CMOS MESFET Cascode Amplifiers for RFIC Applications

abstract: There is an ever-increasing demand for higher bandwidth and data rate ensuing from exploding number of radio frequency integrated systems and devices. As stated in the Shannon-Hartley theorem, the maximum achievable data rate of a communication channel is linearly proportional to the system bandwidth. This is the main driving force behind pushing wireless systems towards millimeter-wave frequency range, where larger bandwidth is available at a higher carrier frequency. Observing the Moor’s law, highly scaled complementary metal–oxide–semiconductor (CMOS) technologies provide fast transistors with a high unity power gain frequency which enables operating at millimeter-wave frequency range. CMOS is the compelling choice for digital and signal processing modules which concurrently offers high computation speed, low power consumption, and mass integration at a high manufacturing yield. One of the main shortcomings of the sub-micron CMOS technologies is the low breakdown voltage of the transistors that limits the dynamic range of the radio frequency (RF) power blocks, especially with the power amplifiers. Low voltage swing restricts the achievable output power which translates into low signal to noise ratio and degraded linearity. Extensive research has been done on proposing new design and IC fabrication techniques with the goal of generating higher output power in CMOS technology. The prominent drawbacks of these solutions are an increased die area, higher cost per design, and lower overall efficiency due to lossy passive components. In this dissertation, CMOS compatible metal–semiconductor field-effect transistor (MESFETs) are utilized to put forward a new solution to enhance the power amplifier’s breakdown voltage, gain and maximum output power. Requiring no change to the conventional CMOS process flow, this low cost approach allows direct incorporation of high voltage power MESFETs into silicon. High voltage MESFETs were employed in a cascode structure to push the amplifier’s cutoff frequency and unity power gain frequency to the 5G and K-band frequency range. This dissertation begins with CMOS compatible MESFET modeling and fabrication steps, and culminates in the discussion of amplifier design and optimization methodology, parasitic de-embedding steps, simulation and measurement results, and high resistivity RF substrate characterization.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

A review of technologies and design techniques of millimeter-wave power amplifiers

his article reviews the state-of-the-art millimeter-wave (mm-wave) power amplifiers (PAs), focusing on broadband design techniques. An overview of the main solid-state technologies is provided, including Si, gallium arsenide (GaAs), GaN, and other III-V materials, and both field-effect and bipolar transistors. The most popular broadband design techniques are introduced, before critically comparing through the most relevant design examples found in the scientific literature. Given the wide breadth of applications that are foreseen to exploit the mm-wave spectrum, this contribution will represent a valuable guide for designers who need a single reference before adventuring in the challenging task of the mm-wave PA design

RF to Millimeter-wave Linear Power Amplifiers in Nanoscale CMOS SOI Technology

The low manufacturing cost, integration capability with baseband and digital circuits, and high operating frequency of nanoscale CMOS technologies have propelled their applications into RF and microwave systems. Implementing fully-integrated RF to millimeter-wave (mm-wave) CMOS power amplifiers (PAs), nevertheless, remains challenging due to the low breakdown voltages of CMOS transistors and the loss from on-chip matching networks. These limitations have reduced the design space of CMOS power amplifiers to narrow-band, low linearity metrics often with insufficient gain, output power, and efficiency. A new topology for implementing power amplifiers based on stacking of CMOS SOI transistors is proposed. The input RF power is coupled to the transistors using on-chip transformers, while the gate terminal of teach transistor is dynamically biased from the output node. The output voltages of the stacked transistors are added constructively to increase the total output voltage swing and output power. Moreover, the stack configuration increases the optimum load impedance of the PA to values close to 50 ohm, leading to power, efficiency and bandwidth enhancements. Practical design issues such as limitation in the number of stacked transistors, gate oxide breakdown, stability, effect of parasitic capacitances on the performance of the PA and large chip areas have also been addressed. Fully-integrated RF to mm-wave frequency CMOS SOI PAs are successfully implemented and measured using the proposed topology

Efficient, High power Precision RF and mmWave Digital Transmitter Architectures

Digital transmitters offer several advantages over conventional analog transmitters such as reconfigurability, elimination of scaling-unfriendly, power hungry and bulky analog blocks and portability across technology. The rapid advancement of technology in CMOS processes also enables integration of complex digital signal processing circuitry on the same die as the digital transmitter to compensate for their non-idealities. The use of this digital assistance can, for instance, enable the use of highly efficient but nonlinear switching-class power amplifiers by compensating for their severe nonlinearity through digital predistortion. While this shift to digitally intensive transmitter architectures is propelled by the benefits stated above, several pressing challenges arise that vary in their nature depending on the frequency of operation - from RF to mmWave. Millimeter wave CMOS power amplifiers have traditionally been limited in output power due to the low breakdown voltage of scaled CMOS technologies and poor quality of on-chip passives. Moreover, high data-rates and efficient spectrum utilization demand highly linear power amplifiers with high efficiency under back-off. However, linearity and high efficiency are traditionally at odds with each other in conventional power amplifier design. In this dissertation, digital assistance is used to relax this trade-off and enable the use of state-of-the-art switching class power amplifiers. A novel digital transmitter architecture which simultaneously employs aggressive device-stacking and large-scale power combining for watt-class output power, dynamic load modulation for linearization, and improved efficiency under back-off by supply-switching and load modulation is presented. At RF frequencies, while the problem of watt-class power amplification has been long solved, more pressing challenges arise from the crowded spectrum in this regime. A major drawback of digital transmitters is the absence of a reconstruction filter after digital-to-analog conversion which causes the baseband quantization noise to get upconverted to RF and amplified at the output of the transmitter. In high power transmitters, this upconverted noise can be so strong as to prevent their use in FDD systems due to receiver desensitization or impose stringent coexistence challenges. In this dissertation, new quantization noise suppression techniques are presented which, for the first time, contribute toward making watt-class fully-integrated digital RF transmitters a viable alternative for FDD and coexistence scenarios. Specifically, the techniques involve embedding a mixed-domain multi-tap FIR filter within highly-efficient watt-class switching power amplifiers to suppress quantization noise, enhancing the bandwidth of noise suppression, enabling tunable location of suppression and overcoming the limitations of purely digital-domain filtering techniques for quantization noise

Fully Integrated 60 GHz Power Amplifiers in 45nm SOI CMOS

With the rapid growth of consumer demand for high data rates and high speed communications, the wireless spectrum has become increasingly precious. This has promoted the evolution of new standards and modulation schemes to improve spectral e fficiency. The allocation of large bandwidths is an alternative to increase the channel capacity and data rate, however the availability of spectrum below 10 GHz is very limited. Recently, the 60 GHz spectrum has emerged as a potential candidate to support multi-Gb/s applications. It off ers 7 GHz of unlicensed spectrum, for development of Wireless Personal Area Networks (WPAN) and cellular backhauls. Meanwhile, the scaling and advancement of low-cost complementary metal-oxide semiconductor (CMOS) technologies has enabled the use of CMOS devices at millimeter wave frequencies and the integration of analogue and digital circuitry has created platform for single chip radio development. However, low power density, low optimum load resistance and poor quality integrated passives (due to lossy silicon substrate) make CMOS technology a poor candidate for power ampli fier (PA) design when, compared to silicon germanium and Group III-V technologies (gallium nitride, gallium arsenide and indium phosphide). In order to overcome the above mentioned challenges in CMOS, this thesis re-explores FET-stacking as a power combining technique at 60 GHz using 45nm silicon-on-insulator (SOI) CMOS for millimeter-wave PAs. The stacking approach enables the use of higher supply voltages to obtain higher output power, and its higher load line resistance Ropt allows for the use of low impedance transformation matching networks. The reliability of CMOS PA under large signal operation is also addressed and improved with the FET-stacking approach applied in this work. This thesis divides the millimeter-wave PA design problem in to two areas, active and passive, both of which are critically designed for optimum performance in terms of effi ciency and output power while taking device and substrate parasitics into consideration. A transistor unit cell combination topology, the 'Manifold', has been analyzed and applied in 45 nm SOI CMOS for large RF power transistor cells. Moreover, various topologies of slow wave coplanar waveguide (CPW) lines are analyzed and implemented on the SOI substrate to synthesize inductors for matching networks at 60 GHz. To demonstrate the active and passive design performance in 45nm SOI CMOS at 60 GHz, a two-stage cascode PA is presented. Measurement under continuous wave (CW) stimulus shows 18.2 dB gain, a 3 dB bandwidth of 20%, 14 dBm saturated output power at 22% peak power-added e fficiency (PAE). Moreover, to validate the FET-stacking analysis, a three-stack PA is designed and fabricated with an output performance of 8.8 dB gain, a 3 dB bandwidth of 20%, 16 dBm saturated output power at 14% peak PAE. Finally, a wideband three stage amplifi er is designed utilizing the two-stage cascode and three-stack PA, achieving 21.5 dB at gain over a fractional bandwidth of 20%, and 16 dBm saturated output power at 13.8% PAE

