Hybrid monolithic integration of high-power DC-DC converters in a high-voltage technology

The supply of electrical energy to home, commercial, and industrial users has become ubiquitous, and it is hard to imagine a world without the facilities provided by electrical energy. Despite the ever increasing efficiency of nearly every electrical application, the worldwide demand for electrical power continues to increase, since the number of users and applications more than compensates for these technological improvements. In order to maintain the affordability and feasibility of the total production, it is essential for the distribution of the produced electrical energy to be as efficient as possible. In other words the loss in the power distribution is to be minimized. By transporting electrical energy at the maximum safe voltage, the current in the conductors, and the associated conduction loss can remain as low as possible. In order to optimize the total efficiency, the high transportation voltage needs to be converted to the appropriate lower voltage as close as possible to the end user. Obviously, this conversion also needs to be as efficient, affordable, and compact as possible. Because of the ever increasing integration of electronic systems, where more and more functionality is combined in monolithically integrated circuits, the cost, the power consumption, and the size of these electronic systems can be greatly reduced. This thorough integration is not limited to the electronic systems that are the end users of the electrical energy, but can also be applied to the power conversion itself. In most modern applications, the voltage conversion is implemented as a switching DC-DC converter, in which electrical energy is temporarily stored in reactive elements, i.e. inductors or capacitors. High switching speeds are used to allow for a compact and efficient implementation. For low power levels, typically below 1 Watt, it is possible to monolithically implement the voltage conversion on an integrated circuit. In some cases, this is even done on the same integrated circuit that is the end user of the electrical energy to minimize the system dimensions. For higher power levels, it is no longer feasible to achieve the desired efficiency with monolithically integrated components, and some external components prove indispensable. Usually, the reactive components are the main limiting factor, and are the first components to be moved away from the integrated circuit for increasing power levels. The semiconductor components, including the power transistors, remain part of the integrated circuit. Using this hybrid approach, it is possible in modern converterapplications to process around 60 Watt, albeit limited to voltages of a few Volt. For hybrid integrated converters with an output voltage of tens of Volt, the power is limited to approximately 10 Watt. For even higher power levels, the integrated power transistors also become a limiting factor, and are replaced with discrete power devices. In these discrete converters, greatly increased power levels become possible, although the system size rapidly increases. In this work, the limits of the hybrid approach are explored when using so-called smart-power technologies. Smart-power technologies are standard lowcost submicron CMOS technologies that are complemented with a number of integrated high-voltage devices. By using an appropriate combination of smart-power technologies and circuit topologies, it is possible to improve on the current state-of-the-art converters, by optimizing the size, the cost, and the efficiency. To determine the limits of smart-power DC-DC converters, we first discuss the major contributing factors for an efficient energy distribution, and take a look at the role of voltage conversion in the energy distribution. Considering the limitations of the technologies and the potential application areas, we define two test-cases in the telecommunications sector for which we want to optimize the hybrid monolithic integration in a smart-power technology. Subsequently, we explore the specifications of an ideal converter, and the relevant properties of the affordable smart-power technologies for the implementation of DC-DC converters. Taking into account the limitations of these technologies, we define a cost function that allows to systematically evaluate the different potential converter topologies, without having to perform a full design cycle for each topology. From this cost function, we notice that the de facto default topology selection in discrete converters, which is typically based on output power, is not optimal for converters with integrated power transistors. Based on the cost function and the boundary conditions of our test-cases, we determine the optimal topology for a smart-power implementation of these applications. Then, we take another step towards the real world and evaluate the influence of parasitic elements in a smart-power implementation of switching converters. It is noticed that the voltage overshoot caused by the transformer secondary side leakage inductance is a major roadblock for an efficient implementation. Since the usual approach to this voltage overshoot in discrete converters is not applicable in smart-power converters due to technological limitations, an alternative approach is shown and implemented. The energy from the voltage overshoot is absorbed and transferred to the output of the converter. This allows for a significant reduction in the voltage overshoot, while maintaining a high efficiency, leading to an efficient, compact, and low-cost implementation. The effectiveness of this approach was tested and demonstrated in both a version using a commercially available integrated circuit, and our own implementation in a smart-power integrated circuit. Finally, we also take a look at the optimization of switching converters over the load range by exploiting the capabilities of highly integrated converters. Although the maximum output power remains one of the defining characteristics of converters, it has been shown that most converters spend a majority of their lifetime delivering significantly lower output power. Therefore, it is also desirable to optimize the efficiency of the converter at reduced output current and output power. By splitting the power transistors in multiple independent segments, which are turned on or off in function of the current, the efficiency at low currents can be significantly improved, without introducing undesirable frequency components in the output voltage, and without harming the efficiency at higher currents. These properties allow a near universal application of the optimization technique in hybrid monolithic DC-DC converter applications, without significant impact on the complexity and the cost of the system. This approach for the optimization of switching converters over the load range was demonstrated using a boost converter with discrete power transistors. The demonstration of our smart-power implementation was limited to simulations due to an issue with a digital control block. On a finishing note, we formulate the general conclusions and provide an outlook on potential future work based on this research

