Architectural Exploration and Design Methodologies of Photonic Interconnection Networks

Photonic technology is becoming an increasingly attractive solution to the problems facing today's electronic chip-scale interconnection networks. Recent progress in silicon photonics research has enabled the demonstration of all the necessary optical building blocks for creating extremely high-bandwidth density and energy-efficient links for on- and off-chip communications. From the feasibility and architecture perspective however, photonics represents a dramatic paradigm shift from traditional electronic network designs due to fundamental differences in how electronics and photonics function and behave. As a result of these differences, new modeling and analysis methods must be employed in order to properly realize a functional photonic chip-scale interconnect design. In this work, we present a methodology for characterizing and modeling fundamental photonic building blocks which can subsequently be combined to form full photonic network architectures. We also describe a set of tools which can be utilized to assess the physical-layer and system-level performance properties of a photonic network. The models and tools are integrated in a novel open-source design and simulation environment called PhoenixSim. Next, we leverage PhoenixSim for the study of chip-scale photonic networks. We examine several photonic networks through the synergistic study of both physical-layer metrics and system-level metrics. This holistic analysis method enables us to provide deeper insight into architecture scalability since it considers insertion loss, crosstalk, and power dissipation. In addition to these novel physical-layer metrics, traditional system-level metrics of bandwidth and latency are also obtained. Lastly, we propose a novel routing architecture known as wavelength-selective spatial routing. This routing architecture is analogous to electronic virtual channels since it enables the transmission of multiple logical optical channels through a single physical plane (i.e. the waveguides). The available wavelength channels are partitioned into separate groups, and each group is routed independently in the network. Each partition is spectrally multiplexed, as opposed to temporally multiplexed in the electronic case. The wavelength-selective spatial routing technique benefits network designers by provider lower contention and increased path diversity

From Lab-on-chip to Lab-in-App: Challenges towards silicon photonic biosensors product developments

This work presents and evaluates different approaches of integrated optical sensors based on photonic integrated circuit (PIC) technologies for refractive index sensing. Bottlenecks in the fabrication flow towards an applicable system are discussed that hinder a cost-effective mass-production for disposable sensor chips. As sensor device, a waveguide coupled micro-ring based approach is chosen which is manufactured in an 8” wafer level process. We will show that the co-integration with a reproducible, scalable and low-cost microfluidic interface is the main challenge which needs to be overcome for future application of silicon technology based PIC sensor chips

Hydrogenated amorphous silicon photonics

Silicon Photonics is quickly proving to be a suitable interconnect technology for meeting the future goals of on-chip bandwidth and low power requirements. However, it is not clear how silicon photonics will be integrated into CMOS chips, particularly microprocessors. The issue of integrating photonic circuits into electronic IC fabrication processes to achieve maximum flexibility and minimize complexity and cost is an important one. In order to maximize usage of chip real estate, it will be advantageous to integrate in three-dimensions. Hydrogenated-amorphous silicon (a-Si:H) is emerging as a promising material for the 3-D integration of silicon photonics for on-chip optical interconnects. In addition, a-Si:H film can be deposited using CMOS compatible low temperature plasma-enhanced chemical vapor deposition (PECVD) process at any point in the fabrication process allowing vertical stacking of optical interconnects. In this thesis we demonstrate a-Si:H as a high performance alternate platform to crystalline silicon, enabling backend integration of optical interconnects in a hybrid photonic-electronic network-on-chip architecture. High quality passive devices are fabricated on a low-loss a-Si:H platform enabling wavelength division multiplexing schemes. We demonstrate a broadband all-optical modulation scheme based on free-carrier absorption effect, which can enable compact electro-optic modulators in a-Si:H. Furthermore, we comprehensively characterize the optical nonlinearities in a-Si:H and observe that a-Si:H exhibits enhanced nonlinearities as compared to crystalline silicon. Based on the enhanced nonlinearities, we demonstrate low-power four-wave mixing in a-Si:H waveguides enabling high-speed all-optical devices in an a-Si:H platform. Finally, we demonstrate a novel data encoding scheme using thermal and all-optical tuning of silicon waveguides, increasing the spectral efficiency in an interconnect link. Looking forward, we shall also discuss some of the challenges that still need to be overcome to realize an integrated a-Si:H based photonic link

Thermal Aware Design Method for VCSEL-Based On-Chip Optical Interconnect

Optical Network-on-Chip (ONoC) is an emerging technology considered as one of the key solutions for future generation on-chip interconnects. However, silicon photonic devices in ONoC are highly sensitive to temperature variation, which leads to a lower efficiency of Vertical-Cavity Surface-Emitting Lasers (VCSELs), a resonant wavelength shift of Microring Resonators (MR), and results in a lower Signal to Noise Ratio (SNR). In this paper, we propose a methodology enabling thermal-aware design for optical interconnects relying on CMOS-compatible VCSEL. Thermal simulations allow designing ONoC interfaces with low gradient temperature and analytical models allow evaluating the SNR.Comment: IEEE International Conference on Design Automation and Test in Europe (DATE 2015), Mar 2015, Grenoble, France. 201

