Design space exploration of photonic interconnects

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2011.Cataloged from PDF version of thesis.Includes bibliographical references (p. 109-113).As processors scale deep into the multi-core and many-core regimes, bandwidth and energy-efficiency of the on-die interconnect network have become paramount design issues. Recognizing potential limits of electrical interconnects, emerging nanophotonic integration has been recently proposed as a potential technology option for both on-chip and chip-to-chip applications. As optical links avoid the capacitive, resistive and signal integrity limits imposed upon electrical interconnects, the introduction of integrated photonics allows for efficient realization of physical connectivity that are costly to accomplish electrically. While many recent works have since cited the potential benefits of optics, inherent design tradeoffs of photonic datapath and backend components remain relatively unknown at the system-level. This thesis develops insights regarding the behavior of electrical and hybrid optoelectrical networks and systems. We present power and area models that capture the behavior of electrical interface circuits and their interactions with optical devices. To animate these models in the context of a full system, we contribute DSENT, a novel physical modeling framework capable of estimating the costs of generalized digital electronics, mixed-signal interface circuitry, and optical links. With DSENT, we enable fast power and area evaluation of entire networks to connect the dynamics of an underlying photonics interconnect to that of an otherwise electrical system. Using our methodolody, we perform a technology-driven design space exploration of intra-chip networks and highlight the importance of thermal tuning and parasitic receiver capacitances in network power consumption. We show that the performance gains enabled by photonics-inspired architectures can enable savings in total system energy even if the network is more costly. Finally, we propose a photonically interconnected DRAM system as a solution to the core-to-DRAM bandwidth bottleneck. By attacking energy consumption at the DRAM channel, chip, and bank level with integrated photoncis, we cut the power consumption of the DRAM system by 10x while remaining area neutral when compared to a projected electrical baseline.by Chen Sun.S.M

High Aspect-ratio Biomimetic Hair-like Microstructure Arrays for MEMS Multi-Transducer Platform

Many emerging applications of sensing microsystems in health care, environment, security and transportation systems require improved sensitivity and selectivity, redundancy, robustness, increased dynamic range, as well as small size, low power and low cost. Providing all of these features in a system consisting of one sensor is not practical or possible. Micro electro mechanical microsystems (MEMS) that combine a large sensor array with signal processing circuits could provide these features. To build such multi-transducer microsystems we get inspiration from “hair”, a structure frequently used in nature. Hair is a simple yet elegant structure that offers many attractive features such as large length to cross-sectional area ratio, large exposed surface area, ability to include different sensing materials, and ability to interact with surrounding media in sophisticated ways. In this thesis, we have developed a microfabrication technology to build 3D biomimetic hair structures for MEMS multi-transducer platform. Direct integration with CMOS will enable signal processing of dense arrays of 100s or 1000s of MEMS transducers within a small chip area. We have developed a new device structure that mimics biological hair. It includes a vertical spring, a proof-mass atop the spring, and high aspect-ratio narrow electrostatic gaps to adjacent electrodes for sensing and actuation. Based on this structure, we have developed three generations of 3D high aspect-ratio, small-footprint, low-noise accelerometers. Arrays of both high-sensitivity capacitive and threshold accelerometers are designed and tested, and they demonstrate extended full-scale detection range and frequency bandwidth. The first-generation capacitive hair accelerometer arrays are based on Silicon-on-Glass (SOG) process utilizing 500 µm thick silicon, achieving a highest sensor density of ~100 sensors/mm2 connected in parallel. Minimum capacitive gap is 5 μm with device height of 400 μm and spring length of 300 μm. A custom-designed Bosch deep-reactive-etching (DRIE) process is developed to etch ultra-deep (> 500 µm) ultra-high aspect-ratio (UHAR) features (AR > 40) with straight sidewalls and reduced undercut across a wide range of feature sizes. A two-gap dry-release process is developed for the second-generation capacitive hair accelerometers. Due to the large device height at full wafer thickness of 1 mm and UHAR capacitive transduction gaps at 2 µm that extend > 200 µm, the accelerometer achieves sub-µg resolution (< 1µg/√Hz) and high sensitivity (1pF/g/mm2), having an area smaller than any previous precision accelerometers with similar performance. Each sensor chip consists of devices with various design parameter to cover a wide range. Bonding with metal interlayers at < 400 °C allows direct integration of these devices on top of CMOS circuits. The third-generation digital threshold hair accelerometer takes advantage of large aspect-ratio of the hair structure and UHAR DRIE structures to provide low noise (< 600 ng/√Hz per mm2 footprint proof-mass due to small contact area) and low power threshold acceleration detection. 16-element (4-bit) and 32-element (5-bit) arrays of threshold devices (total chip area being < 1 cm2) with evenly-spaced threshold gap dimensions from 1 µm to 4 µm as well as with hair spring cross-sectional area from 102 µm to 302 µm are designed to suit specific g-ranges from < 100 mg to 50 g. This hair sensor and sensor array technology is suited for forming MEMS transducer arrays with circuits, including high performance IMUs as well as miniaturized detectors and actuators that require high temporal and spatial resolution, analogous to high-density CMOS imagers.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/143975/1/yemin_1.pd

