Modeling and Analysis of Energy Efficiency in Wireless Handset Transceiver Systems

As wireless communication devices are taking a significant part in our daily life, research steps toward making these devices even faster and smarter are accelerating rapidly. The main limiting factors are energy and power consumption. Many techniques are utilized to increase the battery’s capacity (Ampere per Hour), but that comes with a cost of raising the safety concerns. The other way to increase the battery’s life is to decrease the energy consumption of the devices. In this work, we analyze energy-efficient communications for wireless devices based on an advanced energy consumption model that takes into account a broad range of parameters. The developed model captures relationships between transmission power, transceiver distance, modulation order, channel fading, power amplifier (PA) effects, power control, multiple antennas, as well as other circuit components in the radio frequency (RF) transceiver. Based on the developed model, we are able to identify the optimal modulation order in terms of energy efficiency under different situations (e.g., different transceiver distance, different PA classes and efficiencies, different pulse shape, etc). Furthermore, we capture the impact of system level and network level parameters on the PA energy via peak to average ratio (PAR) and power control. We are also able to identify the impact of multiple antennas at the handset on the energy consumption and the transmitted bit rate for few and many antennas (conventional multiple-input-multiple-output (MIMO) and massive MIMO) at the base station. This work provides an important framework for analyzing energy-efficient communications for different wireless systems ranging from cellular networks to wireless internet of things

Minimum power design of RF front ends

This thesis describes an investigation into the design of RF front ends with minimum power dissipation. The central question is: "What are the fundamental limits for the power dissipation of telecommunication front ends, and what design procedures can be followed that approach these limits and, at the same time, result in practical circuits?" After a discussion of the state of the art in this area, the elementary operations of a front end are identified. For each of these elementary operations, the fundamental limits for the power dissipation are discussed, divided into technology imposed limits and physics imposed limits. A traditional DECT front end design is used to demonstrate the large difference between the fundamental limits and the power dissipation of existing circuits. To improve this situation, first the optimum distribution of specifications across individual subcircuits needs to be determined, such that the requirements for a specific system can be fulfilled. This is achieved through the introduction of formal transforms of the specifications of subcircuits, which correspond with transforms of the subcircuit itself. Using these transforms, the optimum distribution of gain, noise, linearity and power dissipation can be determined. As it turns out, this optimum distribution can even be represented by a simple, analytical expression. This expression predicts that the power dissipation of the DECT front end can be reduced by a factor of 2.7 through an optimum distribution of the specifications. Using these optimum specifications of the subcircuits, the boundaries for further power dissipation reduction can be determined. This is investigated at the system, circuit and technology level. These insights are used in the design of a 2.5GHz wireless local area network, implemented in an optimized technology ("Silicon on Anything"). The power dissipation of the complete receiver is 3.5mW, more than an order of magnitude below other wireless LAN receivers in recent publications. Finally, the combination of this minimum power design method with a platform based development strategy is discussed

Energy Efficient RF Transmitter Design using Enhanced Breakdown Voltage SOI-CMOS Compatible MESFETs

abstract: The high cut-off frequency of deep sub-micron CMOS technologies has enabled the integration of radio frequency (RF) transceivers with digital circuits. However, the challenging point is the integration of RF power amplifiers, mainly due to the low breakdown voltage of CMOS transistors. Silicon-on-insulator (SOI) metal semiconductor field effect transistors (MESFETs) have been introduced to remedy the limited headroom concern in CMOS technologies. The MESFETs presented in this thesis have been fabricated on different SOI-CMOS processes without making any change to the standard fabrication steps and offer 2-30 times higher breakdown voltage than the MOSFETs on the same process. This thesis explains the design steps of high efficiency and wideband RF transmitters using the proposed SOI-CMOS compatible MESFETs. This task involves DC and RF characterization of MESFET devices, along with providing a compact Spice model for simulation purposes. This thesis presents the design of several SOI-MESFET RF power amplifiers operating at 433, 900 and 1800 MHz with ~40% bandwidth. Measurement results show a peak power added efficiency (PAE) of 55% and a peak output power of 22.5 dBm. The RF-PAs were designed to operate in Class-AB mode to minimize the linearity degradation. Class-AB power amplifiers lead to poor power added efficiency, especially when fed with signals with high peak to average power ratio (PAPR) such as wideband code division multiple access (W-CDMA). Polar transmitters have been introduced to improve the efficiency of RF-PAs at backed-off powers. A MESFET based envelope tracking (ET) polar transmitter was designed and measured. A low drop-out voltage regulator (LDO) was used as the supply modulator of this polar transmitter. MESFETs are depletion mode devices; therefore, they can be configured in a source follower configuration to have better stability and higher bandwidth that MOSFET based LDOs. Measurement results show 350 MHz bandwidth while driving a 10 pF capacitive load. A novel polar transmitter is introduced in this thesis to alleviate some of the limitations associated with polar transmitters. The proposed architecture uses the backgate terminal of a partially depleted transistor on SOI process, which relaxes the bandwidth and efficiency requirements of the envelope amplifier in a polar transmitter. The measurement results of the proposed transmitter demonstrate more than three times PAE improvement at 6-dB backed-off output power, compared to the traditional RF transmitters.Dissertation/ThesisPh.D. Electrical Engineering 201

CMOS Integrated Power Amplifiers for RF Reconfigurable and Digital Transmitters

abstract: This dissertation focuses on three different efficiency enhancement methods that are applicable to handset applications. These proposed designs are based on three critical requirements for handset application: 1) Small form factor, 2) CMOS compatibility and 3) high power handling. The three presented methodologies are listed below: 1) A transformer-based power combiner architecture for out-phasing transmitters 2) A current steering DAC-based average power tracking circuit for on-chip power amplifiers (PA) 3) A CMOS-based driver stage for GaN-based switched-mode power amplifiers applicable to fully digital transmitters This thesis highlights the trends in wireless handsets, the motivates the need for fully-integrated CMOS power amplifier solutions and presents the three novel techniques for reconfigurable and digital CMOS-based PAs. Chapter 3, presents the transformer-based power combiner for out-phasing transmitters. The simulation results reveal that this technique is able to shrink the power combiner area, which is one of the largest parts of the transmitter, by about 50% and as a result, enhances the output power density by 3dB. The average power tracking technique (APT) integrated with an on-chip CMOS-based power amplifier is explained in Chapter 4. This system is able to achieve up to 32dBm saturated output power with a linear power gain of 20dB in a 45nm CMOS SOI process. The maximum efficiency improvement is about ∆η=15% compared to the same PA without APT. Measurement results show that the proposed method is able to amplify an enhanced-EDGE modulated input signal with a data rate of 70.83kb/sec and generate more than 27dBm of average output power with EVM<5%. Although small form factor, high battery lifetime, and high volume integration motivate the need for fully digital CMOS transmitters, the output power generated by this type of transmitter is not high enough to satisfy the communication standards. As a result, compound materials such as GaN or GaAs are usually being used in handset applications to increase the output power. Chapter 5 focuses on the analysis and design of two CMOS based driver architectures (cascode and house of cards) for driving a GaN power amplifier. The presented results show that the drivers are able to generate ∆Vout=5V, which is required by the compound transistor, and operate up to 2GHz. Since the CMOS driver is expected to drive an off-chip capacitive load, the interface components, such as bond wires, and decoupling and pad capacitors, play a critical role in the output transient response. Therefore, extensive analysis and simulation results have been done on the interface circuits to investigate their effects on RF transmitter performance. The presented results show that the maximum operating frequency when the driver is connected to a 4pF capacitive load is about 2GHz, which is perfectly matched with the reported values in prior literature.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201