Advanced modeling of nanoscale devices for analog applications

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Finite Element Method Modeling Of Advanced Electronic Devices

In this dissertation, we use finite element method together with other numerical techniques to study advanced electron devices. We study the radiation properties in electron waveguide structure with multi-step discontinuities and soft wall lateral confinement. Radiation mechanism and conditions are examined by numerical simulation of dispersion relations and transport properties. The study of geometry variations shows its significant impact on the radiation intensity and direction. In particular, the periodic corrugation structure exhibits strong directional radiation. This interesting feature may be useful to design a nano-scale transmitter, a communication device for future nano-scale system. Non-quasi-static effects in AC characteristics of carbon nanotube field-effect transistors are examined by solving a full time-dependent, open-boundary Schrödinger equation. The non-quasi-static characteristics, such as the finite channel charging time, and the dependence of small signal transconductance and gate capacitance on the frequency, are explored. The validity of the widely used quasi-static approximation is examined. The results show that the quasi-static approximation overestimates the transconductance and gate capacitance at high frequencies, but gives a more accurate value for the intrinsic cut-off frequency over a wide range of bias conditions. The influence of metal interconnect resistance on the performance of vertical and lateral power MOSFETs is studied. Vertical MOSFETs in a D2PAK and DirectFET package, and lateral MOSFETs in power IC and flip chip are investigated as the case studies. The impact of various layout patterns and material properties on RDS(on) will provide useful guidelines for practical vertical and lateral power MOSFETs design

Nonlinear mechanisms in passive microwave devices

Premi extraordinari doctorat curs 2010-2011, àmbit d’Enginyeria de les TICThe telecommunications industry follows a tendency towards smaller devices, higher power and higher frequency, which imply an increase on the complexity of the electronics involved. Moreover, there is a need for extended capabilities like frequency tunable devices, ultra-low losses or high power handling, which make use of advanced materials for these purposes. In addition, increasingly demanding communication standards and regulations push the limits of the acceptable performance degrading indicators. This is the case of nonlinearities, whose effects, like increased Adjacent Channel Power Ratio (ACPR), harmonics, or intermodulation distortion among others, are being included in the performance requirements, as maximum tolerable levels. In this context, proper modeling of the devices at the design stage is of crucial importance in predicting not only the device performance but also the global system indicators and to make sure that the requirements are fulfilled. In accordance with that, this work proposes the necessary steps for circuit models implementation of different passive microwave devices, from the linear and nonlinear measurements to the simulations to validate them. Bulk acoustic wave resonators and transmission lines made of high temperature superconductors, ferroelectrics or regular metals and dielectrics are the subject of this work. Both phenomenological and physical approaches are considered and circuit models are proposed and compared with measurements. The nonlinear observables, being harmonics, intermodulation distortion, and saturation or detuning, are properly related to the material properties that originate them. The obtained models can be used in circuit simulators to predict the performance of these microwave devices under complex modulated signals, or even be used to predict their performance when integrated into more complex systems. A key step to achieve this goal is an accurate characterization of materials and devices, which is faced by making use of advanced measurement techniques. Therefore, considerations on special measurement setups are being made along this thesis.Award-winningPostprint (published version

Improving the Accuracy and Scope of Control-Oriented Vapor Compression Cycle System Models

The benefits of applying advanced control techniques to vapor compression cycle systems are well know. The main advantages are improved performance and efficiency, the achievement of which brings both economic and environmental gains. One of the most significant hurdles to the practical application of advanced control techniques is the development of a dynamic system level model that is both accurate and mathematically tractable. Previous efforts in control-oriented modeling have produced a class of heat exchanger models known as moving-boundary models. When combined with mass flow device models, these moving-boundary models provide an excellent framework for both dynamic analysis and control design. This thesis contains the results of research carried out to increase both the accuracy and scope of these system level models. The improvements to the existing vapor compression cycle models are carried out through the application of various modeling techniques, some static and some dynamic, some data-based and some physics-based. Semiempirical static modeling techniques are used to increase the accuracy of both heat exchangers and mass flow devices over a wide range of operating conditions. Dynamic modeling techniques are used both to derive new component models that are essential to the simulation of very common vapor compression cycle systems and to improve the accuracy of the existing compressor model. A new heat exchanger model that accounts for the effects of moisture in the air is presented. All of these model improvements and additions are unified to create a simple but accurate system level model with a wide range of application. Extensive model validation results are presented, providing both qualitative and quantitative evaluation of the new models and model improvements.Air Conditioning and Refrigeration Project 17