DSENT - A Tool Connecting Emerging Photonics with Electronics for Opto-Electronic Networks-on-Chip Modeling

With the advent of many-core chips that place substantial demand on the NoC, photonics has been investigated as a promising alternative to electrical NoCs. While numerous opto-electronic NoCs have been proposed, their evaluations tend to be based on fixed numbers for both photonic and electrical components, making it difficult to co-optimize. Through our own forays into opto-electronic NoC design, we observe that photonics and electronics are very much intertwined, reflecting a strong need for a NoC modeling tool that accurately models parameterized electronic and photonic components within a unified framework, capturing their interactions faithfully. In this paper, we present a tool, DSENT, for design space exploration of electrical and opto-electrical networks. We form a framework that constructs basic NoC building blocks from electrical and photonic technology parameters. To demonstrate potential use cases, we perform a network case study illustrating data-rate tradeoffs, a comparison with scaled electrical technology, and sensitivity to photonics parameters

LLM: Realizing Low-Latency Memory by Exploiting Embedded Silicon Photonics for Irregular Workloads

As emerging workloads exhibit irregular memory access patterns with poor data reuse and locality, they would benefit from a DRAM that achieves low latency without sacrificing bandwidth and energy efficiency. We propose LLM (Low Latency Memory), a codesign of the DRAM microarchitecture, the memory controller and the LLC/DRAM interconnect by leveraging embedded silicon photonics in 2.5D/3D integrated system on chip. LLM relies on Wavelength Division Multiplexing (WDM)-based photonic interconnects to reduce the contention throughout the memory subsystem. LLM also increases the bank-level parallelism, eliminates bus conflicts by using dedicated optical data paths, and reduces the access energy per bit with shorter global bitlines and smaller row buffers. We evaluate the design space of LLM for a variety of synthetic benchmarks and representative graph workloads on a full-system simulator (gem5). LLM exhibits low memory access latency for traffics with both regular and irregular access patterns. For irregular traffic, LLM achieves high bandwidth utilization (over 80% peak throughput compared to 20% of HBM2.0). For real workloads, LLM achieves 3 × and 1.8 × lower execution time compared to HBM2.0 and a state-of-the-art memory system with high memory level parallelism, respectively. This study also demonstrates that by reducing queuing on the data path, LLM can achieve on average 3.4 × lower memory latency variation compared to HBM2.0

Process Variation in Silicon Photonic Devices

The high index contrast of the silicon - silicon dioxide material system allows for dense integration of optical waveguide devices. Possible applications include intra-chip, inter-chip and fiber optic interconnection systems. Optical intra-chip interconnections become more desirable as the complementary metal-oxide-semiconductor (CMOS) circuit density puts ever tighter constraint on on-chip interconnection performance. Board level, rack level and rack-to-rack data center interconnections are ever more constrained by space and bandwidth to which silicon photonic modules may offer an improvement. As fiber optic systems serve smaller and smaller area systems, integrated switching systems that are enabled by silicon photonic devices involving wavelength division multiplexing (WDM) become more desirable. In this thesis, we firstly take a brief review of the development history of information technology, optical communication and silicon photonics. Secondly we examine the optical performance of an array of photonic devices which are the basic building blocks for silicon photonic circuits. Thirdly we turn the attention to the fabrication related issues. Silicon photonic circuits are prone to the thermal and fabrication induced process variations. We discover the process variation exhibits a “random walk” pattern with spatial extent at wafer scale. Fourthly we propose a simple method to extract fundamental parameters out of fabricated silicon photonic devices. Based on the systemic wafer-scale measurement results, our method combines the advantage of both numerical simulation and simple analytical modeling techniques. Lastly, we propose a variation-aware on-chip interconnect design for multi-core processors. This design adapts to on-chip thermal and process variation effects, pointing to the improvement of wafer-scale fabrication yield and interconnect network communication throughput

Experimental Designs for Observing the Hong-Ou-Mandel Manifolds Using Silicon Micro-Ring Resonators

We propose three experimental designs for observing the Hong-Ou-Mandel Manifolds using silicon micro-ring resonators. These experimental designs tackle the challenges of producing and coupling identical photon pairs to be incident on a silicon micro-ring resonator, and they describe methods of photon observation. We experimentally characterized a silicon micro-ring resonator with Mach-Zehnder Interferometer couplers. We modified the Hong-Ou-Mandel Manifold theory to include these realistic Mach-Zehnder Interferometer couplers, and computationally predict new manifold structures based on experimental power transmission spectrum comparisons. We also characterized a packaged foundry-fabricated silicon spiral photon pair source to be used as a possible identical photon pair source

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects