Design of a tunable multi-band differential LC VCO using 0.35 mu m SiGe BiCMOS technology for multi-standard wireless communication systems

In this paper, an integrated 2.2-5.7GHz multi-band differential LC VCO for multi-standard wireless communication systems was designed utilizing 0.35 mu m SiGe BiCMOS technology. The topology, which combines the switching inductors and capacitors together in the same circuit, is a novel approach for wideband VCOs. Based on the post-layout simulation results, the VCO can be tuned using a DC voltage of 0 to 3.3 V for 5 different frequency bands (2.27-2.51 GHz, 2.48-2.78 GHz, 3.22-3.53 GHz, 3.48-3.91 GHz and 4.528-5.7 GHz) with a maximum bandwidth of 1.36 GHz and a minimum bandwidth of 300 MHz. The designed and simulated VCO can generate a differential output power between 0.992 and -6.087 dBm with an average power consumption of 44.21 mW including the buffers. The average second and third harmonics level were obtained as -37.21 and -47.6 dBm, respectively. The phase noise between -110.45 and -122.5 dBc/Hz, that was simulated at 1 MHz offset, can be obtained through the frequency of interest. Additionally, the figure of merit (FOM), that includes all important parameters such as the phase noise, the power consumption and the ratio of the operating frequency to the offset frequency, is between -176.48 and -181.16 and comparable or better than the ones with the other current VCOs. The main advantage of this study in comparison with the other VCOs, is covering 5 frequency bands starting from 2.27 up to 5.76 GHz without FOM and area abandonment. Output power of the fundamental frequency changes between -6.087 and 0.992 dBm, depending on the bias conditions (operating bands). Based on the post-layout simulation results, the core VCO circuit draws a current between 2.4-6.3 mA and between 11.4 and 15.3 mA with the buffer circuit from 3.3 V supply. The circuit occupies an area of 1.477 mm(2) on Si substrate, including DC, digital and RF pads

Convergent communication, sensing and localization in 6g systems: An overview of technologies, opportunities and challenges

Herein, we focus on convergent 6G communication, localization and sensing systems by identifying key technology enablers, discussing their underlying challenges, implementation issues, and recommending potential solutions. Moreover, we discuss exciting new opportunities for integrated localization and sensing applications, which will disrupt traditional design principles and revolutionize the way we live, interact with our environment, and do business. Regarding potential enabling technologies, 6G will continue to develop towards even higher frequency ranges, wider bandwidths, and massive antenna arrays. In turn, this will enable sensing solutions with very fine range, Doppler, and angular resolutions, as well as localization to cm-level degree of accuracy. Besides, new materials, device types, and reconfigurable surfaces will allow network operators to reshape and control the electromagnetic response of the environment. At the same time, machine learning and artificial intelligence will leverage the unprecedented availability of data and computing resources to tackle the biggest and hardest problems in wireless communication systems. As a result, 6G will be truly intelligent wireless systems that will provide not only ubiquitous communication but also empower high accuracy localization and high-resolution sensing services. They will become the catalyst for this revolution by bringing about a unique new set of features and service capabilities, where localization and sensing will coexist with communication, continuously sharing the available resources in time, frequency, and space. This work concludes by highlighting foundational research challenges, as well as implications and opportunities related to privacy, security, and trust

Convergent Communication, Sensing and Localization in 6G Systems: An Overview of Technologies, Opportunities and Challenges

Herein, we focus on convergent 6G communication, localization and sensing systems by identifying key technology enablers, discussing their underlying challenges, implementation issues, and recommending potential solutions. Moreover, we discuss exciting new opportunities for integrated localization and sensing applications, which will disrupt traditional design principles and revolutionize the way we live, interact with our environment, and do business. Regarding potential enabling technologies, 6G will continue to develop towards even higher frequency ranges, wider bandwidths, and massive antenna arrays. In turn, this will enable sensing solutions with very fine range, Doppler, and angular resolutions, as well as localization to cm-level degree of accuracy. Besides, new materials, device types, and reconfigurable surfaces will allow network operators to reshape and control the electromagnetic response of the environment. At the same time, machine learning and artificial intelligence will leverage the unprecedented availability of data and computing resources to tackle the biggest and hardest problems in wireless communication systems. As a result, 6G will be truly intelligent wireless systems that will provide not only ubiquitous communication but also empower high accuracy localization and high-resolution sensing services. They will become the catalyst for this revolution by bringing about a unique new set of features and service capabilities, where localization and sensing will coexist with communication, continuously sharing the available resources in time, frequency, and space. This work concludes by highlighting foundational research challenges, as well as implications and opportunities related to privacy, security, and trust

