Reconfigurable three-terminal logic devices using phase-change materials

Conventional solid-state and mass storage memories (such as SRAM, DRAM and the hard disk drive HDD) are facing many technological challenges to meet the ever-increasing demand for fast, low power and cheap data storage solutions. This is compounded by the current conventional computer architectures (such as the von Neumann architecture) with separate processing and storage functionalities and hence data transfer bottlenecks and increased silicon footprint. Beyond the von Neumann computer architecture, the combination of arithmetic-logic processing and (collocally) storage circuits provide a new and promising alternative for computer systems that overcome the many limitations of current technology. However, there are many technical challenges that face the implementation of universal blocks of both logic and memory functions using conventional silicon technology (transistor-transistor logic - TTL, and complementary metal oxide semiconductors - CMOS). Phase-change materials, such as Ge2Sb2Te5 (GST), provide a potential complement or replacement to these technologies to provide both processing and, collocally, storage capability. Existing research in phase-change memory technologies focused on two-terminal non-volatile devices for different memory and logic applications due to their ability to achieve logic-resistive switching in nanosecond time scale, their scalability down to few nanometer-scale cells, and low power requirements. To perform logic functionality, current two-terminal phase-change logic devices need to be connected in series or parallel circuits, and require sequential inputs to perform the required logic function (such as NAND and NOR). In this research programme, three-terminal (3T) non-volatile phase-change memories are proposed and investigated as potential alternative logic cells with simultaneous inputs as reconfigurable, non-volatile logic devices. A vertical 3T logic device structure is proposed in this work based on existing phase-change based memory cell architecture and original concept work by Ovshinsky. A comprehensive, multi-physics finite-element model of the vertical 3T device was constructed in Comsol Multiphysics. This model solves Laplace's equation for the electric potential due to the application of voltage sources. The calculated electric potential and fields provide the Joule heating source in the device, which is used to compute the temperature distribution through solution of the heat diffusion equation, which is necessary to activate the thermally-driven phase transition process. The physically realistic and computationally efficient nucleation- growth model was numerically implemented to model the phase change and resistance change in the Ge2Sb2Te5 (GST) phase-change material in the device, which is combined with the finite- element model using the Matlab programming interface. The changes in electrical and thermal conductivities in the GST region are taken into account following the thermally activated phase transformations between the amorphous-crystalline states using effective medium theory. To determine the appropriate voltage and temperature conditions for the SET and RESET operations, and to optimise the materials and thicknesses of the thermal and heating layers in the device, comprehensive steady-state parametric simulations were carried out using the finite-element multi-physics model. Simulations of transient cycles of writing (SET) and erasing (RESET) processes using appropriate voltage pulses were then carried out on the designed vertical 3T device to study the phase transformations for practical reconfigurable logic operations. The simulations indicated excellent resistance contrast between the logic 1 and 0 states, and successfully demonstrated the feasibility of programming the logic functions of NAND and NOR gates using this 3T configuration

2022 roadmap on neuromorphic computing and engineering

Modern computation based on von Neumann architecture is now a mature cutting-edge science. In the von Neumann architecture, processing and memory units are implemented as separate blocks interchanging data intensively and continuously. This data transfer is responsible for a large part of the power consumption. The next generation computer technology is expected to solve problems at the exascale with 10$^{18}$ calculations each second. Even though these future computers will be incredibly powerful, if they are based on von Neumann type architectures, they will consume between 20 and 30 megawatts of power and will not have intrinsic physically built-in capabilities to learn or deal with complex data as our brain does. These needs can be addressed by neuromorphic computing systems which are inspired by the biological concepts of the human brain. This new generation of computers has the potential to be used for the storage and processing of large amounts of digital information with much lower power consumption than conventional processors. Among their potential future applications, an important niche is moving the control from data centers to edge devices. The aim of this roadmap is to present a snapshot of the present state of neuromorphic technology and provide an opinion on the challenges and opportunities that the future holds in the major areas of neuromorphic technology, namely materials, devices, neuromorphic circuits, neuromorphic algorithms, applications, and ethics. The roadmap is a collection of perspectives where leading researchers in the neuromorphic community provide their own view about the current state and the future challenges for each research area. We hope that this roadmap will be a useful resource by providing a concise yet comprehensive introduction to readers outside this field, for those who are just entering the field, as well as providing future perspectives for those who are well established in the neuromorphic computing community

