Numerical simulation and analytical modelling of self-heating in FDSOI MOSFETs down to very deep cryogenic temperatures

Self-heating (SHE) TCAD numerical simulations have been performed, for the first time, on 30nm FDSOI MOS transistors at extremely low temperatures. The self-heating temperature rise dTmax and the thermal resistance Rth are computed as functions of the ambient temperature Ta and the dissipated electrical power (Pd), considering calibrated silicon and oxide thermal conductivities. The characteristics of the SHE temperature rise dTmax(Pd) display sub-linear behavior at sufficiently high levels of dissipated power, in line with standard FDSOI SHE experimental data. It has been observed that the SHE temperature rise dTmax can significantly exceed the ambient temperature more easily at very low temperatures. Furthermore, a detailed thermal analysis of the primary heat flows in the FDSOI device has been conducted, leading to the development of an analytical SHE model calibrated against TCAD simulation data. This SHE analytical model accurately describes the dTmax(Pd) and Rth(Ta) characteristics of an FDSOI MOS device operating at extreme low ambient temperatures. These TCAD simulations and analytical models hold great promise for predicting the SHE and electro-thermal performance of FDSOI MOS transistors against ambient temperature and dissipated power

FINITE ELEMENT AND IMAGING APPROACHES TO ANALYZE MULTISCALE ELECTROTHERMAL PHENOMENA

Electrothermal effects are crucial in the design and optimization of electronic devices. Thermoreflectance (TR) imaging enables transient thermal characterization at submicron to centimeter scales. Typically, finite element methods (FEM) are used to calculate the temperature profile in devices and ICs with complex geometry. By comparing theory and experiment, important material parameters and device characteristics are extracted. In this work we combine TR and FEM with image blurring/reconstruction techniques to improve electrothermal characterization of micron and nanoscale devices

The 2017 Terahertz Science and Technology Roadmap

Science and technologies based on terahertz frequency electromagnetic radiation (100GHz-30THz) have developed rapidly over the last 30 years. For most of the 20th century, terahertz radiation, then referred to as sub-millimeter wave or far-infrared radiation, was mainly utilized by astronomers and some spectroscopists. Following the development of laser based terahertz time-domain spectroscopy in the 1980s and 1990s the field of THz science and technology expanded rapidly, to the extent that it now touches many areas from fundamental science to “real world” applications. For example THz radiation is being used to optimize materials for new solar cells, and may also be a key technology for the next generation of airport security scanners. While the field was emerging it was possible to keep track of all new developments, however now the field has grown so much that it is increasingly difficult to follow the diverse range of new discoveries and applications that are appearing. At this point in time, when the field of THz science and technology is moving from an emerging to a more established and interdisciplinary field, it is apt to present a roadmap to help identify the breadth and future directions of the field. The aim of this roadmap is to present a snapshot of the present state of THz science and technology in 2016, and provide an opinion on the challenges and opportunities that the future holds. To be able to achieve this aim, we have invited a group of international experts to write 17 sections that cover most of the key areas of THz Science and Technology. We hope that The 2016 Roadmap on THz Science and Technology will prove to be a useful resource by providing a wide ranging introduction to the capabilities of THz radiation for those outside or just entering the field as well as providing perspective and breadth for those who are well established. We also feel that this review should serve as a useful guide for government and funding agencies

Improved parametric analysis of cylindrical surrounding double-gate (CSDG) MOSFET.

Masters Degree. University of KwaZulu-Natal, Durban.Transistors are major components in designing and fabricating high-speed switching devices and micro-electronics. The Metal Oxide Semiconductor Field Effect Transistor (MOSFET) is popular and highly efficient for designing switches. It has wide applications in microelectronics, nanotechnology and Very Large-Scale Integration (VLSI) design where millions of MOSFETs are fabricated and embedded into a single chip. In these applications, heat becomes a major concern and requires to be addressed. The Cylindrical Surrounding Double-Gate (CSDG) MOSFET was introduced to overcome this challenge. The device has two scaled channel paths in a cylindrical two-gate structure, which have excellent control on the electrostatic activities that take place along the channel. This help to reduce corner effect and short channel effect and in turn produce higher drain current. This research work explores these advantages to propose a novel structure for an improved CSDG MOSFET. Firstly, the physical dimensions and structural layout of the improved CDSG MOSFET are highlighted and explained. After that, a parametric analysis of the CDSG MOSFET design has been done. This includes and supported with mathematical analysis and derivation of its operational parameters, namely surface potential, drain current, threshold voltage, transconductance, carrier mobility and capacitive characteristics etc. Thirdly, the thermal effects of this proposed device is analysed at different temperature. Also, the performance of the CDSG MOSFET is analyzed and compared to other existing MOSFET structures. The results from this analysis show that the improved CDSG MOSFET outperforms other existing MOSFETs. In fact, its power consumption is shown to be lower than those of other compared MOSFETs. A practical application of this device as an amplifier also yields plausible performance in terms of amplification gain and efficiency over a wide range of temperatures

