, we programmed the aforementioned physical models with Verilog-A language and integrated them together. The developed electrical model can run on Cadence platform (a standard circuit simulation tool) and faithfully reproduce the behaviors of the FTJ.Then, using the developed FTJ model and STMicroelectronics CMOS design kit, we designed and simulated three types of circuits: i) FTJ-based random access memory (FTRAM), ii) two FTJ-based neuromorphic systems, one of which emulates spike-timing dependent plasticity (STDP) learning rule, the other implements supervised learning of logic functions, iii) FTJ-based Boolean logic block, by which NAND and NOR logic are demonstrated. The influences of the FTJ parameters on the performance of these circuits were analyzed based on simulation results.Finally, we focused on the reversal of the perpendicular magnetization driven by spin-Hall-assisted STT in a three-terminal MTJ. In this scheme, two write currents are applied to generate spin-Hall effect (SHE) and STT. Numerical simulation based on Landau-Lifshitz-Gilbert (LLG) equation demonstrates that the incubation delay of the STT can be eliminated by the strong SHE, resulting in ultrafast magnetization switching without the need to strengthen the STT. We applied this novel write approach to the design of the magnetic flip-flop and full-adder. Performance comparison between the spin-Hall-assisted and the conventional STT magnetic circuits were discussed based on simulation results and theoretical models.Les mémoires non-volatiles (MNV) sont l'objet d'un effort de recherche croissant du fait de leur capacité à limiter la consommation statique, qui obère habituellement la réduction des dimensions dans la technologie CMOS. Dans ce contexte, cette thèse aborde plus spécifiquement deux technologies de mémoires non volatiles : d'une part les jonctions tunnel ferroélectriques (JTF), dispositif non volatil émergent, et d'autre part les dispositifs à transfert de spin (TS) assisté par effet Hall de spin (EHS), approche alternative proposée récemment pour écrire les jonctions tunnel magnétiques (JTM). Mon objectif est de développer des modèles compacts pour ces deux technologies et d'explorer, par simulation, leur intégration dans les circuits non-volatiles.J'ai d'abord étudié les modèles physiques qui décrivent les comportements électriques des JTF : la résistance tunnel, la dynamique de la commutation ferroélectrique et leur comportement memristif. La précision de ces modèles physiques est validée par leur bonne adéquation avec les résultats expérimentaux. Afin de proposer un modèle compatible avec les simulateurs électriques standards, nous j'ai développé les modèles physiques mentionnés ci-dessus en langue Verilog-A, puis je les ai intégrés ensemble. Le modèle électrique que j'ai conçu peut être exploité sur la plate-forme Cadence (un outil standard pour la simulation de circuit). Il reproduit fidèlement les comportements de JTF. Ensuite, en utilisant ce modèle de JTF et le design-kit CMOS de STMicroelectronics, j'ai conçu et simulé trois types de circuits: i) une mémoire vive (RAM) basée sur les JTF, ii) deux systèmes neuromorphiques basés sur les JTF, l'un qui émule la règle d'apprentissage de la plasticité synaptique basée sur le décalage temporel des impulsions neuronale (STDP), l'autre mettant en œuvre l'apprentissage supervisé de fonctions logiques, iii) un bloc logique booléen basé sur les JTF, y compris la démonstration des fonctions logiques NAND et NOR. L'influence des paramètres de la JTF sur les performances de ces circuits a été analysée par simulation. Finalement, nous avons modélisé la dynamique de renversement de l'aimantation dans les dispositifs à anisotropie perpendiculaire à transfert de spin assisté par effet Hall de spin dans un JTM à trois terminaux. Dans ce schéma, deux courants d'écriture sont appliqués pour générer l'EHS et le TS. La simulation numérique basée sur l'équation de Landau-Lifshitz-Gilbert (LLG) démontre que le délai d'incubation de TS peut être éliminé par un fort EHS, conduisant à la commutation ultra-rapide de l'aimantation, sans pour autant requérir une augmentation excessive du TS. Nous avons appliqué cette nouvelle méthode d'écriture à la conception d'une bascule magnétique et d'un additionneur 1 bit magnétique. Les performances des circuits magnétiques assistés par l'EHS ont été comparés à ceux écrits par transfert de spin, par simulation et par une analyse fondée sur le modèle théorique