Magneto-ionic suppression of magnetic vortices

Magneto-ionics refers to the non-volatile control of the magnetic properties of materials by voltage-driven ion migration. This phenomenon constitutes one of the most important magnetoelectric mechanisms and, so far, it has been employed to modify the magnetic easy axis of thin films, their coercivity or their net magnetization. Herein, a novel magneto-ionic effect is demonstrated: the transition from vortex to coherent rotation states, caused by voltage-induced ion motion, in arrays of patterned nanopillars. Electrolyte-gated Co/GdOx bilayered nanopillars are chosen as a model system. Electron microscopy observations reveal that, upon voltage application, oxygen ions diffuse from GdOx to Co, resulting in the development of paramagnetic oxide phases (CoOx) along sporadic diffusion channels. This breaks up the initial magnetization configuration of the ferromagnetic pillars (i.e. vortex states) and leads to the formation of small ferromagnetic nanoclusters, embedded in the CoOx matrix, which behave as single-domain nanoparticles. As a result, a decrease in the net magnetic moment is observed, together with a drastic change in the shape of the hysteresis loop. Micromagnetic simulations are used to interpret these findings. These results pave the way towards a new potential application of magnetoelectricity: the magneto-ionic control of magnetic vortex states

Etude d'architectures et d'empilements innovants de mémoires Split-Gate (grille séparée) à couche de piégeage discret

Du fait de l'augmentation de la demande de produits pour les applications grand public, industrielles et automobiles, des mémoires embarquées fiables et à faible coût de fabrication sont de plus en plus demandées. Dans ce contexte, les mémoires split-gate à piégeage discret sont proposées pour des microcontrôleurs. Elles combinent l'avantage d'une couche de stockage discrète et de la con guration split-gate. Durant ce travail de recherche, des mémoires split-gate à couche de piégeage discret ayant des longueurs de grille de 20nm sont présentées pour la première fois. Celles-ci on été réalisées avec des nanocristaux de silicium (Si-nc), du nitrure de silicium (SiN) ou un hybride Si-nc/SiN avec diélectrique de control de type SiO2 ou AlO et sont comparées en termes de performances lors des procédures d'eff acement et de rétention. Ensuite, la miniaturisation des mémoires split-gate à piégeage de charge est étudié, en particulier au travers de l'impact de la réduction de la longueur de grille sur la fenêtre de mémorisation, la rétention et la consommation. Le rôle des défauts dans le diélectrique de contrôle (alumine) utilisé dans les mémoires de type TANOS a été étudié. Des travaux ont été menés pour déterminer l'origine des pièges dans ce matériau, par le biais de la simulation atomistique ainsi que d'analyses physico-chimiques précises. Nous avons montré que la concentration de pièges dans AlO pouvait être réduite par ajustement des conditions de procédé de fabrication, débouchant ainsi sur l'amélioration de la rétention dans les mémoires à piégeage de charge. Ce résultat est convenable pour les applications de type embarquéDue to the increasing demand for consumer, industrial and automotive products, highly reliable, and low integration cost embedded memories are more and more required. In this context, split-gate charge trap memories were proposed for microcontroller products, combining the advantage of a discrete storage layer and of the split-gate con guration. In this thesis, split-gate charge trap memories with electrical gate length down to 20nm are presented for the 1st time. Silicon nanocristals (Si-nc), or silicon nitride (SiN) and hybrid Si-nc/SiN based split-gate memories, with SiO2 or AlO control dielectrics, are compared in terms of program erase and retention. Then, the scalability of split-gate charge trap memories is studied, investigating the impact of gate length reduction on the memory window, retention and consumption. We thus studied the role of defects on alumina control dielectric employed in TANOS-like memory. We used atomistic simulation, consolidated by a detailed alumina physico-chemical material analysis, to investigate the origin of traps in alumina. We showed that the trap concentration in AlO can be decreased by adjusting the process conditions leading to improved retention behaviour in charge trap memory, suitable for embedded applications.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Nanoscale Carbon-Based Memory Devices

