Improving Performance and Endurance for Crossbar Resistive Memory

Resistive Memory (ReRAM) has emerged as a promising non-volatile memory technology that may replace a significant portion of DRAM in future computer systems. When adopting crossbar architecture, ReRAM cell can achieve the smallest theoretical size in fabrication, ideally for constructing dense memory with large capacity. However, crossbar cell structure suffers from severe performance and endurance degradations, which come from large voltage drops on long wires. In this dissertation, I first study the correlation between the ReRAM cell switching latency and the number of cells in low resistant state (LRS) along bitlines, and propose to dynamically speed up write operations based on bitline data patterns. By leveraging the intrinsic in-memory processing capability of ReRAM crossbars, a low overhead runtime profiler that effectively tracks the data patterns in different bitlines is proposed. To achieve further write latency reduction, data compression and row address dependent memory data layout are employed to reduce the numbers of LRS cells on bitlines. Moreover, two optimization techniques are presented to mitigate energy overhead brought by bitline data patterns tracking. Second, I propose XWL, a novel table-based wear leveling scheme for ReRAM crossbars and study the correlation between write endurance and voltage stress in ReRAM crossbars. By estimating and tracking the effective write stress to different rows at runtime, XWL chooses the ones that are stressed the most to mitigate. Additionally, two extended scenarios are further examined for the performance and endurance issues in neural network accelerators as well as 3D vertical ReRAM (3D-VRAM) arrays. For the ReRAM crossbar-based accelerators, by exploiting the wearing out mechanism of ReRAM cell, a novel comprehensive framework, ReNEW, is proposed to enhance the lifetime of the ReRAM crossbar-based accelerators, particularly for neural network training. To reduce the write latency in 3D-VRAM arrays, a collection of techniques, including an in-memory data encoding scheme, a data pattern estimator for assessing cell resistance distributions, and a write time reduction scheme that opportunistically reduces RESET latency with runtime data patterns, are devised

Device Modeling and Circuit Design of Neuromorphic Memory Structures

The downscaling of CMOS technology and the benefits gleaned thereof have made it the cornerstone of the semiconductor industry for many years. As the technology reaches its fundamental physical limits, however, CMOS is expected to run out of steam instigating the exploration of new nanoelectronic devices. Memristors have emerged as promising candidates for future computing paradigms, specifically, memory arrays and neuromorphic circuits. Towards this end, this dissertation will explore the use of two memristive devices, namely, Transition Metal Oxide (TMO) devices and Insulator Metal Transition (IMT) devices in constructing neuromorphic circuits. A compact model for TMO devices is first proposed and verified against experimental data. The proposed model, unlike most of the other models present in the literature, leverages the instantaneous resistance of the device as the state variable which facilitates parameter extraction. In addition, a model for the forming voltage of TMO devices is developed and verified against experimental data and Monte Carlo simulations. Impact of the device geometry and material characteristics of the TMO device on the forming voltage is investigated and techniques for reducing the forming voltage are proposed. The use of TMOs in syanptic arrays is then explored and a multi-driver write scheme is proposed that improves their performance. The proposed technique enhances voltage delivery across the selected cells via suppressing the effective line resistance and leakage current paths, thus, improving the performance of the crossbar array. An IMT compact model is also developed and verified against experiemntal data and electro-thermal device simulations. The proposed model describes the device as a memristive system with the temperature being the state variable, thus, capturing the temperature dependent resistive switching of the IMT device in a compact form suitable for SPICE implementation. An IMT based Integrate-And-Fire neuron is then proposed. The IMT neuron leverages the temperature dynamics of the device to deliver the functionality of the neuron. The proposed IMT neuron is more compact than its CMOS counterparts as it alleviates the need for complex CMOS circuitry. Impact of the IMT device parameters on the neuron\u27s performance is then studied and design considerations are provided