Hall probes: physics and application to magnetometry

This lecture aims to present an overview of the properties of Hall effect devices. Descriptions of the Hall phenomenon, a review of the Hall effect device characteristics and of the various types of probes are presented. Particular attention is paid to the recent development of three-axis sensors and the related techniques to cancel the offsets and the planar Hall effect. The lecture introduces the delicate problem of the calibration of a three-dimensional sensor and ends with a section devoted to magnetic measurements in conventional beam line magnets and undulators.Comment: 40 pages, presented at the CERN Accelerator School CAS 2009: Specialised Course on Magnets, Bruges, 16-25 June 200

Nanoscale thermal transport. II. 2003–2012

A diverse spectrum of technology drivers such as improved thermal barriers, higher efficiency thermoelectric energy conversion, phase-change memory, heat-assisted magnetic recording, thermal management of nanoscale electronics, and nanoparticles for thermal medical therapies are motivating studies of the applied physics of thermal transport at the nanoscale. This review emphasizes developments in experiment, theory, and computation in the past ten years and summarizes the present status of the field. Interfaces become increasingly important on small length scales. Research during the past decade has extended studies of interfaces between simple metals and inorganic crystals to interfaces with molecular materials and liquids with systematic control of interface chemistry and physics. At separations on the order of ~1 nm , the science of radiative transport through nanoscale gaps overlaps with thermal conduction by the coupling of electronic and vibrational excitations across weakly bonded or rough interfaces between materials. Major advances in the physics of phonons include first principles calculation of the phonon lifetimes of simple crystals and application of the predicted scattering rates in parameter-free calculations of the thermal conductivity. Progress in the control of thermal transport at the nanoscale is critical to continued advances in the density of information that can be stored in phase change memory devices and new generations of magnetic storage that will use highly localized heat sources to reduce the coercivity of magnetic media. Ultralow thermal conductivity—thermal conductivity below the conventionally predicted minimum thermal conductivity—has been observed in nanolaminates and disordered crystals with strong anisotropy. Advances in metrology by time-domain thermoreflectance have made measurements of the thermal conductivity of a thin layer with micron-scale spatial resolution relatively routine. Scanning thermal microscopy and thermal analysis using proximal probes has achieved spatial resolution of 10 nm, temperature precision of 50 mK, sensitivity to heat flows of 10 pW, and the capability for thermal analysis of sub-femtogram samples.United States. Air Force Office of Scientific Research. Multidisciplinary University Research Initiative (FA9550-08-1-0407

Physical Aspects of VLSI Design with a Focus on Three-Dimensional Integrated Circuit Applications

This work is on three-dimensional integration (3DI), and physical problems and aspects of VLSI design. Miniaturization and highly complex integrated systems in microelectronics have led to the 3DI development as a promising technological approach. 3DI offers numerous advantages: Size, power consumption, hybrid integration etc., with more thermal problems and physical complexity as trade-offs. We open this work by presenting the design and testing of an example 3DI system, to our knowledge the first self-powering system in a three-dimensional SOI technology. The system uses ambient optical energy harvested by a photodiode array and stored in an integrated capacitor. An on-chip metal interconnect network, beyond its designed role, behaves as a parasitic load vulnerable to electromagnetic coupling. We have developed a spatially-dependent, transient Green's Function based method of calculating the response of an interconnect network to noise. This efficient method can model network delays and noise sensitivity, which are involved problems in both planar and especially in 3DICs. Three-dimensional systems are more susceptible to thermal problems, which also affect VLSI with high power densities, of complex systems and under extreme temperatures. We analytically and experimentally investigate thermal effects in ICs. We study the effects of non-uniform, non-isotropic thermal conductivity of the typically complex IC material system, with a simulator we developed including this complexity. Through our simulations, verified by experiments, we propose a method of cooling or directionally heating IC regions. 3DICs are suited for developing wireless sensor networks, commonly referred to as ``smart dust.'' The ideal smart dust node includes RF communication circuits with on-chip passive components. We present an experimental study of on-chip inductors and transformers as integrated passives. We also demonstrate the performance improvement in 3DI with its lower capacitive loads. 3DI technology is just one example of the intense development in today's electronics, which maintains the need for educational methods to assist student recruitment into technology, to prepare students for a demanding technological landscape, and to raise societal awareness of technology. We conclude this work by presenting three electrical engineering curricula we designed and implemented, targeting these needs among others

Photodetectors

In this book some recent advances in development of photodetectors and photodetection systems for specific applications are included. In the first section of the book nine different types of photodetectors and their characteristics are presented. Next, some theoretical aspects and simulations are discussed. The last eight chapters are devoted to the development of photodetection systems for imaging, particle size analysis, transfers of time, measurement of vibrations, magnetic field, polarization of light, and particle energy. The book is addressed to students, engineers, and researchers working in the field of photonics and advanced technologies