Numerical analysis of lead-free solder joints: effects of thermal cycling and electromigration

To meet the requirements of miniaturization and multifunction in microelectronics, understanding of their reliability and performance has become an important research subject in order to characterise electronics served under various loadings. Along with the demands of the increasing miniaturization of electronic devices, various properties and the relevant thermo-mechanical-electrical response of the lead-free solder joints to thermal cycling and electro-migration become the critical factors, which affect the service life of microelectronics in different applications. However, due to the size and structure of solder interconnects in microelectronics, traditional methods based on experiments are not applicable in the evaluation of their reliability under complex joint loadings. This thesis presents an investigation, which is based on finite-element method, into the performance of lead-free solder interconnects under thermal fatigue and electro-migration, specifically in the areas as follows: (1) the investigation of thermal-mechanical performance and fatigue-life prediction of flip-chip package under different sizes to achieve a further understanding of IMC layer and size effects of a flip chip package under thermal cycling; (2) the establishment of a numerical method, simulating void-formation/crack-propagation based on the results of finite-element analysis, to allow the prediction of crack evolution and failure time for electro-migration reliability of solder bumps; (3) the establishment of a flow-based algorithm for combination effects of thermal-mechanical and electro-migration that was subsequent implemented in to an FE model to evaluate the reliability assessment of service lives associated with a flip chip package

Study Of Deformation And Crack Propagation On Component During Reflow Soldering Process

A typical element found in electronic assemblies and devices is the multi-layered ceramic capacitor (MLCC). However, MLCC mechanical defects such as voiding, cracking, and delamination would significantly reduce the device's usefulness, dependability, and longevity. This mechanical defect is one of the significant factors that will develop in the surface mount of the multi-layered ceramic capacitor, especially the layer between the two different materials that are mounted together. Therefore, the purpose of this study is to study the crack propagation that will be found in the boundary of the copper and copper-epoxy layers of the multi-layered ceramic capacitor during the reflow soldering process. The numerical simulation method for the thermal reflow process of the MLCC model and the crack propagation from the initial micro voids due to the high moisture contamination on that layer was approached. Besides, the temperature flow and the moisture contamination on the copper and copper-epoxy layers were examined during the simulation for the causes of the crack propagation on the MLCC. From the results of the simulation conducted, the crack propagation in between the copper and copper-epoxy layers was caused by the thermal mismatch and propagation growth of micro voids during the reflow soldering process. As a result of the high pressure of vapour absorbed in the gap between the copper and copper-epoxy layer, it will have a greater capacity to absorb moisture and cause crack delamination, resulting in the higher temperatures required to commence the crack at 270 °C during the reflow process. At 284.2 (mg/mm3), the concentration is at its highest. Because of this, a multi-layered ceramic capacitor results in a 0.077218 mm deformation between copper and copper-epoxy. Higher vicinity stress, mode I stress intensity factor, and crack elongation rate would result from this greater void. The main reason for the temperature reflows that is related to the fracture propagation problems in capacitors has been identified, and workable solutions have thus been suggested. This would help the end-users by enhancing the performance and dependability of the electronic equipment, as well as minimizing the additional manufacturing costs and lead times required in locating and resolving the problems

The durability of solder joints under thermo-mechanical loading; application to Sn-37Pb and Sn-3.8Ag-0.7Cu lead-free replacement alloy

Solder joints in electronic packages provide mechanical, electrical and thermal connections. Hence, their reliability is also a major concern to the electronic packaging industry. Ball Grid Arrays (BGAs) are a very common type of surface mount technology for electronic packaging. This work primarily addresses the thermo-mechanical durability of BGAs and is applied to the exemplar alloys; traditional leaded solder and a popular lead-free solder. Isothermal mechanical fatigue tests were carried out on 4-ball test specimens of the lead-free (Sn-3.8Ag-0.7Cu) and leaded (Sn-37Pb) solder under load control at room temperature, 35°C and 75°C. As well as this, a set of combined thermal and mechanical cycling tests were carried out, again under load control with the thermal cycles either at a different frequency from the mechanical cycles (not-in-phase) or at the same frequency (both in phase and out-of-phase). The microstructural evaluation of both alloys was investigated by carrying out a series of simulated ageing tests, coupled with detailed metallurgical analysis and hardness testing. The results were treated to produce stress-life, cyclic behaviour and creep curves for each of the test conditions. Careful calibration allowed the effects of substrate and grips to be accounted for and so a set of strain-life curves to be produced. These results were compared with other results from the literature taking into account the observations on microstructure made in the ageing tests. It is generally concluded that the TMF performance is better for the Sn-Ag-Cu alloy than for the Sn-Pb alloy, when expressed as stress-life curves. There is also a significant effect on temperature and phase for each of the alloys, the Sn-Ag-Cu being less susceptible to these effects. When expressed as strain life, the effects of temperature, phase and alloy type are much diminished. Many of these conclusions coincided with only parts of the literature and reasons for the remaining differences are advanced