Amorphous carbon-based memories have gained traction in recent years due to their good scalability and switching performance and are an important contender to close the performance gap between fast but volatile DRAM and slow but non-volatile flash memory. A writing and erasing process driven by the electrically induced formation and rupture of a conductive filament permits switching times in the range of a few nanoseconds. Further, the memristive property of amorphous carbon allows the implementation of beyond von Neumann computation paradigms. However, ‘pure’ amorphous memories have a low cyclic endurance. To overcome this and to exploit beyond von Neumann computation, devices based on oxygenated amorphous carbon were employed here. The first part of this thesis evaluated the switching performance and data retention capabilities of tetrahedral amorphous carbon memories. Switching times below 10 ns were achieved for the SET as well as for the RESET times. An energy consumption below 1 pJ was obtained, while data could be retained for more than 300 s at 450 °C. Further, evidence was provided that the SET process is not induced by an electric field alone. A finite-element simulation was employed in the second part of this thesis to reproduce the experimentally determined conductivity of tetrahedral amorphous carbon (ta-C) memory devices and to shine light on the conditions at the onset switching from the high to low resistance states (dielectric breakdown). The maximum temperature observed at dielectric breakdown was 1615 K. It was found that a reduction of the lateral cell radius from 25 nm to 15 nm and 10 nm increases the switching performance by reducing the switching current from 34 µA to 20 µA and 8 µA. The third part of this thesis evaluated the switching performance, temperature stability, multilevel storage and memcomputing capabilities of oxygenated amorphous carbon. Switching times below 10 ns for both, SET and RESET were demonstrated. A 3-level (1 1 /2 bits) data storage was achieved using three different resistance states. Further, a memcomputing approach was implemented using a base-16 accumulation response with energy consumptions as low as <100 fJ per pulse. Additionally, a finite element simulation of a device in the low resistance state (LRS) was used to illustrate the correlation between device resistance and Joule heating effects