A 39GHz Balanced Power Amplifier with Enhanced Linearity in 45 nm SOI CMOS

With the high data rate communication systems that come with fifth-generation (5G) mobile networks, the shift of operation to millimeter-wave frequency becomes inevitable. The expected data rate in 5G is significantly improved over 4G by utilizing the large available channel bandwidth at millimeter wave frequencies and complex data modulation schemes. With this increase in operation frequency, many new challenges arise and research efforts are made to tackle them. Among them, the phased array system is one of the hottest topics as it can be made use of to improve the link budget and overcome the path loss challenge at these frequencies. As the last circuit component in the transmitter's front-end right before the antenna, the power amplifier (PA) is one of the most crucial components with significant effects on overall system performance. Many of the traditional challenges of CMOS PA design such as output power and efficiency, are now compounded with the additional challenges that are imposed on complementary metal-oxide semiconductor (CMOS) PAs in millimeter wave phased array systems. This thesis presents a balanced power amplifier design with enhanced linearity in GlobalFoundries' 45nm silicon-on-insulator (SOI) CMOS technology. By using the balanced topology with each stage terminating with a differential 2-stacked architecture, the PA achieves saturated output power of over 21 dBm. Each of the two identical sub-PAs in the balanced topology uses 2-stage topology with driver and PA co-design method. The linearity is enhanced through careful choice of biasing point and a strategic inter-stage matching network design methodology, resulting in amplitude-to-phase distortion below 1 degree up to the output 1dB compression level of over 19 dBm. The balanced amplifier topology significantly reduces the PA performance variation over mismatched load impedance at the output, thus improving the PA performance over different antenna active impedance caused by varying phased array beam-steering angles. In addition to this, the balanced topology also optimizes the PA input and output return loss, giving a better matching than -20 dB at both input and output, and minimizing the risk of potential issues and performance degradation in the system integration phase. Lastly, the compact transformer based matching networks and quadrature hybrids reduce the chip area occupation of this PA, resulting in a compact design with competitive performance

Millimetre Wave Series Connected Doherty PA Using 45nm SOI Process

With the high demand for high data rate communication systems, it is expected that wireless networks will migrate into the unexploited millimeter-wave frequencies. This migration and the utilization of wide-band digitally modulated signal possessing of high Peak-to-Average-Power- Ratio (PAPR) brings diffcult challenges in attaining a satisfactory trade-off between linearity and efficiency when designing mm-wave power amplifiers (PAs). There are various methods of maximizing the output power and peak effciency of mm-wave PAs that use deep-sub-micron technologies. Of these methods, little attention has been given to the efficiency enhancement of PAs in back-off region. The use of the Doherty technique in the mm-wave frequencies has attracted little attention. This is mainly due to complexity in realizing the quarter-wave impedance inverter and the low-gain of the class-C operating peaking transistor using deep-sub-micron technologies. In this thesis, a series-connected-load (SCL) Doherty topology is proposed to enhance the efficiency of a millimeter-wave power amplifier realized on a deep-sub-micron semiconductor technology. The output combiner is determined by the ABCD matrices of the ideal combiner network in the SCL Doherty PA to ensure proper load modulation. Then, it describes the methodology applied to realize the transformer-based combiner networks while absorbing the parasitic capacitance of the transistors to maximize efficiency in the back-off region. This methodology is then applied to realize a two-stage SCL Doherty PA in 45 nm Silicon-on- Insulator CMOS technology to operate at 60 GHz

Architectures and Integrated Circuits for Efficient, High-power "Digital'' Transmitters for Millimeter-wave Applications

This thesis presents architectures and integrated circuits for the implementation of energy-efficient, high-power "digital'' transmitters to realize high-speed long-haul links at millimeter-wave frequencies in nano-scale silicon-based processes

Distributed Circuit Analysis and Design for Ultra-wideband Communication and sub-mm Wave Applications

This thesis explores research into new distributed circuit design techniques and topologies, developed to extend the bandwidth of amplifiers operating in the mm and sub-mm wave regimes, and in optical and visible light communication systems. Theoretical, mathematical modelling and simulation-based studies are presented, with detailed designs of new circuits based on distributed amplifier (DA) principles, and constructed using a double heterojunction bipolar transistor (DHBT) indium phosphide (InP) process with fT =fmax of 350/600 GHz. A single stage DA (SSDA) with bandwidth of 345 GHz and 8 dB gain, based on novel techniques developed in this work, shows 140% bandwidth improvement over the conventional DA design. Furthermore, the matrix-single stage DA (M-SSDA) is proposed for higher gain than both the conventional DA and matrix amplifier. A two-tier M-SSDA with 14 dB gain at 300 GHz bandwidth, and a three-tier M-SSDA with a gain of 20 dB at 324 GHz bandwidth, based on a cascode gain cell and optimized for bandwidth and gain flatness, are presented based on full foundry simulation tests. Analytical and simulation-based studies of the noise performance peculiarities of the SSDA and its multiplicative derivatives are also presented. The newly proposed circuits are fabricated as monolithic microwave integrated circuits (MMICs), with measurements showing 7.1 dB gain and 200 GHz bandwidth for the SSDA and 12 dB gain at 170 GHz bandwidth for the three-tier M-SSDA. Details of layout, fabrication and testing; and discussion of performance limiting factors and layout optimization considerations are presented. Drawing on the concept of artificial transmission line synthesis in distributed amplification, a new technique to achieve up to three-fold improvement in the modulation bandwidth of light emitting diodes (LEDs) for visible light communication (VLC) is introduced. The thesis also describes the design and application of analogue pre-emphasis to improve signal-to-noise ratio in bandwidth limited optical transceivers