Terahertz Communications and Sensing for 6G and Beyond: A Comprehensive View

The next-generation wireless technologies, commonly referred to as the sixth generation (6G), are envisioned to support extreme communications capacity and in particular disruption in the network sensing capabilities. The terahertz (THz) band is one potential enabler for those due to the enormous unused frequency bands and the high spatial resolution enabled by both short wavelengths and bandwidths. Different from earlier surveys, this paper presents a comprehensive treatment and technology survey on THz communications and sensing in terms of the advantages, applications, propagation characterization, channel modeling, measurement campaigns, antennas, transceiver devices, beamforming, networking, the integration of communications and sensing, and experimental testbeds. Starting from the motivation and use cases, we survey the development and historical perspective of THz communications and sensing with the anticipated 6G requirements. We explore the radio propagation, channel modeling, and measurements for THz band. The transceiver requirements, architectures, technological challenges, and approaches together with means to compensate for the high propagation losses by appropriate antenna and beamforming solutions. We survey also several system technologies required by or beneficial for THz systems. The synergistic design of sensing and communications is explored with depth. Practical trials, demonstrations, and experiments are also summarized. The paper gives a holistic view of the current state of the art and highlights the issues and challenges that are open for further research towards 6G.Comment: 55 pages, 10 figures, 8 tables, submitted to IEEE Communications Surveys & Tutorial

Next Generation Silicon Photonic Transceiver: From Device Innovation to System Analysis

Silicon photonics is recognized as a disruptive technology that has the potential to reshape many application areas, for example, data center communication, telecommunications, high-performance computing, and sensing. The key capability that silicon photonics offers is to leverage CMOS-style design, fabrication, and test infrastructure to build compact, energy-efficient, and high-performance integrated photonic systems-on- chip at low cost. As the need to squeeze more data into a given bandwidth and a given footprint increases, silicon photonics becomes more and more promising. This work develops and demonstrates novel devices, methodologies, and architectures to resolve the challenges facing the next-generation silicon photonic transceivers. The first part of this thesis focuses on the topology optimization of passive silicon photonic devices. Specifically, a novel device optimization methodology - particle swarm optimization in conjunction with 3D finite-difference time-domain (FDTD), has been proposed and proven to be an effective way to design a wide range of passive silicon photonic devices. We demonstrate a polarization rotator and a 90◦ optical hybrid for polarization-diversity and phase-diversity communications - two important schemes to increase the communication capacity by increasing the spectral efficiency. The second part of this thesis focuses on the design and characterization of the next- generation silicon photonic transceivers. We demonstrate a polarization-insensitive WDM receiver with an aggregate data rate of 160 Gb/s. This receiver adopts a novel architecture which effectively reduces the polarization-dependent loss. In addition, we demonstrate a III-V/silicon hybrid external cavity laser with a tuning range larger than 60 nm in the C-band on a silicon-on-insulator platform. A III-V semiconductor gain chip is hybridized into the silicon chip by edge-coupling to the silicon chip. The demonstrated packaging method requires only passive alignment and is thus suitable for high-volume production. We also demonstrate all silicon-photonics-based transmission of 34 Gbaud (272 Gb/s) dual-polarization 16-QAM using our integrated laser and silicon photonic coherent transceiver. The results show no additional penalty compared to commercially available narrow linewidth tunable lasers. The last part of this thesis focuses on the chip-scale optical interconnect and presents two different types of reconfigurable memory interconnects for multi-core many-memory computing systems. These reconfigurable interconnects can effectively alleviate the memory access issues, such as non-uniform memory access, and Network-on-Chip (NoC) hot-spots that plague the many-memory computing systems by dynamically directing the available memory bandwidth to the required memory interface

Graphene-based Wireless Agile Interconnects for Massive Heterogeneous Multi-chip Processors