Highly Integrated Dc-dc Converters

A monolithically integrated smart rectifier has been presented first in this work. The smart rectifier, which integrates a power MOSFET, gate driver and control circuitry, operates in a self-synchronized fashion based on its drain-source voltage, and does not need external control input. The analysis, simulation, and design considerations are described in detail. A 5V, 5-µm CMOS process was used to fabricate the prototype. Experimental results show that the proposed rectifier functions as expected in the design. Since no dead-time control needs to be used to switch the sync-FET and ctrl-FET, it is expected that the body diode losses can be reduced substantially, compared to the conventional synchronous rectifier. The proposed self-synchronized rectifier (SSR) can be operated at high frequencies and maintains high efficiency over a wide load range. As an example of the smart rectifier\u27s application in isolated DC-DC converter, a synchronous flyback converter with SSR is analyzed, designed and tested. Experimental results show that the operating frequency could be as high as 4MHz and the efficiency could be improved by more than 10% compared to that when a hyper fast diode rectifier is used. Based on a new current-source gate driver scheme, an integrated gate driver for buck converter is also developed in this work by using a 0.35µm CMOS process with optional high voltage (50V) power MOSFET. The integrated gate driver consists both the current-source driver for high-side power MOSFET and low-power driver for low-side power iv MOSFET. Compared with the conventional gate driver circuit, the current-source gate driver can recovery some gate charging energy and reduce switching loss. So the current-source driver (CSD) can be used to improve the efficiency performance in high frequency power converters. This work also presents a new implementation of a power supply in package (PSiP) 5MHz buck converter, which is different from all the prior-of-art PSiP solutions by using a high-Q bondwire inductor. The high-Q bondwire inductor can be manufactured by applying ferrite epoxy to the common bondwire during standard IC packaging process, so the new implementation of PSiP is expected to be a cost-effective way of power supply integration

High Performance Low Voltage Power Mosfet For High-frequency Synchronous Buck Converters

Power management solutions such as voltage regulator (VR) mandate DC-DC converters with high power density, high switching frequency and high efficiency to meet the needs of future computers and telecom equipment. The trend towards DC-DC converters with higher switching frequency presents significant challenges to power MOSFET technology. Optimization of the MOSFETs plays an important role in improving low-voltage DC-DC converter performance. This dissertation focuses on developing and optimizing high performance low voltage power MOSFETs for high frequency applications. With an inherently large gate charge, the trench MOSFET suffers significant switching power losses and cannot continue to provide sufficient performance in high frequency applications. Moreover, the influence of parasitic impedance introduced by device packaging and PCB assembly in board level power supply designs becomes more pronounced as the output voltage continues to decrease and the nominal current continues to increase. This eventually raises the need for highly integrated solutions such as power supply in package (PSiP) or on chip (PSoC). However, it is often more desirable in some PSiP architectures to reverse the source/drain electrodes from electrical and/or thermal point of view. In this dissertation, a stacked-die Power Block PSiP architecture is first introduced to enable DC-DC buck converters with a current rating up to 40 A and a switching frequency in the MHz range. New high- and low-side NexFETs are specially designed and optimized for the new PSiP architecture to maximize its efficiency and power density. In particular, a new NexFET structure with iv its source electrode on the bottom side of the die (source-down) is designed to enable the innovative stacked-die PSiP technology with significantly reduced parasitic inductance and package footprint. It is also observed that in synchronous buck converter very fast switching of power MOSFETs sometimes leads to high voltage oscillations at the phase node of the buck converter, which may introduce additional power loss and cause EMI related problems and undesirable electrical stress to the power MOSFET. At the same time, the synchronous MOSFET plays an important role in determining the performance of the synchronous buck converter. The reverse recovery of its body diode and the Cdv/dt induced false trigger-on are two major mechanisms that impact the performance of the SyncFET. This dissertation introduces a new approach to effectively overcome the aforementioned challenges associated with the state-of-art technology. The threshold voltage of the low-side NexFET is intentionally reduced to minimize the conduction and body diode related power losses. Meanwhile, a monolithically integrated gate voltage pull-down circuitry is proposed to overcome the possible Cdv/dt induced turn-on issue inadvertently induced by the low VTH SynFET. Through extensive modeling and simulation, all these innovative concepts are integrated together in a power module and fabricated with a 0.35µm process. With all these novel device technology improvements, the new power module delivers a significant improvement in efficiency and offers an excellent solution for future high frequency, high current density DC-DC converters. Megahertz operation of a Power v Block incorporating these new device techniques is demonstrated with an excellent efficiency observed