EMERGING COMPUTING BASED NOVEL SOLUTIONS FOR DESIGN OF LOW POWER CIRCUITS

The growing applications for IoT devices have caused an increase in the study of low power consuming circuit design to meet the requirement of devices to operate for various months without external power supply. Scaling down the conventional CMOS causes various complications to design due to CMOS properties, therefore various non-conventional CMOS design techniques are being proposed that overcome the limitations. This thesis focuses on some of those emerging and novel low power design technique namely Adiabatic logic and low power devices like Magnetic Tunnel Junction (MTJ) and Carbon Nanotube Field Effect transistor (CNFET). Circuits that are used for large computations (multipliers, encryption engines) that amount to maximum part of power consumption in a whole chip are designed using these novel low power techniques

Reconfigurable three-terminal logic devices using phase-change materials

Conventional solid-state and mass storage memories (such as SRAM, DRAM and the hard disk drive HDD) are facing many technological challenges to meet the ever-increasing demand for fast, low power and cheap data storage solutions. This is compounded by the current conventional computer architectures (such as the von Neumann architecture) with separate processing and storage functionalities and hence data transfer bottlenecks and increased silicon footprint. Beyond the von Neumann computer architecture, the combination of arithmetic-logic processing and (collocally) storage circuits provide a new and promising alternative for computer systems that overcome the many limitations of current technology. However, there are many technical challenges that face the implementation of universal blocks of both logic and memory functions using conventional silicon technology (transistor-transistor logic - TTL, and complementary metal oxide semiconductors - CMOS). Phase-change materials, such as Ge2Sb2Te5 (GST), provide a potential complement or replacement to these technologies to provide both processing and, collocally, storage capability. Existing research in phase-change memory technologies focused on two-terminal non-volatile devices for different memory and logic applications due to their ability to achieve logic-resistive switching in nanosecond time scale, their scalability down to few nanometer-scale cells, and low power requirements. To perform logic functionality, current two-terminal phase-change logic devices need to be connected in series or parallel circuits, and require sequential inputs to perform the required logic function (such as NAND and NOR). In this research programme, three-terminal (3T) non-volatile phase-change memories are proposed and investigated as potential alternative logic cells with simultaneous inputs as reconfigurable, non-volatile logic devices. A vertical 3T logic device structure is proposed in this work based on existing phase-change based memory cell architecture and original concept work by Ovshinsky. A comprehensive, multi-physics finite-element model of the vertical 3T device was constructed in Comsol Multiphysics. This model solves Laplace's equation for the electric potential due to the application of voltage sources. The calculated electric potential and fields provide the Joule heating source in the device, which is used to compute the temperature distribution through solution of the heat diffusion equation, which is necessary to activate the thermally-driven phase transition process. The physically realistic and computationally efficient nucleation- growth model was numerically implemented to model the phase change and resistance change in the Ge2Sb2Te5 (GST) phase-change material in the device, which is combined with the finite- element model using the Matlab programming interface. The changes in electrical and thermal conductivities in the GST region are taken into account following the thermally activated phase transformations between the amorphous-crystalline states using effective medium theory. To determine the appropriate voltage and temperature conditions for the SET and RESET operations, and to optimise the materials and thicknesses of the thermal and heating layers in the device, comprehensive steady-state parametric simulations were carried out using the finite-element multi-physics model. Simulations of transient cycles of writing (SET) and erasing (RESET) processes using appropriate voltage pulses were then carried out on the designed vertical 3T device to study the phase transformations for practical reconfigurable logic operations. The simulations indicated excellent resistance contrast between the logic 1 and 0 states, and successfully demonstrated the feasibility of programming the logic functions of NAND and NOR gates using this 3T configuration