The main design principles in computer architecture have recently shifted from a monolithic scaling-driven approach to the development of heterogeneous architectures that tightly co-integrate multiple specialized processor and memory chiplets. In such data-hungry multi-chip architectures, current Networksin- Package (NiPs) may not be enough to cater to their heterogeneous and fast-changing communication demands. This position paper makes the case for wireless in-package networking as the enabler of efficient and versatile wired-wireless interconnect fabrics for massive heterogeneous processors. To that end, the use of graphene-based antennas and transceivers with unique frequency-beam reconfigurability in the terahertz band is proposed. The feasibility of such a wireless vision and the main research challenges towards its realization are analyzed from the technological, communications, and computer architecture perspectives

Graphene-based wireless agile interconnects for massive heterogeneous multi-chip processors

The main design principles in computer architecture have recently shifted from a monolithic scaling-driven approach to the development of heterogeneous architectures that tightly co-integrate multiple specialized processor and memory chiplets. In such data-hungry multi-chip architectures, current Networks-in-Package (NiPs) may not be enough to cater to their heterogeneous and fast-changing communication demands. This position article makes the case for wireless in-package networking as the enabler of efficient and versatile wired-wireless interconnect fabrics for massive heterogeneous processors. To that end, the use of graphene-based antennas and transceivers with unique frequency-beam reconfigurability in the terahertz band is proposed. The feasibility of such a wireless vision and the main research challenges toward its realization are analyzed from the technological, communications, and computer architecture perspectives.This publication is part of the Spanish I+D+i project TRAINER-A (ref. PID2020-118011GB-C21), funded by MCIN/AEI/10.13039/501100011033. This work has been also supported by the European Commission under H2020 grants WiPLASH (GA 863337), 2D-EPL (GA 952792), and Graphene Flagship (GA 881603); the FLAGERA framework under grant TUGRACO (HA 3022/9-1, LE 2440/3-1), the European Research Council under grants WINC (GA 101042080), COMPUSAPIEN (GA 725657), and PROJESTOR (GA 682675), the German Ministry of Education and Research under grant GIMMIK (03XP0210) and the and the German Research Foundation under grant HIPEDI (WA 4139/1-1).Peer ReviewedArticle signat per 21 autors/es: Sergi Abadal, Robert Guirado, Hamidreza Taghvaee, and Akshay Jain are with the Universitat Politècnica de Catalunya, Spain; Elana Pereira de Santana and Peter Haring Bolívar are with the University of Siegen, Germany; Mohamed Saeed, Renato Negra, Kun-Ta Wang, and Max C. Lemme are with RWTH Aachen University, Germany. Zhenxing Wang, Kun-Ta Wang, and Max C. Lemme are also with AMO GmbH, Germany; Joshua Klein, Marina Zapater, Alexandre Levisse, and David Atienza are with the Swiss Federal Institute of Technology, Switzerland. Marina Zapater is also with the University of Applied Sciences and Arts Western Switzerland; Davide Rossi and Francesco Conti are with the University of Bologna,Italy; Martino Dazzi, Geethan Karunaratne, Irem Boybat, and Abu Sebastian are with IBM Research Europe, SwitzerlandPostprint (author's final draft

Multi-Mode Antennas for Ultra-Wide-Angle Scanning Millimeter-Wave Arrays

In this paper, a novel multi-mode millimeter-wave antenna array with enhanced scan range and reduced scan losses is presented. The individual array element consists of a differentially fed microstrip patch on top of which a cylindrical dielectric resonator is integrated. The radiation pattern of the antenna element can be reconfigured by changing the phase offset between the feeding ports of the patch and the dielectric resonator to excite two distinct radiating modes. With such a feature, the field of view can be divided into two different subspaces, with the first one covering the angular range from -75to 0and the second one from 0to +75. In a 1 × 16 linear array configuration, the achieved scan range extends from -75to 75along the horizontal plane with a maximal gain loss of 3 dB, which is better than the ideal cos θ0 behavior. The proposed design operates in the frequency range between 27 GHz and 29.5 GHz and, thanks to its wide-scan capabilities, constitutes an effective solution for upcoming 5G/6G millimeter-wave wireless communications

MEMS-enabled silicon photonic integrated devices and circuits

Photonic integrated circuits have seen a dramatic increase in complexity over the past decades. This development has been spurred by recent applications in datacenter communications and enabled by the availability of standardized mature technology platforms. Mechanical movement of wave-guiding structures at the micro- and nanoscale provides unique opportunities to further enhance functionality and to reduce power consumption in photonic integrated circuits. We here demonstrate integration of MEMS-enabled components in a simplified silicon photonics process based on IMEC's Standard iSiPP50G Silicon Photonics Platform and a custom release process