A scalable parallel finite element framework for growing geometries. Application to metal additive manufacturing

This work introduces an innovative parallel, fully-distributed finite element framework for growing geometries and its application to metal additive manufacturing. It is well-known that virtual part design and qualification in additive manufacturing requires highly-accurate multiscale and multiphysics analyses. Only high performance computing tools are able to handle such complexity in time frames compatible with time-to-market. However, efficiency, without loss of accuracy, has rarely held the centre stage in the numerical community. Here, in contrast, the framework is designed to adequately exploit the resources of high-end distributed-memory machines. It is grounded on three building blocks: (1) Hierarchical adaptive mesh refinement with octree-based meshes; (2) a parallel strategy to model the growth of the geometry; (3) state-of-the-art parallel iterative linear solvers. Computational experiments consider the heat transfer analysis at the part scale of the printing process by powder-bed technologies. After verification against a 3D benchmark, a strong-scaling analysis assesses performance and identifies major sources of parallel overhead. A third numerical example examines the efficiency and robustness of (2) in a curved 3D shape. Unprecedented parallelism and scalability were achieved in this work. Hence, this framework contributes to take on higher complexity and/or accuracy, not only of part-scale simulations of metal or polymer additive manufacturing, but also in welding, sedimentation, atherosclerosis, or any other physical problem where the physical domain of interest grows in time

Modeling and optimization of high-performance many-core systems for energy-efficient and reliable computing

Thesis (Ph.D.)--Boston UniversityMany-core systems, ranging from small-scale many-core processors to large-scale high performance computing (HPC) data centers, have become the main trend in computing system design owing to their potential to deliver higher throughput per watt. However, power densities and temperatures increase following the growth in the performance capacity, and bring major challenges in energy efficiency, cooling costs, and reliability. These challenges require a joint assessment of performance, power, and temperature tradeoffs as well as the design of runtime optimization techniques that monitor and manage the interplay among them. This thesis proposes novel modeling and runtime management techniques that evaluate and optimize the performance, energy, and reliability of many-core systems. We first address the energy and thermal challenges in 3D-stacked many-core processors. 3D processors with stacked DRAM have the potential to dramatically improve performance owing to lower memory access latency and higher bandwidth. However, the performance increase may cause 3D systems to exceed the power budgets or create thermal hot spots. In order to provide an accurate analysis and enable the design of efficient management policies, this thesis introduces a simulation framework to jointly analyze performance, power, and temperature for 3D systems. We then propose a runtime optimization policy that maximizes the system performance by characterizing the application behavior and predicting the operating points that satisfy the power and thermal constraints. Our policy reduces the energy-delay product (EDP) by up to 61.9% compared to existing strategies. Performance, cooling energy, and reliability are also critical aspects in HPC data centers. In addition to causing reliability degradation, high temperatures increase the required cooling energy. Communication cost, on the other hand, has a significant impact on system performance in HPC data centers. This thesis proposes a topology-aware technique that maximizes system reliability by selecting between workload clustering and balancing. Our policy improves the system reliability by up to 123.3% compared to existing temperature balancing approaches. We also introduce a job allocation methodology to simultaneously optimize the communication cost and the cooling energy in a data center. Our policy reduces the cooling cost by 40% compared to cooling-aware and performance-aware policies, while achieving comparable performance to performance-aware policy

Thermal aware task assignment for multicore processors using genetic algorithm

Microprocessor power and thermal density are increasing exponentially. The reliability of the processor declined, cooling costs rose, and the processor's lifespan was shortened due to an overheated processor and poor thermal management like thermally unbalanced processors. Thus, the thermal management and balancing of multi-core processors are extremely crucial. This work mostly focuses on a compact temperature model of multicore processors. In this paper, a novel task assignment is proposed using a genetic algorithm to maintain the thermal balance of the cores, by considering the energy expended by each task that the core performs. And expecting the cores’ temperature using the hotspot simulator. The algorithm assigns tasks to the processors depending on the task parameters and current cores’ temperature in such a way that none of the tasks’ deadlines are lost for the earliest deadline first (EDF) scheduling algorithm. The mathematical model was derived, and the simulation results showed that the highest temperature difference between the cores is 8 °C for approximately 14 seconds of simulation. These results validate the effectiveness of the proposed algorithm in managing the hotspot and reducing both temperature and energy consumption in multicore processors

Dynamic Thermal Management for Microprocessors

In deep submicron era, thermal hot spots and large temperature gradients significantly impact system reliability, performance, cost and leakage power. Dynamic thermal management techniques are designed to tackle the problems and control the chip temperature as well as power consumption. They refer to those techniques which enable the chip to autonomously modify the task execution and power dissipation characteristics so that lower-cost cooling solutions could be adopted while still guaranteeing safe temperature regulation. As long as the temperature is regulated, the system reliability can be improved, leakage power can be reduced and cooling system lifetime can be extended significantly. Multimedia applications are expected to form the largest portion of workload in general purpose PC and portable devices. The ever-increasing computation intensity of multimedia applications elevates the processor temperature and consequently impairs the reliability and performance of the system. In this thesis, we propose to perform dynamic thermal management using reinforcement learning algorithm for multimedia applications. The presented learning model does not need any prior knowledge of the workload information or the system thermal and power characteristics. It learns the temperature change and workload switching patterns by observing the temperature sensor and event counters on the processor, and finds the management policy that provides good performance-thermal tradeoff during the runtime. As the system complexity increases, it is more and more difficult to perform thermal management in a centralized manner because of state explosion and the overhead of monitoring the entire chip. In this thesis, we present a framework for distributed thermal management in many-core systems where balanced thermal profile can be achieved by proactive task migration among neighboring cores. The framework has a low cost agent residing in each core that observes the local workload and temperature and communicates with its nearest neighbor for task migration and exchange. By choosing only those migration requests that will result in balanced workload without generating thermal emergency, the presented framework maintains workload balance across the system and avoids unnecessary migration. Experimental results show that, our distributed management policy achieves almost the same performance as a global management policy when the tasks are initially randomly distributed. Compared with existing proactive task migration technique, our approach generates less hotspot, less migration overhead with negligible performance overhead. Temperature affects the leakage power and cooling power. In this thesis, we address the impact of task allocation on a processor\u27s leakage power and cooling fan power. Although the leakage power is determined by the average die temperature and the fan power is determined by the peak temperature, our analysis shows that the overall power can be minimized if a task allocation with minimum peak temperature is adopted together with an intelligent fan speed adjustment technique that finds the optimal tradeoff between fan power and leakage power. We further present a multi-agent distributed task migration technique that searches for the best task allocation during runtime. By choosing only those migration requests that will result chip maximum temperature reduction, the presented framework achieves large fan power savings as well as overall power reduction