Fabrication and Pseudo-Analog Characteristics of Ta2O5 -Based ReRAM Cell

Memristori on yksi elektroniikan peruskomponenteista vastuksen, kondensaattorin ja kelan lisäksi. Se on passiivinen komponentti, jonka teorian kehitti Leon Chua vuonna 1971. Kesti kuitenkin yli kolmekymmentä vuotta ennen kuin teoria pystyttiin yhdistämään kokeellisiin tuloksiin. Vuonna 2008 Hewlett Packard julkaisi artikkelin, jossa he väittivät valmistaneensa ensimmäisen toimivan memristorin. Memristori eli muistivastus on resistiivinen komponentti, jonka vastusarvoa pystytään muuttamaan. Nimens mukaisesti memristori kykenee myös säilyttämään vastusarvonsa ilman jatkuvaa virtaa ja jännitettä. Tyypillisesti memristorilla on vähintään kaksi vastusarvoa, joista kumpikin pystytään valitsemaan syöttämällä komponentille jännitettä tai virtaa. Tämän vuoksi memristoreita kutsutaankin usein resistiivisiksi kytkimiksi. Resistiivisiä kytkimiä tutkitaan nykyään paljon erityisesti niiden mahdollistaman muistiteknologian takia. Resistiivisistä kytkimistä rakennettua muistia kutsutaan ReRAM-muistiksi (lyhenne sanoista resistive random access memory). ReRAM-muisti on Flash-muistin tapaan haihtumaton muisti, jota voidaan sähköisesti ohjelmoida tai tyhjentää. Flash-muistia käytetään tällä hetkellä esimerkiksi muistitikuissa. ReRAM-muisti mahdollistaa kuitenkin nopeamman ja vähävirtaiseman toiminnan Flashiin verrattuna, joten se on tulevaisuudessa varteenotettava kilpailija markkinoilla. ReRAM-muisti mahdollistaa myös useammin bitin tallentamisen yhteen muistisoluun binäärisen (”0” tai ”1”) toiminnan sijaan. Tyypillisesti ReRAM-muistisolulla on kaksi rajoittavaa vastusarvoa, mutta näiden kahden tilan välille pystytään mahdollisesti ohjelmoimaan useampia tiloja. Muistisoluja voidaan kutsua analogisiksi, jos tilojen määrää ei ole rajoitettu. Analogisilla muistisoluilla olisi mahdollista rakentaa tehokkaasti esimerkiksi neuroverkkoja. Neuroverkoilla pyritään mallintamaan aivojen toimintaa ja suorittamaan tehtäviä, jotka ovat tyypillisesti vaikeita perinteisille tietokoneohjelmille. Neuroverkkoja käytetään esimerkiksi puheentunnistuksessa tai tekoälytoteutuksissa. Tässä diplomityössä tarkastellaan Ta2O5 -perustuvan ReRAM-muistisolun analogista toimintaa pitäen mielessä soveltuvuus neuroverkkoihin. ReRAM-muistisolun valmistus ja mittaustulokset käydään läpi. Muistisolun toiminta on harvoin täysin analogista, koska kahden rajoittavan vastusarvon välillä on usein rajattu määrä tiloja. Tämän vuoksi toimintaa kutsutaan pseudoanalogiseksi. Mittaustulokset osoittavat, että yksittäinen ReRAM-muistisolu kykenee binääriseen toimintaan hyvin. Joiltain osin yksittäinen solu kykenee tallentamaan useampia tiloja, mutta vastusarvoissa on peräkkäisten ohjelmointisyklien välillä suurta vaihtelevuutta, joka hankaloittaa tulkintaa. Valmistettu ReRAM-muistisolu ei sellaisenaan kykene toimimaan pseudoanalogisena muistina, vaan se vaati rinnalleen virtaa rajoittavan komponentin. Myös valmistusprosessin kehittäminen vähentäisi yksittäisen solun toiminnassa esiintyvää varianssia, jolloin sen toiminta muistuttaisi enemmän pseudoanalogista muistia.The memristor is one of the fundamental circuit elements in addition to a resistor, capacitor and an inductor. It is a passive component whose theory was postulated by Leon Chua in 1971. It took over 30 years before any known physical examples were discovered. In 2008 Hewlett Packard published an article where they manufactured a device which they claimed to be the first memristor found. The memristor, which is a concatenation of memory resistor, is a resistive component that has an ability to change its resistance. It can also remember its resistance value without continuous current or voltage. Typically, a memristor has at least two resistance states that can be altered. This is the reason why memristors are also called resistive switches. Resistive switches can be used in memory technologies. A memory array that has been built using resistive switches is called ReRAM (resistive random access memory). ReRAM, like Flash memory, is a non-volatile memory that can be programmed or erased electrically. Flash memories are currently used e.g. in memory sticks. However, compared to Flash, ReRAM has faster operating speed and lower power consumption, for instance. It could potentially replace current memory standards in future. A ReRAM memory cell can also store multiple bits instead of binary operation (”0” or ”1”). Typically there exists multiple intermediate resistance states between ReRAM’s limiting resistances that could be utilized. Such memory could be called analog, if the amount of intermediate states is not limited to discrete levels. Analog memories make it possible to build artificial neural networks (ANN) efficiently, for instance. ANNs try to model the behaviour of brain and to perform tasks that are difficult for traditional computer programs such as speech recognition or artificial intelligence. This thesis studies the analog behaviour of Ta 2 O 5 -based ReRAM cell. Manufacturing process and measurement results are presented. The operation of ReRAM cell is rarely fully analog as there exists limited amount of intermediate resistance states. This is the reason why operation is called pseudo-analog. Measurement results show that a single ReRAM cell is suitable for binary operation. In some cases, a single cell can store multiple resistance values but there exists significant variance in resistance states between subsequent programming cycles. The proposed ReRAM cell cannot operate as pseudo-analog ReRAM cell in itself as it needs an external current limiting component. Improving the manufacturing process should reduce the variability such that the operation would be more like a pseudo-analog memory.Siirretty Doriast

Physics of thin-film ferroelectric oxides

This review covers the important advances in recent years in the physics of thin film ferroelectric oxides, the strongest emphasis being on those aspects particular to ferroelectrics in thin film form. We introduce the current state of development in the application of ferroelectric thin films for electronic devices and discuss the physics relevant for the performance and failure of these devices. Following this we cover the enormous progress that has been made in the first principles computational approach to understanding ferroelectrics. We then discuss in detail the important role that strain plays in determining the properties of epitaxial thin ferroelectric films. Finally, we look at the emerging possibilities for nanoscale ferroelectrics, with particular emphasis on ferroelectrics in non conventional nanoscale geometries.Comment: This is an invited review for Reviews of Modern Physics. We welcome feedback and will endeavour to incorporate comments received promptly into the final versio

Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu