Land Use Planning for Solar Energy: Resource Guide

This document was created to help New York State localities develop and adopt solar friendly policies and plans. It begins by presenting the local government’s role in land use planning and regulation and introduces common characteristics of “solar friendly” communities. The resource then describes how municipalities should begin a solar energy initiative through an official policy statement that provides support for solar energy and that authorizes a task force to shepherd the process, appropriate studies, training programs for staff and board members, inter-municipal partnerships, and outside funding sources. Next, the document explains how municipalities should engage the entire community in the solar energy initiative process to ensure support for the initiative and its implementation. Finally, the resource presents local planning best practices that communities can incorporate into their comprehensive plans, subarea plans, or other plans. Throughout, this document provides helpful resources and examples that communities can use to develop effective solar energy policies and plans

A Smart Modular Wireless System for Condition Monitoring Data Acquisition

Smart sensors, big data, the cloud and distributed data processing are some of the most interning changes in the way we collect, manage and treat data in recent years. These changes have not significantly influenced the common practices in condition monitoring for shipping. In part this is due to the reduced trust in data security, data ownership issues, lack of technological integration and obscurity of direct benefit. This paper presents a method of incorporating smart sensor techniques and distributed processing in data acquisition for condition monitoring to assist decision support for maintenance actions addressing these inhibitors

Continuous maintenance and the future – Foundations and technological challenges

High value and long life products require continuous maintenance throughout their life cycle to achieve required performance with optimum through-life cost. This paper presents foundations and technologies required to offer the maintenance service. Component and system level degradation science, assessment and modelling along with life cycle ‘big data’ analytics are the two most important knowledge and skill base required for the continuous maintenance. Advanced computing and visualisation technologies will improve efficiency of the maintenance and reduce through-life cost of the product. Future of continuous maintenance within the Industry 4.0 context also identifies the role of IoT, standards and cyber security

Infrared testing of electronic components Final report, 5 Apr. 1965 - 5 Jun. 1966

Infrared radiation nondestructive test technique for electrical/electronic equipmen

Effect of overmolding process on the integrity of electronic circuits

Traditional injection molding processes have been widely used in the plastic processing industry. It is the major processing technique for converting thermoplastic polymers into complicated 3D parts with the aid of heat and pressure. Next generation of electronic circuits used in different application areas such as automotive, home appliances and medical devices will embed various electronic functionalities in plastic products. In this study, over-molding injection molding (OVM) of electronic components will be examined to insert novel performance in polymer materials. This low-cost manufacturing process offers potential benefits such as, reduction in processing time, higher freedom of design and less energy used when compared to the conventional injection molding method. This paper aims to evaluate the performance of this process and propose a series of alternative solutions to optimize the adhesion between and integration of electronics and engineering plastics. A number of methods are used to optimize the process so that the electronic circuits are not damaged during the over-molding, moreover to test the reliability of the system in order to control the continuity of connections between the electronic circuit foils and the electronic components after the OVM process. Correspondingly, we have performed specific tests for this purpose varying in some conditions: the type of injected plastic used, over-molding parameters (temperature, pressure and injection time), electronic circuit design, type of assembled electronic components, type of foils used and the effect of using underfill material below the electronic component. From these tests, first conclusions were made. We have also studied adhesion between the foil and the over-molding material. In this case, various types of engineering plastics have been tested; polypropylene (PP), 30% weight percentage glass,fiber filled polypropylene (GF-PP), Polyamide-6 (PA6) and 50% weight percentage glass fiber filled polyamide-6 (GF-PA6). It was proved that throughout the wide range of tested materials, (PA6) over-molded samples showed a better adhesion on the copper-polyimide foils than the rest. These plastics were over-molded on two types of polyimide (PP/Copper (Cu) tracks foils with and without an adhesive layer between PI and Cu. It was obviously clear that the foils with on adhesive layer between PI and Cu had more delamination in the Cu tracks than the foils without an adhesive layer. Furthermore, it was shown that the presence of an underfill material has on effect on the system as the foils that had an underfill material below their components successfully had a better connection than the folis without an underfill material. Finally, experiments were executed using the two probe method as an electrical measurement and microscope investigation as the visual inspection