Investigation of the mechanical performance of fiber-modified ceramic composites using finite element method

Ceramic materials are widely used in impact safekeeping systems. Ceramic is a heterogeneous material; its characteristics depend considerably both on specifications of its ingredients and the material structure completely. The finite element method (FEM) can be a useful tool for strength computation of these materials. In this paper, the mechanical properties of the ceramic composites are investigated, and the mechanical performance modeling of fiber-fortified ceramic matrix composites (CMC) is expressed by the instance of aluminum oxide fibers in a matrix composite based on alumina. The starting point of the modeling is an infrastructure (primary cell) that contains a micromechanical size, the statistical analysis characteristics of the matrix, fiber-matrix interface, fiber, and their reciprocal influences. The numeral assessment of the model is done using the FEM. The numerical results of composite elastic modulus were computed based on the amount of the added fibers and the porosity was evaluated for empirical data of samples with a similar composition. Various scanning electron microscope (SEM) images were used for each sample to specify the porosity. Also, the unit cell method presumed that the porous ceramic substance is manufactured from an array of fundamental units, each with the same composition, material characteristic, and cell geometry. The results showed that when the material consists of different pores and fibers, the amount of Young’s modulus reduces with the increment of porosity. The linear correlation model of elasticity versus porosity value from experimental data was derived by MATLAB curve fitting. The experimental data from the mechanical test and numerical values were in good agreement

Non-destructive evaluation of solder joint reliability

A through life non-destructive evaluation technique is presented in which a key solder joint feature, nucleating at the bump to silicon interface and propagating across a laminar crack plane is captured and tracked using acoustic microscopy imaging (AMI). The feasibility of this concept was successfully demonstrated by employing the measurement technique in combination with Finite Element Analysis (FEA) to study the impact of component floor plan layout on the reliability of electronics systems subjected to thermal cycling. A comprehensive review of current and emerging packaging and interconnect technologies has shown increasingly a move from conventional 2D to 3D packaging. These present new challenges for reliability and Non Destructive Evaluation (NDE) due to solder joints being hidden beneath the packaging, and not ordinarily visible or accessible for inspection. Solutions are developed using non-destructive testing (NDT) techniques that have the potential to detect and locate defects in microelectronic devices. This thesis reports on X-ray and Acoustic Micro Imaging (AMI) which have complementary image discriminating features. Gap type defects are hard to find using X-ray alone due to low contrast and spot size resolution, whereas AMI having better axial resolution has allowed cracks and delamination at closely spaced interfaces to be investigated. The application of AMI to the study of through life solder joint behaviour has been achieved for the first time. Finite Element Analysis and AMI performance were compared to measure solder joint reliability for several realistic test cases. AMI images were taken at regular intervals to monitor through- life behaviour. Image processing techniques were used to extract a diameter measurement for a laminar crack plane, within a solder joint damage region occurring at the bump to silicon interface. FEA solder joint reliability simulations for flip-chip and micro-BGA (mBGA) packages placed on FR4 PCB's were compared to the AMI measurement performance, with a reasonable level of correlation observed. Both techniques clearly showed significant reliability degradation of the critical solder joints located furthest from the neutral axis of the package, typically residing at the package corners. The technique also confirmed that circuit board thickness can affect interconnect reliability, as can floor plan. Improved correlation to the real world environment was achieved when simulation models considered the entire floor plan layout and constraints imposed on the circuit board assembly. This thesis established a novel through life solder joint evaluation method crucial to the development of better physics of failure models and the advancement of model based prognostics in electronics systems

Lifetime modelling of large area solder joints in power electronic inverter units