Vertical III-V Nanowires For In-Memory Computing

In recent times, deep neural networks (DNNs) have demonstrated great potential in various machine learning applications,such as image classification and object detection for autonomous driving. However, increasing the accuracy of DNNsrequires scaled, faster, and more energy-efficient hardware, which is limited by the von Neumann architecture whereseparate memory and computing units lead to a bottleneck in performance. A promising solution to address the vonNeumann bottleneck is in-memory computing, which can be achieved by integrating non-volatile memory cells such asRRAMs into dense crossbar arrays. On the hardware side, the 1-transistor-1-resistor (1T1R) configuration has been centralto numerous demonstrations of reservoir, in-memory and neuromorphic computing.In this thesis, to achieve a 1T1R cell with a minimal footprint of 4F2, a technology platform has been developed to integrate avertical nanowire GAA MOSFET as a selector device for the RRAM. Firstly, the effect of the geometry (planar to vertical) ofthe ITO/HfO2/TiN RRAM cell was studied where low energy switching (0.49 pJ) and high endurance (106) were achievedin the vertical configuration. Furthermore, InAs was incorporated as the GAA MOSFET selector channel material toleverage the beneficial transport properties of III-V materials desirable for supply voltage scaling. Finally, an approach wasdeveloped wherein InAs is used as the selector channel as well as the RRAM electrode by carefully tuning the InAs nativeoxides. This thesis also presents low-frequency noise characterization of the RRAM cell as well as the MOSFET to furtherunderstand the semiconductor/oxide interface. The vertical 1T1R cell developed in this thesis enables the implementationof Boolean logic operations using a single vertical nanowire while reducing the footprint by 51x when compared to itstraditional CMOS counterpart

An Analytical Approach for Memristive Nanoarchitectures

As conventional memory technologies are challenged by their technological physical limits, emerging technologies driven by novel materials are becoming an attractive option for future memory architectures. Among these technologies, Resistive Memories (ReRAM) created new possibilities because of their nano-features and unique $I$-$V$ characteristics. One particular problem that limits the maximum array size is interference from neighboring cells due to sneak-path currents. A possible device level solution to address this issue is to implement a memory array using complementary resistive switches (CRS). Although the storage mechanism for a CRS is fundamentally different from what has been reported for memristors (low and high resistances), a CRS is simply formed by two series bipolar memristors with opposing polarities. In this paper our intention is to introduce modeling principles that have been previously verified through measurements and extend the simulation principles based on memristors to CRS devices and hence provide an analytical approach to the design of a CRS array. The presented approach creates the necessary design methodology platform that will assist designers in implementation of CRS devices in future systems.Comment: 12 pages, 10 figures, 4 table

MemCA: all-memristor design for deterministic and probabilistic cellular automata hardware realization

© 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other worksInspired by the behavior of natural systems, Cellular Automata (CA) tackle the demanding long-distance information transfer of conventional computers by the massive parallel computation performed by a set of locally-coupled dynamical nodes. Although CA are envisioned as powerful deterministic computers, their intrinsic capabilities are expanded after the memristor’s probabilistic switching is introduced into CA cells, resulting in new hybrid deterministic and probabilistic memristor-based CA (MemCA). In the proposed MemCA hardware realization, memristor devices are incorporated in both the cell and rule modules, composing the very first all-memristor CA hardware, designed with mixed CMOS/Memristor circuits. The proposed implementation accomplishes high operating speed and reduced area requirements, exploiting also memristor as an entropy source in every CA cell. MemCA’s functioning is showcased in deterministic and probabilistic operation, which can be externally modified by the selection of programming voltage amplitude, without changing the design. Also, the proposed MemCA system includes a reconfigurable rule module implementation that allows for spatial and temporal rule inhomogeneity.Peer ReviewedPostprint (published version

Reconfigurable writing architecture for reliable RRAM operation in wide temperature ranges

Resistive switching memories [resistive RAM (RRAM)] are an attractive alternative to nonvolatile storage and nonconventional computing systems, but their behavior strongly depends on the cell features, driver circuit, and working conditions. In particular, the circuit temperature and writing voltage schemes become critical issues, determining resistive switching memories performance. These dependencies usually force a design time tradeoff among reliability, device endurance, and power consumption, thereby imposing nonflexible functioning schemes and limiting the system performance. In this paper, we present a writing architecture that ensures the correct operation no matter the working temperature and allows the dynamic load of application-oriented writing profiles. Thus, taking advantage of more efficient configurations, the system can be dynamically adapted to overcome RRAM intrinsic challenges. Several profiles are analyzed regarding power consumption, temperature-variations protection, and operation speed, showing speedups near 700x compared with other published drivers

In-memory computing with emerging memory devices: Status and outlook

Supporting data for "In-memory computing with emerging memory devices: status and outlook", submitted to APL Machine Learning