Sketch-based and parametric modeling: Association of two-externalization processes for early daylight optimization

peer reviewedThis paper focuses on sketch-based and parametric modeling as two externalization devices used in architectural design practice. The first part of this paper addresses features and ability of these externalization tools to support design activities during the early design steps. The second part proposes an association process of a sketch-based modeling tool (SketSha-Archi®) and a parametric modeling tool (Grasshopper®) to create an advanced process for daylight optimization. The process aimed to associate the hand-sketching freedom with the precise exploration functions of digital tools (parametric modeling and evaluation tools)

Assessing polymeric nanocomposites and advanced cooling techniques for thermal management of next-generation power electronics

The field of power electronics devices has seen two significant trends in recent years: rapid miniaturization of devices and the replacement of silicon-based devices with wide bandgap semiconductor materials-based devices (Silicon Carbide (SiC), Gallium Nitride (GaN)). The end result of these advancements are devices that need advanced cooling technologies to dissipate ultrahigh high and concentrated heat loads. Multiple advanced thermal management solutions such as liquid cooling, jet, and spray impingement have been proposed as potential solutions. The present dissertation quantifies the benefits of key advanced cooling techniques for thermal management of power electronics packages. An analytical modeling framework based on a thermal resistance circuit has been utilized to estimate the maximum heat flux that can be dissipated from a power electronics package, and the junction temperatures at varying levels of power dissipation. Analysis was conducted for heat sinks made of copper (k=400 W/mK) and a polymer (k=20 W/mK). The developed modeling framework takes into account heat spreading in both lateral directions while capturing the influence of material properties on the spreading angle. The model can, therefore, be considered to capture 3D effects as well. Additionally, 3D Finite Element Analysis (FEA) simulations have been carried out to compare with the findings of the analytical model. This dissertation also studies the influence of polymeric encapsulants of varying thermal conductivities on the resulting temperature distributions in the package via steady 2D coupled electro-thermal simulations. Overall, the methodology and results presented in this dissertation provide insights for selecting optimal combinations of thermal management technologies and advanced polymeric materials, based on the heat dissipation requirements of power electronics packages.Mechanical Engineerin

Recent advances in 3D printing of biomaterials.

3D Printing promises to produce complex biomedical devices according to computer design using patient-specific anatomical data. Since its initial use as pre-surgical visualization models and tooling molds, 3D Printing has slowly evolved to create one-of-a-kind devices, implants, scaffolds for tissue engineering, diagnostic platforms, and drug delivery systems. Fueled by the recent explosion in public interest and access to affordable printers, there is renewed interest to combine stem cells with custom 3D scaffolds for personalized regenerative medicine. Before 3D Printing can be used routinely for the regeneration of complex tissues (e.g. bone, cartilage, muscles, vessels, nerves in the craniomaxillofacial complex), and complex organs with intricate 3D microarchitecture (e.g. liver, lymphoid organs), several technological limitations must be addressed. In this review, the major materials and technology advances within the last five years for each of the common 3D Printing technologies (Three Dimensional Printing, Fused Deposition Modeling, Selective Laser Sintering, Stereolithography, and 3D Plotting/Direct-Write/Bioprinting) are described. Examples are highlighted to illustrate progress of each technology in tissue engineering, and key limitations are identified to motivate future research and advance this fascinating field of advanced manufacturing

Extended papers selected from ESSDERC 2015

This special issue of Solid State Electronics includes 28 papers which have been carefully selected from the best presentations given at the 45th European Solid-State Device Research Conference (ESSDERC 2015) held from September 14–18, 2015 in Graz, Austria. These papers cover a wide range of topics related to the research on solid-state devices. These topics are used also to organize the conference submissions and presentations into 7 tracks: CMOS Processes, Devices and Integration; Opto-, Power- and Microwave Devices; Modeling & Simulation; Characterization, Reliability & Yield; Advanced & Emerging Memories; MEMS, Sensors & Display Technologies; Emerging Non-CMOS Devices & Technologies