487 research outputs found

    RON-BEAM DEBUG AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS

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    A current research project at IMAG/TIM3 Laboratory aims at an integrated test system combining the use of the Scanning Electron Microscope (SEM), used in voltage contrast mode, with a new high-level approach of fault location in complex VLSI circuits, in order to reach a complete automated diagnosis process. Two research themes are induced by this project, which are: prototype validation of known circuits, on which CAD information is available, and failure analysis of unknown circuits, which are compared to reference circuits. For prototype validation, a knowledge-based approach to fault location is used. Concerning failure analysis, automatic image comparison based on pattern recog- nition techniques is performed. The purpose of the paper is to present these two methodologies, focusing on the SEM-based data acquisition process

    MISSED: an environment for mixed-signal microsystem testing and diagnosis

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    A tight link between design and test data is proposed for speeding up test-pattern generation and diagnosis during mixed-signal prototype verification. Test requirements are already incorporated at the behavioral level and specified with increased detail at lower hierarchical levels. A strict distinction between generic routines and implementation data makes reuse of software possible. A testability-analysis tool and test and DFT libraries support the designer to guarantee testability. Hierarchical backtrace procedures in combination with an expert system and fault libraries assist the designer during mixed-signal chip debuggin

    A Methodology to Emulate Single Event Upsets in Flip-Flops using FPGAs through Partial Reconfiguration and Instrumentation

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    This paper presents a methodology to emulate Single Event Upsets (SEUs) in FPGA flip-flops (FFs). Since the content of a FF is not modifiable through the FPGA configuration memory bits, a dedicated design is required for fault injection in the FFs. The method proposed in this paper is a hybrid approach that combines FPGA partial reconfiguration and extra logic added to the circuit under test, without modifying its operation. This approach has been integrated into a fault-injection platform, named NESSY (Non intrusive ErrorS injection SYstem), developed by our research group. Finally, this paper includes results on a Virtex-5 FPGA demonstrating the validity of the method on the ITC’99 benchmark set and a Feed-Forward Equalization (FFE) filter. In comparison with other approaches in the literature, this methodology reduces the resource consumption introduced to carry out the fault injection in FFs, at the cost of adding very little time overhead (1.6 �μs per fault)

    Space station data system analysis/architecture study. Task 2: Options development DR-5. Volume 1: Technology options

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    The second task in the Space Station Data System (SSDS) Analysis/Architecture Study is the development of an information base that will support the conduct of trade studies and provide sufficient data to make key design/programmatic decisions. This volume identifies the preferred options in the technology category and characterizes these options with respect to performance attributes, constraints, cost, and risk. The technology category includes advanced materials, processes, and techniques that can be used to enhance the implementation of SSDS design structures. The specific areas discussed are mass storage, including space and round on-line storage and off-line storage; man/machine interface; data processing hardware, including flight computers and advanced/fault tolerant computer architectures; and software, including data compression algorithms, on-board high level languages, and software tools. Also discussed are artificial intelligence applications and hard-wire communications

    AI/ML Algorithms and Applications in VLSI Design and Technology

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    An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

    Towards Accurate Estimation of Error Sensitivity in Computer Systems

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    Fault injection is an increasingly important method for assessing, measuringand observing the system-level impact of hardware and software faults in computer systems. This thesis presents the results of a series of experimental studies in which fault injection was used to investigate the impact of bit-flip errors on program execution. The studies were motivated by the fact that transient hardware faults in microprocessors can cause bit-flip errors that can propagate to the microprocessors instruction set architecture registers and main memory. As the rate of such hardware faults is expected to increase with technology scaling, there is a need to better understand how these errors (known as ‘soft errors’) influence program execution, especially in safety-critical systems.Using ISA-level fault injection, we investigate how five aspects, or factors, influence the error sensitivity of a program. We define error sensitivity as the conditional probability that a bit-flip error in live data in an ISA-register or main-memory word will cause a program to produce silent data corruption (SDC; i.e., an erroneous result). We also consider the estimation of a measure called SDC count, which represents the number of ISA-level bit flips that cause an SDC.The five factors addressed are (a) the inputs processed by a program, (b) the level of compiler optimization, (c) the implementation of the program in the source code, (d) the fault model (single bit flips vs double bit flips) and (e)the fault-injection technique (inject-on-write vs inject-on-read). Our results show that these factors affect the error sensitivity in many ways; some factors strongly impact the error sensitivity or SDC count whereas others show a weaker impact. For example, our experiments show that single bit flips tend to cause SDCs more than double bit flips; compiler optimization positively impacts the SDC count but not necessarily the error sensitivity; the error sensitivity varies between 20% and 50% among the programs we tested; and variations in input affect the error sensitivity significantly for most of the tested programs

    Parallel algorithms and architectures for VLSI pattern generation

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    Cross-layer Soft Error Analysis and Mitigation at Nanoscale Technologies

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    This thesis addresses the challenge of soft error modeling and mitigation in nansoscale technology nodes and pushes the state-of-the-art forward by proposing novel modeling, analyze and mitigation techniques. The proposed soft error sensitivity analysis platform accurately models both error generation and propagation starting from a technology dependent device level simulations all the way to workload dependent application level analysis
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