Comparison of a Material Point Method and a Galerkin meshfree method for the simulation of cohesive-frictional materials

The simulation of large deformation problems, involving complex history-dependent constitutive laws, is of paramount importance in several engineering fields. Particular attention has to be paid to the choice of a suitable numerical technique such that reliable results can be obtained. In this paper, a Material Point Method (MPM) and a Galerkin Meshfree Method (GMM) are presented and verified against classical benchmarks in solid mechanics. The aim is to demonstrate the good behavior of the methods in the simulation of cohesive-frictional materials, both in static and dynamic regimes and in problems dealing with large deformations. The vast majority of MPM techniques in the literature are based on some sort of explicit time integration. The techniques proposed in the current work, on the contrary, are based on implicit approaches, which can also be easily adapted to the simulation of static cases. The two methods are presented so as to highlight the similarities to rather than the differences fromPeer ReviewedPostprint (published version

A simple and efficient BEM implementation of quasistatic linear visco-elasticity

A simple, yet efficient procedure to solve quasistatic problems of special linear visco-elastic solids at small strains with equal rheological response in all tensorial components, utilizing boundary element method (BEM), is introduced. This procedure is based on the implicit discretisation in time (the so-called Rothe method) combined with a simple "algebraic" transformation of variables, leading to a numerically stable procedure (proved explicitly by discrete energy estimates), which can be easily implemented in a BEM code to solve initial-boundary value visco-elastic problems by using the Kelvin elastostatic fundamental solution only. It is worth mentioning that no inverse Laplace transform is required here. The formulation is straightforward for both 2D and 3D problems involving unilateral frictionless contact. Although the focus is to the simplest Kelvin-Voigt rheology, a generalization to Maxwell, Boltzmann, Jeffreys, and Burgers rheologies is proposed, discussed, and implemented in the BEM code too. A few 2D and 3D initial-boundary value problems, one of them with unilateral frictionless contact, are solved numerically

Scale effects in orthotropic composite assemblies as micropolar continua: A comparison between weak-and strong-form finite element solutions

The aim of the present work was to investigate the mechanical behavior of orthotropic composites, such as masonry assemblies, subjected to localized loads described as micropolar materials. Micropolar models are known to be effective in modeling the actual behavior of microstructured solids in the presence of localized loads or geometrical discontinuities. This is due to the introduction of an additional degree of freedom (the micro-rotation) in the kinematic model, if compared to the classical continuum and the related strain and stress measures. In particular, it was shown in the literature that brick/block masonry can be satisfactorily modeled as a micropolar continuum, and here it is assumed as a reference orthotropic composite material. The in-plane elastic response of panels made of orthotropic arrangements of bricks of different sizes is analyzed herein. Numerical simulations are provided by comparing weak and strong finite element formulations. The scale effect is investigated, as well as the significant role played by the relative rotation, which is a peculiar strain measure of micropolar continua related to the non-symmetry of strain and work-conjugated stress. In particular, the anisotropic effects accounting for the micropolar moduli, related to the variation of microstructure internal sizes, are highlighted

Thermophysical Phenomena in Metal Additive Manufacturing by Selective Laser Melting: Fundamentals, Modeling, Simulation and Experimentation

Among the many additive manufacturing (AM) processes for metallic materials, selective laser melting (SLM) is arguably the most versatile in terms of its potential to realize complex geometries along with tailored microstructure. However, the complexity of the SLM process, and the need for predictive relation of powder and process parameters to the part properties, demands further development of computational and experimental methods. This review addresses the fundamental physical phenomena of SLM, with a special emphasis on the associated thermal behavior. Simulation and experimental methods are discussed according to three primary categories. First, macroscopic approaches aim to answer questions at the component level and consider for example the determination of residual stresses or dimensional distortion effects prevalent in SLM. Second, mesoscopic approaches focus on the detection of defects such as excessive surface roughness, residual porosity or inclusions that occur at the mesoscopic length scale of individual powder particles. Third, microscopic approaches investigate the metallurgical microstructure evolution resulting from the high temperature gradients and extreme heating and cooling rates induced by the SLM process. Consideration of physical phenomena on all of these three length scales is mandatory to establish the understanding needed to realize high part quality in many applications, and to fully exploit the potential of SLM and related metal AM processes

Transient electrothermal simulation of power semiconductor devices

In this paper, a new thermal model based on the Fourier series solution of heat conduction equation has been introduced in detail. 1-D and 2-D Fourier series thermal models have been programmed in MATLAB/Simulink. Compared with the traditional finite-difference thermal model and equivalent RC thermal network, the new thermal model can provide high simulation speed with high accuracy, which has been proved to be more favorable in dynamic thermal characterization on power semiconductor switches. The complete electrothermal simulation models of insulated gate bipolar transistor (IGBT) and power diodes under inductive load switching condition have been successfully implemented in MATLAB/Simulink. The experimental results on IGBT and power diodes with clamped inductive load switching tests have verified the new electrothermal simulation model. The advantage of Fourier series thermal model over widely used equivalent RC thermal network in dynamic thermal characterization has also been validated by the measured junction temperature