Microfluidics and Nanofluidics Handbook

The Microfluidics and Nanofluidics Handbook: Two-Volume Set comprehensively captures the cross-disciplinary breadth of the fields of micro- and nanofluidics, which encompass the biological sciences, chemistry, physics and engineering applications. To fill the knowledge gap between engineering and the basic sciences, the editors pulled together key individuals, well known in their respective areas, to author chapters that help graduate students, scientists, and practicing engineers understand the overall area of microfluidics and nanofluidics. Topics covered include Finite Volume Method for Numerical Simulation Lattice Boltzmann Method and Its Applications in Microfluidics Microparticle and Nanoparticle Manipulation Methane Solubility Enhancement in Water Confined to Nanoscale Pores Volume Two: Fabrication, Implementation, and Applications focuses on topics related to experimental and numerical methods. It also covers fabrication and applications in a variety of areas, from aerospace to biological systems. Reflecting the inherent nature of microfluidics and nanofluidics, the book includes as much interdisciplinary knowledge as possible. It provides the fundamental science background for newcomers and advanced techniques and concepts for experienced researchers and professionals

1996 Laboratory directed research and development annual report

This report summarizes progress from the Laboratory Directed Research and Development (LDRD) program during fiscal year 1996. In addition to a programmatic and financial overview, the report includes progress reports from 259 individual R&D projects in seventeen categories. The general areas of research include: engineered processes and materials; computational and information sciences; microelectronics and photonics; engineering sciences; pulsed power; advanced manufacturing technologies; biomedical engineering; energy and environmental science and technology; advanced information technologies; counterproliferation; advanced transportation; national security technology; electronics technologies; idea exploration and exploitation; production; and science at the interfaces - engineering with atoms

NASA Tech Briefs, February 2001

The topics include: 1) Application Briefs; 2) National Design Engineering Show Preview; 3) Marketing Inventions to Increase Income; 4) A Personal-Computer-Based Physiological Training System; 5) Reconfigurable Arrays of Transistors for Evolvable Hardware; 6) Active Tactile Display Device for Reading by a Blind Person; 7) Program Automates Management of IBM VM Computer Systems; 8) System for Monitoring the Environment of a Spacecraft Launch; 9) Measurement of Stresses and Strains in Muscles and Tendons; 10) Optical Measurement of Temperatures in Muscles and Tendons; 11) Small Low-Temperature Thermometer With Nanokelvin Resolution; 12) Heterodyne Interferometer With Phase-Modulated Carrier; 13) Rechargeable Batteries Based on Intercalation in Graphite; 14) Signal Processor for Doppler Measurements in Icing Research; 15) Model Optimizes Drying of Wet Sheets; 16) High-Performance POSS-Modified Polymeric Composites; 17) Model Simulates Semi-Solid Material Processing; 18) Modular Cryogenic Insulation; 19) Passive Venting for Alleviating Helicopter Tail-Boom Loads; 20) Computer Program Predicts Rocket Noise; 21) Process for Polishing Bare Aluminum to High Optical Quality; 22) External Adhesive Pressure-Wall Patch; 23) Java Implementation of Information-Sharing Protocol; 24) Electronic Bulletin Board Publishes Schedules in Real Time; 25) Apparatus Would Extract Water From the Martian Atmosphere; 26) Review of Research on Supercritical vs Subcritical Fluids; 27) Hybrid Regenerative Water-Recycling System; 28) Study of Fusion-Driven Plasma Thruster With Magnetic Nozzle; 29) Liquid/Vapor-Hydrazine Thruster Would Produce Small Impulses; and 30) Thruster Based on Sublimation of Solid Hydrazin

Photodetectors

In this book some recent advances in development of photodetectors and photodetection systems for specific applications are included. In the first section of the book nine different types of photodetectors and their characteristics are presented. Next, some theoretical aspects and simulations are discussed. The last eight chapters are devoted to the development of photodetection systems for imaging, particle size analysis, transfers of time, measurement of vibrations, magnetic field, polarization of light, and particle energy. The book is addressed to students, engineers, and researchers working in the field of photonics and advanced technologies

Fiscal Year 1995

The mission of the Engineering Research, Development, and Technology Program at Lawrence Livermore National Laboratory (LLNL) is to develop the knowledge base, process technologies, specialized equipment, tools and facilities to support current and future LLNL programs. Engineering`s efforts are guided by a strategy that results in dual benefit: first, in support of Department of Energy missions, such as national security through nuclear deterrence; and second, in enhancing the nation`s economic competitiveness through their collaboration with US industry in pursuit of the most cost-effective engineering solutions to LLNL programs. To accomplish this mission, the Engineering Research, Development, and Technology Program has two important goals: (1) identify key technologies relevant to LLNL programs where they can establish unique competencies, and (2) conduct high-quality research and development to enhance their capabilities and establish themselves as the world leaders in these technologies. To focus Engineering`s efforts, technology thrust areas are identified and technical leaders are selected for each area. The thrust areas are comprised of integrated engineering activities, staffed by personnel from the nine electronics and mechanical engineering divisions, and from other LLNL organizations. This annual report, organized by thrust area, describes Engineering`s activities for fiscal year 1995. The report provides timely summaries of objectives methods, and key results from eight thrust areas: computational electronics and electromagnetics; computational mechanics; microtechnology; manufacturing technology; materials science and engineering; power conversion technologies; nondestructive evaluation; and information engineering