Optimization and analysis of PwrSoC Buck converter with integrated passives for automotive application

Current trends in automotive industry impose as main drivers the improvement of the efficiency and the miniaturization of the electronic systems. New technologies for passives enable the integration of inductor based power converter together with the load in a single chip. Due to the complexity of the system and various constraints, multi-variable optimization needs to be employed. This study presents an energy-based piece-wise linear model for switches losses estimation for 40 nm automotive approved semiconductor technology used for implementation of PwrSoC buck converter system. The model, based on discrete number of calculations performed with Spice simulations, is presented in detail in this study and it is validated experimentally

Design Methologies for Integrated Inductor-Based Soft-Switching DC DC Converters

This paper presents a study on resonant converter topologies targeted for CMOS integration. Design methodologies to optimize efficiency for the integration of Quasi-Resonant and Quasi-Square-Wave converters are proposed. A power loss model is used to optimize the design parameters of the power stage, including the driver circuits, and also to conclude about CMOS technology limitations. Based on this discussion, and taking as reference a 0.35μm CMOS process, two converters are designed to validate the proposal: a Quasi Resonant boost converter operating at 100MHz and a Quasi-Square-Wave buck converter operating at 70MHz. Simulation results confirm the feasibility of these topologies for monolithic integration

Dead Time Management in GaN Based Three-Phase Motor Drives

This paper deals with the dead time selection in Gallium Nitride (GaN) FET based three-phase brushless DC motor drives. The GaN wide-bandgap (WBG) technology enables the increase of the switching frequency compared with silicon MOSFET. In inverter applications, it is necessary to insert a dead time in the switching signals, to avoid cross conduction in the inverter leg. The dead time selection is a compromise between the switching time and the quality of the inverter output waveforms. GaN FETs can operate with dead times in the range of tens of ns. In this paper the advantages of the GaN technology in the reduction of dead time in terms of output waveforms distortion and speed ripple compared with silicon MOSFET are carried out. Furthermore, an evaluation on the dead time compensation technique compared with the hardware technology reduction is investigated demonstrating the effectiveness and the saving of software and hardware resources obtained by GaN FET devices

Effect of CMOS Technology Scaling on Fully-Integrated Power Supply Efficiency

International audienceIntegrating a power supply in the same die as the powered circuits is an appropriate solution for granular, fine and fast power management. To allow same-die co-integration, fully integrated DC-DC converters designed in the latest CMOS technologies have been greatly studied by academics and industrialists in the last decade. However, there is little study concerning the effects of the CMOS scaling on these particular circuits. To show the trends, this paper compares the achievable efficiencies of the 2:1 switched capacitor DC-DC converter topology under the same constraints in 65, 130 and 350nm bulk CMOS nodes and 28nm in bulk and FDSOI technologies with various capacitor options

Energy-Based switches losses model for the optimization of PwrSoC buck converter

Current trends in automotive industry impose as main drivers the improvement of the efficiency and the miniaturization of the electronic systems. New technologies for passives enable the integration of inductor based power converter together with the load in a single chip. Due to the complexity of the system and various constraints, multi-variable optimization needs to be employed. This study presents an energy-based piece-wise linear model for switches losses estimation for 40 nm automotive approved semiconductor technology used for implementation of PwrSoC buck converter system. The model, based on discrete number of calculations performed with Spice simulations, is presented in detail in this study and it is validated experimentally

Design and optimization of IGBT gate drivers for high insulation voltage up to 30kV

International audienceIn this article, a design methodology tooptimize IGBT gate drivers for high insulation voltage capability(up to 30kV) is proposed. A Pot core ferrite with circular coilstransformer is used for high insulation capabilities. Theinsulation voltage level is defined by the air gap length and thedielectric material. The pulse width modulation (PWM) signaltransmission and power transmission functions of IGBT gatedriver are studied and optimized. For both functions, theobjective of the studies is to optimize the geometric elements oftransformer and the associated electrical components by the helpof a virtual prototyping tool. Therefore, the optimization resultsare proposed under Pareto fronts: optimization objectives for aset of the barrier insulation thickness. Finally, the experimentalverifications are shown to validate the proposed methodology

Hybrid behavioral-analytical loss model for a high frequency and low load DC/DC buck converter

This work presents a behavioral-analytical hybrid loss model for a buck converter. The model has been designed for a wide operating frequency range up to 4MHz and a low power range (below 20W). It is focused on the switching losses obtained in the power MOSFETs. Main advantages of the model are the fast calculation time (below 8.5 seconds) and a good accuracy, which makes this model suitable for the optimization process of the losses in the design of a converter. It has been validated by simulation and experimentally with one GaN power transistor and three Si MOSFETs. Results show good agreement between measurements and the mode