Power electronics (PE) modules in inverter units are a critical part of the Hybrid/Electric vehicles drivetrain. During passive temperature cycling, the solder joint between the PE module and the baseplate develops cracks. A detailed reliability investigation was carried out on multiple physical variants under three temperature cycling profiles to uncover major influence parameters. A stress triaxiality and inelastic strain based FEM damage parameter was formulated which showed excellent correlation with experimental results.Leistungselektronikmodule (PE) in Wechselrichtern sind ein wichtiger Bestandteil von Hybrid-/Elektrofahrzeugen. Bei passivem Temperaturwechsel entwickelt die Lötstelle zwischen dem PE-Modul und der Grundplatte Risse. Es wurde eine detaillierte Zuverlässigkeitsuntersuchung an mehreren physikalischen Varianten unter drei Temperaturwechselprofile durchgeführt, um die wichtigsten Einflussparameter aufzudecken. Es wurde ein auf Spannungs-Triaxialität und unelastischer Dehnung basierender FEM-Schadensparameter formuliert, der eine ausgezeichnete Korrelation mit experimentellen Ergebnissen zeigte

Dynamic Mechanical and Failure Properties of Solder Joints

Ph.DDOCTOR OF PHILOSOPH

Thermal and thermo-mechanical performance of voided lead-free solder thermal interface materials for chip-scale packaged power device

The need to maximise thermal performance of electronic devices coupled with the continuing trends on miniaturization of electronic packages require innovative package designs for power devices and modules such as Electronic Control Unit (ECU). Chip scale packaging (CSP) technology offer promising solution for packaging power electronics. This is as a result of the technology’s relatively improved thermal performance and inherent size advantage. In CSP technology, heat removal from the device could be enhanced through the backside of the chip. Heat dissipating units such as heat spreader and/or heat sink can be attached to the backside (reverse side) of the heat generating silicon die (via TIM) in an effort to improve the surface area available for heat dissipation. TIMs are used to mechanically couple the heat generating chip to a heat sinking device and more crucially to enhance thermal transfer across the interface. Extensive review shows that solder thermal interface materials (STIMs) apparently offer better thermal performance than comparable state-of-the-art commercial polymer-based TIMs and thus a preferable choice in packaging power devices. Nonetheless, voiding remains a major reliability concern of STIMs. This is coupled with the fact that solder joints are generally prone to fatigue failures under thermal cyclic loading. Unfortunately, the occurrence of solder voids is almost unavoidable during manufacturing process and is even predominant in lead (Pb)-free solder joints. The impacts of these voids on the thermal and mechanical performance of solder joints are not clearly understood and scarcely available in literature especially with regards to STIMs (large area solder joints). Hence, this work aims to investigate STIM and the influence of voids on the thermo-mechanical and thermal performance of STIM. As previous results suggest that factors such as the location, configuration (spatial arrangement) and size of voids play vital roles on the exact effect of voids, extensive three dimensional (3D) finite element modelling is employed to elucidate the precise effect of these void features on a Pb-free STIM selected after thermo-mechanical fatigue test of standard Pb-free solder alloys. Finite element analysis (FEA) results show that solder voids configuration, size and location are all vital parameters in evaluating the mechanical and thermal impacts of voids. Depending on the location, configuration and size of voids; solder voids can either influence the initiation or propagation of damage in the STIM layer or the location of hot spot on the heat generating chip. Experimental techniques are further employed to compare and correlate levels of voiding and shear strength for representative Pb-free solders. Experimental results also suggest that void size, location and configuration may have an influence on the mechanical durability of solder joints. The findings of this research work would be of interest to electronic packaging engineers especially in the automotive sector and have been disseminated through publications in peer reviewed journals and presentations in international conferences

NASA SBIR abstracts of 1990 phase 1 projects

The research objectives of the 280 projects placed under contract in the National Aeronautics and Space Administration (NASA) 1990 Small Business Innovation Research (SBIR) Phase 1 program are described. The basic document consists of edited, non-proprietary abstracts of the winning proposals submitted by small businesses in response to NASA's 1990 SBIR Phase 1 Program Solicitation. The abstracts are presented under the 15 technical topics within which Phase 1 proposals were solicited. Each project was assigned a sequential identifying number from 001 to 280, in order of its appearance in the body of the report. The document also includes Appendixes to provide additional information about the SBIR program and permit cross-reference in the 1990 Phase 1 projects by company name, location by state, principal investigator, NASA field center responsible for management of each project, and NASA contract number